JPS6469091A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS6469091A JPS6469091A JP22681987A JP22681987A JPS6469091A JP S6469091 A JPS6469091 A JP S6469091A JP 22681987 A JP22681987 A JP 22681987A JP 22681987 A JP22681987 A JP 22681987A JP S6469091 A JPS6469091 A JP S6469091A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- adhesive agent
- electrode
- recessed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To ensure electric connection of soldering between an electrode part of chip parts and the wiring pattern of a printed board, by arranging a recessed part on the periperal parts of an adhesive agent spreading position on the printed board. CONSTITUTION:A printed circuit board 1 has a structure wherein a recessed part 7 is arranged on the peripheral part of an adhesive agent spreading posi tion. As a result, even if the adhesive agent of an amount more than the neces sary amount is spread at the time of bonding chip part 3, the superfluous adhe sive agent 8 is buried in the recessed part 7, and does not reach an electrode part 5 of the chip parts 3, thereby, enabling sure soldering connection between the electrode 5 of the chip parts 3 and the wiring pattern 6 on the printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22681987A JPS6469091A (en) | 1987-09-10 | 1987-09-10 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22681987A JPS6469091A (en) | 1987-09-10 | 1987-09-10 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6469091A true JPS6469091A (en) | 1989-03-15 |
Family
ID=16851092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22681987A Pending JPS6469091A (en) | 1987-09-10 | 1987-09-10 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6469091A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05191026A (en) * | 1992-01-13 | 1993-07-30 | Sanyo Electric Co Ltd | Flat package ic solder-dipped type printed wiring board |
US5564182A (en) * | 1994-04-21 | 1996-10-15 | Nassimi; Shary | Method for installing axial multiple |
US5668702A (en) * | 1994-04-21 | 1997-09-16 | Nassimi; Shary | Combination axial and surface mount cylindrical package containing one or more electronic components |
-
1987
- 1987-09-10 JP JP22681987A patent/JPS6469091A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05191026A (en) * | 1992-01-13 | 1993-07-30 | Sanyo Electric Co Ltd | Flat package ic solder-dipped type printed wiring board |
US5564182A (en) * | 1994-04-21 | 1996-10-15 | Nassimi; Shary | Method for installing axial multiple |
US5668702A (en) * | 1994-04-21 | 1997-09-16 | Nassimi; Shary | Combination axial and surface mount cylindrical package containing one or more electronic components |
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