JPS647529A - Semiconductor device and mounting thereof - Google Patents
Semiconductor device and mounting thereofInfo
- Publication number
- JPS647529A JPS647529A JP62161882A JP16188287A JPS647529A JP S647529 A JPS647529 A JP S647529A JP 62161882 A JP62161882 A JP 62161882A JP 16188287 A JP16188287 A JP 16188287A JP S647529 A JPS647529 A JP S647529A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- lead holding
- holding frames
- parts
- film tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Abstract
PURPOSE:To prevent outer leads form deforming by a method wherein a lead holding part comprising inner lead holding frames and outer lead holding frames is formed on a film tape furthermore guide holes are formed. CONSTITUTION:Guide holes 24 are formed on the parts near four corner parts of a film tape 21. Besides, multiple leads 25 comprising copper foils etc., are formed in four directions on the film tape 21 while the parts near the ends of inner lead parts 25-1 of the leads 25 are connected to a semiconductor elements 26 contained in an opening part 22. Furthermore, the inner leads 25-1 are mutually linked and held with one another by inner lead holding frames 23-1 around the opening 22. On the other hand, the parts near the ends of outer leads 25-2 are linked and held with one another by outer lead holding frames 23-2. In such manner, the outer leads 25-2 vulnerable to deformation can be surely prevented from deforming.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62161882A JPS647529A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device and mounting thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62161882A JPS647529A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device and mounting thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS647529A true JPS647529A (en) | 1989-01-11 |
Family
ID=15743782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62161882A Pending JPS647529A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device and mounting thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS647529A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5341213A (en) * | 1992-07-21 | 1994-08-23 | Avco Corporation | Alignment of radiation receptor with lens by Fourier optics |
JPH09191025A (en) * | 1995-05-08 | 1997-07-22 | Fujitsu Ltd | Method of positioning ic retaining film and inspection method of ic chip which uses the same |
-
1987
- 1987-06-29 JP JP62161882A patent/JPS647529A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5341213A (en) * | 1992-07-21 | 1994-08-23 | Avco Corporation | Alignment of radiation receptor with lens by Fourier optics |
JPH09191025A (en) * | 1995-05-08 | 1997-07-22 | Fujitsu Ltd | Method of positioning ic retaining film and inspection method of ic chip which uses the same |
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