KR960028780A - Component Mounting Device - Google Patents
Component Mounting Device Download PDFInfo
- Publication number
- KR960028780A KR960028780A KR1019940038348A KR19940038348A KR960028780A KR 960028780 A KR960028780 A KR 960028780A KR 1019940038348 A KR1019940038348 A KR 1019940038348A KR 19940038348 A KR19940038348 A KR 19940038348A KR 960028780 A KR960028780 A KR 960028780A
- Authority
- KR
- South Korea
- Prior art keywords
- component
- circuit board
- printed circuit
- component support
- movable rail
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
본 발명은 인쇄회로기판에 전기·전자부품들을 자동으로 장착하기 위한 장치에 관한 것이다.The present invention relates to an apparatus for automatically mounting electrical and electronic components on a printed circuit board.
본 발명의 부품장착장치에 있어서는, 인쇄회로기판에 장착될 부품이 놓이는 부품지지부들 중 가동레일에 인접하게 위치하는 부품지지부가 고정레일에 대해 진퇴가능하게 설치되어 있으므로, 인쇄회로기판의 크기에 맞추어 가동레일이 이동될 때그 부품지지부도 함께 이동시킬 수 있다. 따라서, 흡착헤드가 가동레일에 인접한 부품지지부와 인쇄회로기판 사이를 왕복이동하는 거리를 단축시킬 수 있어, 부품을 장착하는데 소요되는 작업시간이 절감되는 효과가 있다.In the component mounting apparatus of the present invention, since the component support portion positioned adjacent to the movable rail among the component support portions on which the component to be mounted on the printed circuit board is placed is provided to be retractable with respect to the fixed rail, it is adapted to the size of the printed circuit board. When the movable rail is moved, the component support can also be moved. Therefore, the suction head can shorten the distance reciprocating between the component support portion adjacent to the movable rail and the printed circuit board, thereby reducing the work time required for mounting the component.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 제1도에 도시된 부품장착장치의 평면도, 제3도는 본 발명에 따른 부품장착장치의 사시도, 제4도는 제3도에 도시된 부품장착장치의 평면도2 is a plan view of the component mounting apparatus shown in FIG. 1, FIG. 3 is a perspective view of the component mounting apparatus according to the present invention, and FIG. 4 is a plan view of the component mounting apparatus shown in FIG.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940038348A KR0155794B1 (en) | 1994-12-28 | 1994-12-28 | Chip mounter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940038348A KR0155794B1 (en) | 1994-12-28 | 1994-12-28 | Chip mounter |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960028780A true KR960028780A (en) | 1996-07-22 |
KR0155794B1 KR0155794B1 (en) | 1998-12-15 |
Family
ID=19404604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940038348A KR0155794B1 (en) | 1994-12-28 | 1994-12-28 | Chip mounter |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0155794B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100613736B1 (en) * | 1998-05-25 | 2006-08-22 | 소니 가부시끼 가이샤 | Assembling device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105050334B (en) * | 2015-07-09 | 2017-10-24 | 厦门弘信电子科技股份有限公司 | The upper trigger of FPC pretreatment line |
CN105246267A (en) * | 2015-09-29 | 2016-01-13 | 芜湖宏景电子股份有限公司 | Fast movement structure for printed circuit board (PCB) bonding pad chip mounter |
-
1994
- 1994-12-28 KR KR1019940038348A patent/KR0155794B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100613736B1 (en) * | 1998-05-25 | 2006-08-22 | 소니 가부시끼 가이샤 | Assembling device |
Also Published As
Publication number | Publication date |
---|---|
KR0155794B1 (en) | 1998-12-15 |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20070628 Year of fee payment: 10 |
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LAPS | Lapse due to unpaid annual fee |