JPS6216876A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS6216876A
JPS6216876A JP15784785A JP15784785A JPS6216876A JP S6216876 A JPS6216876 A JP S6216876A JP 15784785 A JP15784785 A JP 15784785A JP 15784785 A JP15784785 A JP 15784785A JP S6216876 A JPS6216876 A JP S6216876A
Authority
JP
Japan
Prior art keywords
solder
vapor phase
soldering
inert
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15784785A
Other languages
Japanese (ja)
Inventor
Teruo Okano
輝男 岡野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP15784785A priority Critical patent/JPS6216876A/en
Publication of JPS6216876A publication Critical patent/JPS6216876A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent the oxidation of a solder on the melted solder face and in the atmosphere on the tank by forming an inert vapor phase by the evaporation of an inert liquid material on a solder tank and by performing a jet type and vapor phase type soldering in the vapor phase thereof. CONSTITUTION:An inert liquid material 24 is fed on the melted solder face 23 from a pipe 22 by providing upper part cover 21 at the upper side of a solder tank 11 and by inserting as well a liquid feeding pipe 22. The consolidation print board P with a surface package type component on board is transferred into the solder tank 11 via a conveyor 17. The liquid material 24 is evaporated with the heat of the solder surface 23 and an inert vapor phase 25 is formed on the solder tank 11. In this case, the oxidation of the solder is prevented by coating the solder surface 23 with the liquid material 24 and the oxidation of the solder in the atmosphere can be prevented as well because of the soldering of jet type and vapor phase type being performed in the vapor phase 25.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、噴流式および気相式のはんだ付け方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to jet and vapor phase soldering methods.

〔従来の技術〕[Conventional technology]

従来、噴流式はんだ付け方法は、はんだ槽の内部に設け
たノズルから溶融はんだを噴流させ、その噴流はんだに
被はんだ付け吻を接触させて、この被はんだ付け物に対
しはんだ付けを行うようにしている。Conventionally, in the jet soldering method, molten solder is jetted from a nozzle installed inside a solder bath, and the object to be soldered is brought into contact with the jet of solder to solder the object. ing.

そして、前記はんだ槽内の溶融はんだ面に酸化防止剤を
供給し、この酸化防止剤により、はんだ槽内の溶融はん
だの酸化を防止するようにしている。Then, an antioxidant is supplied to the surface of the molten solder in the solder bath, and the oxidation of the molten solder in the solder bath is prevented by this antioxidant.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

前記酸化防止剤は、前記はんだ槽内の溶融はんだ面にお
ける酸化を抑制することはでさるものの、前記ノズルか
ら噴流する溶融はんだの酸化を防止することはできない
。Although the antioxidant can suppress oxidation on the surface of the molten solder in the solder bath, it cannot prevent the oxidation of the molten solder jetted from the nozzle.

さらに、前記波はんだ付け物が、プリント配線基板上に
リード挿入型部品だけでなく面実装型部品を搭載してな
る混載基板の場合は、従来の噴流式はんだ付け方法のみ
では、前記面実装型部品のはんだ付けに対応できない。Furthermore, if the wave soldering object is a mixed board in which not only lead insertion type components but also surface mount type components are mounted on a printed wiring board, the surface mount type components cannot be soldered using only the conventional jet soldering method. Cannot handle soldering of parts.

