JPS6469091A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
JPS6469091A
JPS6469091A JP22681987A JP22681987A JPS6469091A JP S6469091 A JPS6469091 A JP S6469091A JP 22681987 A JP22681987 A JP 22681987A JP 22681987 A JP22681987 A JP 22681987A JP S6469091 A JPS6469091 A JP S6469091A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
adhesive agent
electrode
recessed part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22681987A
Other languages
Japanese (ja)
Inventor
Yuki Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP22681987A priority Critical patent/JPS6469091A/en
Publication of JPS6469091A publication Critical patent/JPS6469091A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To ensure electric connection of soldering between an electrode part of chip parts and the wiring pattern of a printed board, by arranging a recessed part on the periperal parts of an adhesive agent spreading position on the printed board. CONSTITUTION:A printed circuit board 1 has a structure wherein a recessed part 7 is arranged on the peripheral part of an adhesive agent spreading posi tion. As a result, even if the adhesive agent of an amount more than the neces sary amount is spread at the time of bonding chip part 3, the superfluous adhe sive agent 8 is buried in the recessed part 7, and does not reach an electrode part 5 of the chip parts 3, thereby, enabling sure soldering connection between the electrode 5 of the chip parts 3 and the wiring pattern 6 on the printed circuit board.
JP22681987A 1987-09-10 1987-09-10 Printed circuit board Pending JPS6469091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22681987A JPS6469091A (en) 1987-09-10 1987-09-10 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22681987A JPS6469091A (en) 1987-09-10 1987-09-10 Printed circuit board

Publications (1)

Publication Number Publication Date
JPS6469091A true JPS6469091A (en) 1989-03-15

Family

ID=16851092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22681987A Pending JPS6469091A (en) 1987-09-10 1987-09-10 Printed circuit board

Country Status (1)

Country Link
JP (1) JPS6469091A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191026A (en) * 1992-01-13 1993-07-30 Sanyo Electric Co Ltd Flat package ic solder-dipped type printed wiring board
US5564182A (en) * 1994-04-21 1996-10-15 Nassimi; Shary Method for installing axial multiple
US5668702A (en) * 1994-04-21 1997-09-16 Nassimi; Shary Combination axial and surface mount cylindrical package containing one or more electronic components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191026A (en) * 1992-01-13 1993-07-30 Sanyo Electric Co Ltd Flat package ic solder-dipped type printed wiring board
US5564182A (en) * 1994-04-21 1996-10-15 Nassimi; Shary Method for installing axial multiple
US5668702A (en) * 1994-04-21 1997-09-16 Nassimi; Shary Combination axial and surface mount cylindrical package containing one or more electronic components

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