JPS6451644A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6451644A
JPS6451644A JP20814187A JP20814187A JPS6451644A JP S6451644 A JPS6451644 A JP S6451644A JP 20814187 A JP20814187 A JP 20814187A JP 20814187 A JP20814187 A JP 20814187A JP S6451644 A JPS6451644 A JP S6451644A
Authority
JP
Japan
Prior art keywords
package
semiconductor device
height
stand
lower section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20814187A
Other languages
Japanese (ja)
Inventor
Shinichi Watabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP20814187A priority Critical patent/JPS6451644A/en
Publication of JPS6451644A publication Critical patent/JPS6451644A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To load other electronic parts to the lower section of a package on mounting to a printed mounting board for a semiconductor substrate, and to enable high density packaging by bringing the height of the stand-off of the semiconductor device to the thickness or more of the package. CONSTITUTION:The height 4 of stand-off is made larger than the thickness of a package 2, and space only in the height section of stand-off height 4 is formed in the lower section of the package 2 for a semiconductor device 1 on mounting to a printed board 6. Accordingly, small electronic parts 7 housed into the space can be loaded to the lower section of the package 2 for the semiconductor device 1.
JP20814187A 1987-08-24 1987-08-24 Semiconductor device Pending JPS6451644A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20814187A JPS6451644A (en) 1987-08-24 1987-08-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20814187A JPS6451644A (en) 1987-08-24 1987-08-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6451644A true JPS6451644A (en) 1989-02-27

Family

ID=16551315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20814187A Pending JPS6451644A (en) 1987-08-24 1987-08-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6451644A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0392513U (en) * 1989-12-29 1991-09-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0392513U (en) * 1989-12-29 1991-09-20

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