本発明の目的は、はｌυだ槽内の溶融はんだ面の酸化を
防止できるとともに、前記はんだ槽上の雰囲気中でもは
んだの酸化を防止でき、さらに前記被はんだ付け物がリ
ード挿入型部品と面実装型部品とを搭載してなる混載基
板のようなものであっても、それに対応できるはんだ付
け方法を提供することにある。It is an object of the present invention to prevent oxidation of the molten solder surface in the solder bath, to prevent the solder from oxidizing even in the atmosphere above the solder bath, and furthermore, it is possible to prevent the solder from oxidizing in the atmosphere above the solder bath. It is an object of the present invention to provide a soldering method that can be applied even to a mixed board mounted with molded parts.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、はんだ槽１１の内部に設けたノズル１２から
は／υだ槽１１内の溶融はんだを噴流し、その噴流はん
だ１６に被はんだ付け物１８を接触させてはんだ付けを
行うはんだ付け方法において、前記はんだＭ１１１内の
溶融はんだ面２３に気相式はんだ付ｔＪ用熱媒体となる
不活性液剤２４を供給し、この不活性液剤２４を前記溶
融はんだ而２３の熱により蒸発させることにより、前記
はんだＩ！１１上に不活性蒸気相２５を形成し、この不
活性蒸気相２５中で噴流式はんだ付けおよび気相式はん
だ付けを行うものである。The present invention provides a soldering method in which the molten solder in the solder tank 11 is jetted from a nozzle 12 provided inside the solder tank 11, and the object to be soldered 18 is brought into contact with the jetted solder 16 to carry out soldering. In this step, an inert liquid 24 serving as a heat medium for vapor phase soldering tJ is supplied to the molten solder surface 23 in the solder M111, and this inert liquid 24 is evaporated by the heat of the molten solder 23. Said solder I! An inert vapor phase 25 is formed on the soldering device 11, and jet soldering and vapor phase soldering are performed in this inert vapor phase 25.

〔作用〕[Effect]

本発明は、前記はんだ槽１１内の溶融はんだ面２３上に
供給された前記不活性液剤２４が、その溶融はんだ面２
３を覆うことにより、このはんだ槽１１内の溶融はんだ
面２３での酸化が防止されるとともに、前記不活性液剤
２４が前記溶融はんだ面２３から気化熱を得て蒸発し、
はんだ槽１１上に不活性蒸気相２５を形成するので、こ
の不活性蒸気相２５中で噴流式はんだ付けがなされ、雰
囲気中でのはんだの酸化も防止される。In the present invention, the inert liquid 24 supplied onto the molten solder surface 23 in the solder bath 11 is applied to the molten solder surface 23.
3 prevents oxidation on the molten solder surface 23 in the solder bath 11, and the inert liquid 24 obtains vaporization heat from the molten solder surface 23 and evaporates.
Since an inert vapor phase 25 is formed on the solder bath 11, jet soldering is performed in this inert vapor phase 25, and oxidation of the solder in the atmosphere is also prevented.

同時に、前記蒸気相２５が、被はんだ付け物１８に凝結
する際に自己が保有づる気化潜熱を放出して。At the same time, when the vapor phase 25 condenses on the soldering object 18, it releases its own latent heat of vaporization.

被はｌυだ付け物としての表面実装基板のペーストはん
だ等をリフロー（溶Ｍ）１．、、、気相式はんだ付けを
行う。Reflow (molten M) 1. ,,, Perform vapor phase soldering.

〔実施例〕〔Example〕

以下、本発明を図面に示す一実施例を参照して詳細に説
明する。Hereinafter, the present invention will be described in detail with reference to an embodiment shown in the drawings.

１０は蒸気槽であり、この蒸気槽１０の内部に噴流式は
んだ槽１１を設ける。このはｌυだ槽１１の内部にノズ
ル１２を設け、さらに前記はｌυだ槽１１の下部にはん
だ槽の一部である溶融１ｆｉ１３を設け、この溶融！！
１３の内部にヒータ１４を設け、このヒータ１４により
前記溶融槽１３内のはんだを溶融して、はぼ２５０℃に
温度制御する。前記溶融槽１３の上部の仕切板１５の一
部には図示しないポンプ羽根が設けられ、このポンプ羽
根の回転により、前記はんだ槽１１から前記溶融槽１３
に溶融はんだを吸込み、さらに前記ノズル１２に圧送し
、このノズル１２から溶融はんだを噴流させる。そして
、その噴流はんだ１６にコンベヤ１１上の被はんだ付け
物１８を接触させて、はんだ付けを行うようにする。10 is a steam tank, and a jet solder tank 11 is provided inside this steam tank 10. A nozzle 12 is provided inside the lυ solder tank 11, and a melt 1fi 13, which is a part of the solder tank, is provided at the bottom of the lυ solder tank 11. !
A heater 14 is provided inside the melting tank 13, and the heater 14 melts the solder in the melting tank 13 to control the temperature to approximately 250°C. A pump blade (not shown) is provided on a part of the partition plate 15 above the melting tank 13, and the rotation of the pump blade causes the solder tank 11 to be removed from the melting tank 13.
The molten solder is sucked in and further forced into the nozzle 12, and the molten solder is jetted from the nozzle 12. Then, the object 18 to be soldered on the conveyor 11 is brought into contact with the solder jet 16 to perform soldering.

