GB8821709D0 - Method for connecting leadless chip packages & articles - Google Patents
Method for connecting leadless chip packages & articlesInfo
- Publication number
- GB8821709D0 GB8821709D0 GB888821709A GB8821709A GB8821709D0 GB 8821709 D0 GB8821709 D0 GB 8821709D0 GB 888821709 A GB888821709 A GB 888821709A GB 8821709 A GB8821709 A GB 8821709A GB 8821709 D0 GB8821709 D0 GB 8821709D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- articles
- leadless chip
- chip packages
- pads
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Die Bonding (AREA)
Abstract
Leadless chip package (10) is adhesively secured to printed wiring board (14) and is electrically connected by metallic conductor ribbon or wire (40, 42, 44...) to pads (30, 32, 34, 36) on the package (10) and pads (16, 18, 20, 22...) on the printed wiring board (14) to provide secure connection.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US571587A | 1987-01-21 | 1987-01-21 | |
PCT/US1988/000146 WO1988005428A1 (en) | 1987-01-21 | 1988-01-21 | Method for connecting leadless chip packages and articles |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8821709D0 true GB8821709D0 (en) | 1988-11-16 |
GB2208569A GB2208569A (en) | 1989-04-05 |
GB2208569B GB2208569B (en) | 1991-01-30 |
Family
ID=21717338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8821709A Expired - Fee Related GB2208569B (en) | 1987-01-21 | 1988-09-16 | Method for connecting leadless chip packages and articles |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH0719952B2 (en) |
AU (1) | AU611127B2 (en) |
ES (1) | ES2006054A6 (en) |
GB (1) | GB2208569B (en) |
IL (1) | IL85008A0 (en) |
WO (1) | WO1988005428A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2634616B1 (en) * | 1988-07-20 | 1995-08-25 | Matra | METHOD FOR MOUNTING ELECTRONIC MICRO-COMPONENTS ON A SUPPORT AND PRODUCT REALIZABLE BY THE METHOD |
US4996629A (en) * | 1988-11-14 | 1991-02-26 | International Business Machines Corporation | Circuit board with self-supporting connection between sides |
GB2283863A (en) * | 1993-11-16 | 1995-05-17 | Ibm | Direct chip attach module |
GB2344550A (en) * | 1998-12-09 | 2000-06-14 | Ibm | Pad design for electronic package |
DE10018415C1 (en) * | 2000-04-03 | 2001-09-27 | Schott Glas | Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path |
GB2362515B (en) * | 2000-04-13 | 2003-09-24 | Zeiss Stiftung | Connection of a junction to an electrical conductor track on a plate |
US7090098B2 (en) | 2004-05-06 | 2006-08-15 | Johnsondiversey, Inc. | Metering and dispensing closure |
CN102528266B (en) * | 2010-12-24 | 2014-03-05 | 中国科学院深圳先进技术研究院 | Method for welding circuit lead of array element of ultrasonic array ultrasound probe |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1252883A (en) * | 1967-11-10 | 1971-11-10 | ||
JPS53134116A (en) * | 1977-04-27 | 1978-11-22 | Toyota Motor Corp | Fuel feeder for internal combustion engine |
JPS5521148A (en) * | 1978-07-31 | 1980-02-15 | Nichicon Capacitor Ltd | Method of impregnating electrolytic capacitor |
US4225900A (en) * | 1978-10-25 | 1980-09-30 | Raytheon Company | Integrated circuit device package interconnect means |
US4320438A (en) * | 1980-05-15 | 1982-03-16 | Cts Corporation | Multi-layer ceramic package |
US4423468A (en) * | 1980-10-01 | 1983-12-27 | Motorola, Inc. | Dual electronic component assembly |
ZA826825B (en) * | 1981-10-02 | 1983-07-27 | Int Computers Ltd | Devices for mounting integrated circuit packages on a printed circuit board |
DE8322946U1 (en) * | 1982-09-17 | 1987-05-07 | Control Data Corp., Minneapolis, Minn. | Circuit board |
JPS603141A (en) * | 1983-06-20 | 1985-01-09 | Toshiba Corp | Circuit board |
-
1988
- 1988-01-01 IL IL85008A patent/IL85008A0/en not_active IP Right Cessation
- 1988-01-19 ES ES8800109A patent/ES2006054A6/en not_active Expired
- 1988-01-21 JP JP63501263A patent/JPH0719952B2/en not_active Expired - Lifetime
- 1988-01-21 AU AU11843/88A patent/AU611127B2/en not_active Ceased
- 1988-01-21 WO PCT/US1988/000146 patent/WO1988005428A1/en unknown
- 1988-09-16 GB GB8821709A patent/GB2208569B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ES2006054A6 (en) | 1989-04-01 |
IL85008A0 (en) | 1988-06-30 |
AU1184388A (en) | 1988-08-10 |
WO1988005428A1 (en) | 1988-07-28 |
JPH0719952B2 (en) | 1995-03-06 |
JPH01501990A (en) | 1989-07-06 |
GB2208569A (en) | 1989-04-05 |
GB2208569B (en) | 1991-01-30 |
AU611127B2 (en) | 1991-06-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19960121 |