GB8821709D0 - Method for connecting leadless chip packages & articles - Google Patents

Method for connecting leadless chip packages & articles

Info

Publication number
GB8821709D0
GB8821709D0 GB888821709A GB8821709A GB8821709D0 GB 8821709 D0 GB8821709 D0 GB 8821709D0 GB 888821709 A GB888821709 A GB 888821709A GB 8821709 A GB8821709 A GB 8821709A GB 8821709 D0 GB8821709 D0 GB 8821709D0
Authority
GB
United Kingdom
Prior art keywords
articles
leadless chip
chip packages
pads
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB888821709A
Other versions
GB2208569A (en
GB2208569B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of GB8821709D0 publication Critical patent/GB8821709D0/en
Publication of GB2208569A publication Critical patent/GB2208569A/en
Application granted granted Critical
Publication of GB2208569B publication Critical patent/GB2208569B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Leadless chip package (10) is adhesively secured to printed wiring board (14) and is electrically connected by metallic conductor ribbon or wire (40, 42, 44...) to pads (30, 32, 34, 36) on the package (10) and pads (16, 18, 20, 22...) on the printed wiring board (14) to provide secure connection.
GB8821709A 1987-01-21 1988-09-16 Method for connecting leadless chip packages and articles Expired - Fee Related GB2208569B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US571587A 1987-01-21 1987-01-21
PCT/US1988/000146 WO1988005428A1 (en) 1987-01-21 1988-01-21 Method for connecting leadless chip packages and articles

Publications (3)

Publication Number Publication Date
GB8821709D0 true GB8821709D0 (en) 1988-11-16
GB2208569A GB2208569A (en) 1989-04-05
GB2208569B GB2208569B (en) 1991-01-30

Family

ID=21717338

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8821709A Expired - Fee Related GB2208569B (en) 1987-01-21 1988-09-16 Method for connecting leadless chip packages and articles

Country Status (6)

Country Link
JP (1) JPH0719952B2 (en)
AU (1) AU611127B2 (en)
ES (1) ES2006054A6 (en)
GB (1) GB2208569B (en)
IL (1) IL85008A0 (en)
WO (1) WO1988005428A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2634616B1 (en) * 1988-07-20 1995-08-25 Matra METHOD FOR MOUNTING ELECTRONIC MICRO-COMPONENTS ON A SUPPORT AND PRODUCT REALIZABLE BY THE METHOD
US4996629A (en) * 1988-11-14 1991-02-26 International Business Machines Corporation Circuit board with self-supporting connection between sides
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
GB2344550A (en) * 1998-12-09 2000-06-14 Ibm Pad design for electronic package
DE10018415C1 (en) * 2000-04-03 2001-09-27 Schott Glas Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path
GB2362515B (en) * 2000-04-13 2003-09-24 Zeiss Stiftung Connection of a junction to an electrical conductor track on a plate
US7090098B2 (en) 2004-05-06 2006-08-15 Johnsondiversey, Inc. Metering and dispensing closure
CN102528266B (en) * 2010-12-24 2014-03-05 中国科学院深圳先进技术研究院 Method for welding circuit lead of array element of ultrasonic array ultrasound probe

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1252883A (en) * 1967-11-10 1971-11-10
JPS53134116A (en) * 1977-04-27 1978-11-22 Toyota Motor Corp Fuel feeder for internal combustion engine
JPS5521148A (en) * 1978-07-31 1980-02-15 Nichicon Capacitor Ltd Method of impregnating electrolytic capacitor
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4423468A (en) * 1980-10-01 1983-12-27 Motorola, Inc. Dual electronic component assembly
ZA826825B (en) * 1981-10-02 1983-07-27 Int Computers Ltd Devices for mounting integrated circuit packages on a printed circuit board
DE8322946U1 (en) * 1982-09-17 1987-05-07 Control Data Corp., Minneapolis, Minn. Circuit board
JPS603141A (en) * 1983-06-20 1985-01-09 Toshiba Corp Circuit board

Also Published As

Publication number Publication date
ES2006054A6 (en) 1989-04-01
IL85008A0 (en) 1988-06-30
AU1184388A (en) 1988-08-10
WO1988005428A1 (en) 1988-07-28
JPH0719952B2 (en) 1995-03-06
JPH01501990A (en) 1989-07-06
GB2208569A (en) 1989-04-05
GB2208569B (en) 1991-01-30
AU611127B2 (en) 1991-06-06

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960121