前記被はんだ付け物１８は、プリント配線基板Ｐに面実
装型部品（スモールアウトラインパッケージＩＣ１クオ
ードフラツトパツケージＩＣ，チップ部品等）Δとリー
ド挿入型部品（デュアルインラインパッケージＩＣ等）
Ｂとが混載された表面実装基板である。前記面実装型部
品Δは、その部品本体を基板Ｐ上に接着され、かつ、そ
のリード部を基板Ｐ上に塗布したペーストはんだ上に位
置決めされている。The objects to be soldered 18 include surface mount type components (small outline package IC1 quad flat package IC, chip components, etc.) Δ and lead insertion type components (dual inline package IC, etc.) on the printed wiring board P.
This is a surface mount board on which B and B are mounted together. The surface mount type component Δ has its component body adhered onto the substrate P, and its lead portions are positioned on paste solder applied onto the substrate P.

また、前記はんだ槽１１の上側に上部カバー２１を設け
、この上部カバー２１の上側より前記はんだ槽１１の上
側に給液管２２を挿入し、この給液管２２がら前記はん
だ１１１内の溶融はんだ而２３に気相式はんだ付け用熱
媒体となる不活性液剤２４を供給する。Further, an upper cover 21 is provided above the solder tank 11, and a liquid supply pipe 22 is inserted from the upper side of the upper cover 21 to the upper side of the solder tank 11. Then, an inert liquid 24 which becomes a heat medium for vapor phase soldering is supplied to the inert liquid 23 .

そして、この不活性液剤２４を前記溶融はんだ面２３の
熱により蒸発させることにより、前記はんだ槽１１上に
不活性蒸気相２５を形成する。前記不活性液剤２４は、
フッ素系不活性化学液（商品名フロリナート）であり、
沸点２１５℃である。Then, by evaporating this inert liquid agent 24 by the heat of the molten solder surface 23, an inert vapor phase 25 is formed on the solder bath 11. The inert liquid agent 24 is
It is a fluorine-based inert chemical liquid (trade name Fluorinert),
The boiling point is 215°C.

前記上部カバー２１は、−側に前記被はんだ付【ノ物１
８の搬入口３１を設けるととらに、他側に搬出口３２を
設けてなり、さらに前記搬入口３１および搬出口３２の
内側部に、それぞれ蒸気相吸込口３３を設け、この各吸
込口３３にそれぞれダクト３４を接続し、この各ダクト
３４を１本化し、その共通ダクト３５の内部に排気ファ
ン３Ｇを設け、さらに、前記ダクト３５を図示しないコ
ンデンサ（凝縮器）を経て前記給液管２２に接続する。The upper cover 21 has the solderable material 1 on the negative side.
In addition to providing a carry-in port 31 of 8, a carry-out port 32 is provided on the other side, and a vapor phase suction port 33 is provided inside each of the carry-in port 31 and the carry-in port 32. A duct 34 is connected to each duct, each duct 34 is unified into one, and an exhaust fan 3G is provided inside the common duct 35. Furthermore, the duct 35 is connected to the liquid supply pipe 22 through a condenser (not shown). Connect to.

前記コンベヤ１７は、フッ他樹脂コーティンググラスフ
ァイバ編組ネッ］・等を無端状に配設したもので、その
ネットの一部を、前記搬入口３１に引込み、前記ノズル
１２の上側を経て前記搬出口３２から引出す。そして前
記ネット上に前記被はんだ付け物１８を載せて搬送する
。The conveyor 17 is an endless arrangement of a resin-coated glass fiber braided net, etc., and a part of the net is drawn into the carry-in port 31, passed above the nozzle 12, and then passed through the carry-out port. Pull out from 32. Then, the object to be soldered 18 is placed on the net and transported.

