JPS63163267U - - Google Patents
Info
- Publication number
- JPS63163267U JPS63163267U JP5683487U JP5683487U JPS63163267U JP S63163267 U JPS63163267 U JP S63163267U JP 5683487 U JP5683487 U JP 5683487U JP 5683487 U JP5683487 U JP 5683487U JP S63163267 U JPS63163267 U JP S63163267U
- Authority
- JP
- Japan
- Prior art keywords
- flux
- soldering
- board
- sprayer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に関する半田付け装置のフラツ
クス漕における部分側面図、第２図は第１図に対
応する従来例の部分側面図である。
主要部分を示す図面の符号の説明、１……フラ
ツクス槽、２……フラツクス、３……噴霧式フラ
クサー、４……基板、５……保持キヤリア、５ａ
，５ｂ……保持部、６……拡散防止治具、６ａ…
…開口部。
FIG. 1 is a partial side view of a flux tank of a soldering apparatus according to the present invention, and FIG. 2 is a partial side view of a conventional example corresponding to FIG. Explanation of symbols in drawings showing main parts: 1...Flux tank, 2...Flux, 3...Spray type fluxer, 4...Substrate, 5...Holding carrier, 5a
, 5b... Holding part, 6... Diffusion prevention jig, 6a...
…Aperture.
Claims (1)
で搬送し、噴霧器により基板の半田面側に向けて
フラツクスを噴霧塗布する半田付装置において、
前記噴霧器と基板の半田面との間に、噴霧される
フラツクスの拡散防止治具を設けたことを特徴と
する半田付装置。 In a soldering device, a board is held by a holder and transported to a flux tank, and a sprayer sprays flux onto the solder side of the board.
A soldering apparatus characterized in that a jig for preventing diffusion of sprayed flux is provided between the sprayer and the soldering surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5683487U JPS63163267U (en) | 1987-04-15 | 1987-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5683487U JPS63163267U (en) | 1987-04-15 | 1987-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63163267U true JPS63163267U (en) | 1988-10-25 |
Family
ID=30886004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5683487U Pending JPS63163267U (en) | 1987-04-15 | 1987-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63163267U (en) |
-
1987
- 1987-04-15 JP JP5683487U patent/JPS63163267U/ja active Pending
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