GB2167228B - Integrated circuit package - Google Patents

Integrated circuit package

Info

Publication number
GB2167228B
GB2167228B GB08425708A GB8425708A GB2167228B GB 2167228 B GB2167228 B GB 2167228B GB 08425708 A GB08425708 A GB 08425708A GB 8425708 A GB8425708 A GB 8425708A GB 2167228 B GB2167228 B GB 2167228B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
circuit package
package
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08425708A
Other versions
GB8425708D0 (en
GB2167228A (en
Inventor
John Malcolm Wilkinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anamartic Ltd
Original Assignee
Anamartic Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anamartic Ltd filed Critical Anamartic Ltd
Priority to GB08425708A priority Critical patent/GB2167228B/en
Publication of GB8425708D0 publication Critical patent/GB8425708D0/en
Publication of GB2167228A publication Critical patent/GB2167228A/en
Application granted granted Critical
Publication of GB2167228B publication Critical patent/GB2167228B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
GB08425708A 1984-10-11 1984-10-11 Integrated circuit package Expired GB2167228B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08425708A GB2167228B (en) 1984-10-11 1984-10-11 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08425708A GB2167228B (en) 1984-10-11 1984-10-11 Integrated circuit package

Publications (3)

Publication Number Publication Date
GB8425708D0 GB8425708D0 (en) 1984-11-14
GB2167228A GB2167228A (en) 1986-05-21
GB2167228B true GB2167228B (en) 1988-05-05

Family

ID=10568032

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08425708A Expired GB2167228B (en) 1984-10-11 1984-10-11 Integrated circuit package

Country Status (1)

Country Link
GB (1) GB2167228B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6274823B1 (en) 1993-11-16 2001-08-14 Formfactor, Inc. Interconnection substrates with resilient contact structures on both sides
US8373428B2 (en) 1993-11-16 2013-02-12 Formfactor, Inc. Probe card assembly and kit, and methods of making same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4111247C3 (en) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Circuit arrangement
DE19529237C1 (en) * 1995-08-09 1996-08-29 Semikron Elektronik Gmbh High power semiconductor circuit device
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
DE10149886A1 (en) 2001-10-10 2003-04-30 Eupec Gmbh & Co Kg The power semiconductor module
DE102007062163B4 (en) * 2007-12-21 2009-08-13 Semikron Elektronik Gmbh & Co. Kg Arrangement in pressure contact with a power semiconductor module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744218A (en) * 1954-12-21 1956-05-01 Gen Electric Sealed rectifier unit and method of making the same
DE1064636B (en) * 1958-03-21 1959-09-03 Eberle & Co Appbau Ges Process for producing the electrical connections to the electrodes of semiconductor elements of semiconductor arrangements
US2963632A (en) * 1958-09-10 1960-12-06 Gen Electric Cantilever semiconductor mounting
DE1930545A1 (en) * 1968-06-25 1970-01-02 Texas Instruments Inc Semiconductor device, in particular a package structure for a semiconductor device
CH534428A (en) * 1970-11-20 1973-02-28 Siemens Ag Arrangement with semiconductor components and a carrier
NL7704773A (en) * 1977-05-02 1978-11-06 Philips Nv HYBRID CIRCUIT EQUIPPED WITH SEMICONDUCTOR CIRCUIT.
GB2072894B (en) * 1977-06-20 1982-08-25 Hitachi Ltd Electronic device eg an electronic watch
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
US4390598A (en) * 1982-04-05 1983-06-28 Fairchild Camera & Instrument Corp. Lead format for tape automated bonding

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US6274823B1 (en) 1993-11-16 2001-08-14 Formfactor, Inc. Interconnection substrates with resilient contact structures on both sides
US8373428B2 (en) 1993-11-16 2013-02-12 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates

Also Published As

Publication number Publication date
GB8425708D0 (en) 1984-11-14
GB2167228A (en) 1986-05-21

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19921011