次に、この実施例の作用を説明する。前記給液管２２か
ら前記は／υだ槽１１内の溶融はんだ面２３上に供給さ
れた前記不活性液剤２４が、その溶融はんだ面２３を奮
うことにより、このはんだ槽１１内の溶融はんだ而２３
での酸化を防止する。また、前記不活性液剤（沸点２１
５℃）２４は前記溶融はんだ而（はぼ２５０℃）２３か
ら気化熱を得て然発し、はんだ槽１１上に不活性蒸気相
２５が形成されるので、この不活性蒸気相２５中で噴流
式はんだ付けがなされ、雰囲気中でのはんだの酸化も防
止される。Next, the operation of this embodiment will be explained. The inert liquid 24 supplied from the liquid supply pipe 22 onto the molten solder surface 23 in the solder tank 11 stirs the molten solder surface 23, thereby reducing the molten solder in the solder tank 11. 23
to prevent oxidation. In addition, the inert liquid agent (boiling point 21
5° C.) 24 spontaneously generates heat of vaporization from the molten solder (250° C.) 23, and an inert vapor phase 25 is formed on the solder bath 11. In this inert vapor phase 25, a jet stream type soldering is performed, and oxidation of the solder in the atmosphere is also prevented.

同時に、前記蒸気相２５が、被はんだ付け物１８に凝結
する際に自己が保有する気化潜熱を放出して、被はんだ
付け物としての表面実装基板の前記ペーストは／υだを
リフロー（溶融）し、気相式はんだ付けを行う。At the same time, when the vapor phase 25 condenses on the object 18 to be soldered, it releases its latent heat of vaporization, and the paste on the surface mount board as the object to be soldered is reflowed (melted). Then, perform vapor phase soldering.

そして、前記蒸気相２５は、前記排気ファン３６により
、搬入部および搬出部の吸込口３３から前記ダクト３４
に吸込まれ、ダクト３５から前記コンデンサ（凝縮器）
におくられ、このコンデンサの凝縮作用で不活性液剤に
戻り、図示しないポンプにより前記給液管２２に循環さ
れる。Then, the vapor phase 25 is transferred from the suction ports 33 of the carry-in section and the carry-out section to the duct 34 by the exhaust fan 36.
from the duct 35 to the condenser (condenser)
The liquid is returned to an inert liquid by the condensation action of the condenser, and is circulated to the liquid supply pipe 22 by a pump (not shown).

〔発明の効果〕〔Effect of the invention〕

本発明によれば、ノズルを有する噴流式はんだ槽内の溶
融はんだ面に気相式はんだ付け用熱媒体となる不活性液
剤を供給し、この不活性液剤を前記溶融はんだ面の熱に
より蒸発させることにより、前記はんだ槽上に不活性蒸
気相を形成し、この不活性蒸気相中で噴流式はんだ付け
および気相式はんだ付けを行うようにしたから、前記不
活性液剤により、はんだ槽内の溶融はんだ面の酸化を防
止できるとともに、前記不活性蒸気相により、前記はん
だ槽上の雰囲気中でのはんだの酸化を防止できる。さら
に前記被はんだ付け物がリード挿入型部品と面実装型部
品とを搭載してなる混ＩＩＡ基板のようなものであって
も、それに対応でき、リード挿入型部品を前記噴流式は
んだ付け方法により前記基板にはんだ付けできるととも
に、前記面実装型部品を前記気相式はんだ付け方法によ
り前記基板にはんだ付けできる。しかも、前記不活性液
剤をはんだ槽内の溶融はｌυだ１面の熱により蒸発させ
て、はんだ槽上に不活性蒸気相を形成するようにしたか
ら、通常の気相式はんだ付け方法に比べ装置を小形にで
きる利点がある。According to the present invention, an inert liquid agent serving as a heat medium for vapor phase soldering is supplied to a molten solder surface in a jet solder bath having a nozzle, and this inert liquid agent is evaporated by the heat of the molten solder surface. As a result, an inert vapor phase is formed above the solder bath, and jet soldering and vapor phase soldering are performed in this inert vapor phase. Oxidation of the molten solder surface can be prevented, and the inert vapor phase can also prevent oxidation of the solder in the atmosphere above the solder bath. Furthermore, even if the object to be soldered is a mixed IIA board on which lead insertion type components and surface mount type components are mounted, it can be handled, and lead insertion type components can be soldered by the jet soldering method. It is possible to solder the surface mount type component to the substrate using the vapor phase soldering method. Moreover, since the inert liquid is melted in the solder bath and evaporated by heat from one side, forming an inert vapor phase on the solder bath, it is compared to the normal vapor phase soldering method. This has the advantage that the device can be made smaller.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明のはんだ付け方法の一実施例を示す断面図で
ある。 １１・・はんだ栖、１２・・ノズル、１６・・噴流はん
だ、１８・・被はんだ付け物、２３・・溶融はんだ面、
２４・・不活性液剤、２５・・不活性蒸気相。The figure is a sectional view showing an embodiment of the soldering method of the present invention. 11...Soldering bowl, 12...Nozzle, 16...Solder jet, 18...Soldering object, 23...Melted solder surface,
24... Inert liquid agent, 25... Inert vapor phase.

Claims (1)

【特許請求の範囲】[Claims] （１）はんだ槽の内部に設けたノズルからはんだ槽内の
溶融はんだを噴流し、その噴流はんだに被はんだ付け物
を接触させてはんだ付けを行うはんだ付け方法において
、前記はんだ槽内の溶融はんだ面に気相式はんだ付け用
熱媒体となる不活性液剤を供給し、この不活性液剤を前
記溶融はんだ面の熱により蒸発させることにより、前記
はんだ槽上に不活性蒸気相を形成し、この不活性蒸気相
中で噴流式はんだ付けおよび気相式はんだ付けを行うこ
とを特徴とするはんだ付け方法。(1) In a soldering method in which the molten solder in the solder tank is jetted from a nozzle provided inside the solder tank and the object to be soldered is brought into contact with the jet of solder, the molten solder in the solder tank is soldered. An inert liquid agent is supplied to the surface as a heat medium for vapor phase soldering, and this inert liquid agent is evaporated by the heat of the molten solder surface to form an inert vapor phase on the solder bath. A soldering method characterized by jet soldering and vapor phase soldering in an inert vapor phase.
JP15784785A 1985-07-17 1985-07-17 Soldering method Pending JPS6216876A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15784785A JPS6216876A (en) 1985-07-17 1985-07-17 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15784785A JPS6216876A (en) 1985-07-17 1985-07-17 Soldering method

Publications (1)

Publication Number Publication Date
JPS6216876A true JPS6216876A (en) 1987-01-26

Family

ID=15658658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15784785A Pending JPS6216876A (en) 1985-07-17 1985-07-17 Soldering method

Country Status (1)

Country Link
JP (1) JPS6216876A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418569A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Soldering wave former
JPH06210444A (en) * 1993-01-14 1994-08-02 Kuroda Denki Kk Method for soldering by utilizing liquid environment
US5395465A (en) * 1992-06-09 1995-03-07 Oji Kenzai Kogyo Co., Ltd. Method for manufacturing laminate for honeycomb structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163075A (en) * 1983-03-07 1984-09-14 Tanaka Seisakusho:Kk Method and device for automatic incidence-stoppage of nozzle of automatic gas cutting machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163075A (en) * 1983-03-07 1984-09-14 Tanaka Seisakusho:Kk Method and device for automatic incidence-stoppage of nozzle of automatic gas cutting machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418569A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Soldering wave former
US5395465A (en) * 1992-06-09 1995-03-07 Oji Kenzai Kogyo Co., Ltd. Method for manufacturing laminate for honeycomb structure
JPH06210444A (en) * 1993-01-14 1994-08-02 Kuroda Denki Kk Method for soldering by utilizing liquid environment

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