DE69018668D1 - Electro-optical inspection device for printed circuit boards with components mounted on them. - Google Patents

Electro-optical inspection device for printed circuit boards with components mounted on them.

Info

Publication number
DE69018668D1
DE69018668D1 DE69018668T DE69018668T DE69018668D1 DE 69018668 D1 DE69018668 D1 DE 69018668D1 DE 69018668 T DE69018668 T DE 69018668T DE 69018668 T DE69018668 T DE 69018668T DE 69018668 D1 DE69018668 D1 DE 69018668D1
Authority
DE
Germany
Prior art keywords
electro
printed circuit
circuit boards
inspection device
components mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69018668T
Other languages
German (de)
Other versions
DE69018668T2 (en
Inventor
Kazutoshi Ikegaya
Yuji Maruyama
Kunio Sannomiya
Yukifumi Tsuda
Hiroto Toba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1033040A external-priority patent/JPH0752158B2/en
Priority claimed from JP3304189A external-priority patent/JPH02212748A/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69018668D1 publication Critical patent/DE69018668D1/en
Application granted granted Critical
Publication of DE69018668T2 publication Critical patent/DE69018668T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69018668T 1989-02-13 1990-02-13 Electro-optical inspection device for printed circuit boards with components mounted on them. Expired - Fee Related DE69018668T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1033040A JPH0752158B2 (en) 1989-02-13 1989-02-13 Mounted board inspection device
JP3304189A JPH02212748A (en) 1989-02-13 1989-02-13 Packaged circuit board inspecting device

Publications (2)

Publication Number Publication Date
DE69018668D1 true DE69018668D1 (en) 1995-05-24
DE69018668T2 DE69018668T2 (en) 1995-09-14

Family

ID=26371675

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69018668T Expired - Fee Related DE69018668T2 (en) 1989-02-13 1990-02-13 Electro-optical inspection device for printed circuit boards with components mounted on them.

Country Status (3)

Country Link
US (1) US5027418A (en)
EP (1) EP0383532B1 (en)
DE (1) DE69018668T2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2751435B2 (en) * 1989-07-17 1998-05-18 松下電器産業株式会社 Inspection method for soldering condition of electronic components
EP0417736B1 (en) * 1989-09-12 1994-11-30 Matsushita Electric Industrial Co., Ltd. System for optically inspecting conditions of parts packaged on substrate
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
US5448650A (en) * 1992-04-30 1995-09-05 International Business Machines Corporation Thin-film latent open optical detection with template-based feature extraction
US5420689A (en) * 1993-03-01 1995-05-30 Siu; Bernard High speed illumination system for microelectronics inspection
US5424838A (en) * 1993-03-01 1995-06-13 Siu; Bernard Microelectronics inspection system
US5325276A (en) * 1992-09-10 1994-06-28 United Parcel Service Of America, Inc. Lighting apparatus for the computer imaging of a surface
US5313373A (en) * 1992-11-25 1994-05-17 United Parcel Service Of America, Inc. Apparatus for the uniform illumination of a surface
US5408084A (en) * 1993-02-18 1995-04-18 United Parcel Service Of America, Inc. Method and apparatus for illumination and imaging of a surface using 2-D LED array
US5399852A (en) * 1993-02-19 1995-03-21 United Parcel Service Of America, Inc. Method and apparatus for illumination and imaging of a surface employing cross polarization
DE69435333D1 (en) 1993-04-21 2011-03-24 Omron Tateisi Electronics Co DEVICE FOR VISUAL CHECKING OF PLATINES AND THEIR USE FOR CONTROLLING AND CORRECTING SOLUTIONS
SG80529A1 (en) * 1993-06-14 2001-05-22 Omron Tateisi Electronics Co Visual inspection supporting apparatus and printed circuit board inspecting apparatus, and methods of soldering inspection and correction using the apparatus
JPH10141929A (en) * 1996-11-12 1998-05-29 Hitachi Ltd Soldering inspection device
US6369888B1 (en) 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
JP2004287681A (en) * 2003-03-20 2004-10-14 Hitachi Ltd Wiring design support system and wiring design support method
US20060291715A1 (en) * 2005-06-24 2006-12-28 Mv Research Limited Machine vision system and method
US7529336B2 (en) 2007-05-31 2009-05-05 Test Research, Inc. System and method for laminography inspection

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4642813A (en) * 1983-04-18 1987-02-10 Object Recognition Systems, Inc. Electro-optical quality control inspection of elements on a product
DE3472300D1 (en) * 1983-04-22 1988-07-28 Sick Optik Elektronik Erwin Device for the detection of faults
JPS61290311A (en) * 1985-06-19 1986-12-20 Hitachi Ltd Apparatus and method for inspecting soldered zone
JPS61293657A (en) * 1985-06-21 1986-12-24 Matsushita Electric Works Ltd Method for inspecting soldering appearance
JPS61293659A (en) * 1985-06-24 1986-12-24 Matsushita Electric Works Ltd Method for inspecting soldering appearance
US4823394A (en) * 1986-04-24 1989-04-18 Kulicke & Soffa Industries, Inc. Pattern recognition system
US4740708A (en) * 1987-01-06 1988-04-26 International Business Machines Corporation Semiconductor wafer surface inspection apparatus and method
US4926452A (en) * 1987-10-30 1990-05-15 Four Pi Systems Corporation Automated laminography system for inspection of electronics

Also Published As

Publication number Publication date
EP0383532A3 (en) 1992-07-01
EP0383532B1 (en) 1995-04-19
EP0383532A2 (en) 1990-08-22
DE69018668T2 (en) 1995-09-14
US5027418A (en) 1991-06-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee