GB2056772B - Integrated circuit package and module - Google Patents

Integrated circuit package and module

Info

Publication number
GB2056772B
GB2056772B GB8026184A GB8026184A GB2056772B GB 2056772 B GB2056772 B GB 2056772B GB 8026184 A GB8026184 A GB 8026184A GB 8026184 A GB8026184 A GB 8026184A GB 2056772 B GB2056772 B GB 2056772B
Authority
GB
United Kingdom
Prior art keywords
module
integrated circuit
circuit package
package
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8026184A
Other versions
GB2056772A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu IT Holdings Inc
Original Assignee
Amdahl Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amdahl Corp filed Critical Amdahl Corp
Priority to GB8026184A priority Critical patent/GB2056772B/en
Publication of GB2056772A publication Critical patent/GB2056772A/en
Application granted granted Critical
Publication of GB2056772B publication Critical patent/GB2056772B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB8026184A 1980-08-12 1980-08-12 Integrated circuit package and module Expired GB2056772B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8026184A GB2056772B (en) 1980-08-12 1980-08-12 Integrated circuit package and module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8026184A GB2056772B (en) 1980-08-12 1980-08-12 Integrated circuit package and module

Publications (2)

Publication Number Publication Date
GB2056772A GB2056772A (en) 1981-03-18
GB2056772B true GB2056772B (en) 1983-09-01

Family

ID=10515386

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8026184A Expired GB2056772B (en) 1980-08-12 1980-08-12 Integrated circuit package and module

Country Status (1)

Country Link
GB (1) GB2056772B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT398254B (en) * 1982-08-10 1994-11-25 Dowty Electronic Components CHIP CARRIERS AND ARRANGEMENT OF SUCH CHIP CARRIERS

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207356A (en) * 1981-06-15 1982-12-20 Fujitsu Ltd Semiconductor device
JPS5875859A (en) * 1981-10-30 1983-05-07 Fujitsu Ltd Semiconductor device
EP0081419A3 (en) * 1981-12-03 1985-05-15 FAIRCHILD CAMERA & INSTRUMENT CORPORATION High lead count hermetic mass bond integrated circuit carrier
JPS593549U (en) * 1982-06-29 1984-01-11 富士通株式会社 semiconductor equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT398254B (en) * 1982-08-10 1994-11-25 Dowty Electronic Components CHIP CARRIERS AND ARRANGEMENT OF SUCH CHIP CARRIERS

Also Published As

Publication number Publication date
GB2056772A (en) 1981-03-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee