JPH09116259A - Carrierless automatic soldering equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain simply adjusting the position of a peel back point and the flow at the position, by adjusting positions of an introduction side guide plate and an exit side guide plate of a printed wiring board and adjusting the flow of solder jet. SOLUTION: A jet forming equipment of a carrierless automatic soldering equipment has an introduction side guide plate arranged on the introduction side of a printed wiring board, and an exit side guide plate arranged on the exit side. The guide plates 31, 32 are adjustable. The first guide plate 31 is installed rotatably around a horizontal shaft. The horizontal shaft of the first guide plate is arranged in a connection part of a vertical plate and a horizontal plate, i.e., an upper end of the vertical plate, and the horizontal shaft of the second guide plate 32 is arranged in a connection part of a vertical plate and a curved plate, i.e., an upper end of the vertical plate. The first and the second guide plates 31, 32 are constituted movably in the vertical direction. That is, the respective horizontal shafts of the first and the second guide plates 31, 32 are movable in the vertical direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrierless automatic soldering device for automatically soldering a printed wiring board, and more particularly, it is provided in a molten solder bath of a carrierless automatic soldering device. The present invention relates to improvements in a jet forming device or a former.

[0002]

2. Description of the Related Art The outline of a conventional carrierless automatic soldering apparatus will be described with reference to FIGS. 3 is an external perspective view thereof, and FIG. 4 shows a cross-sectional structure taken along line 4-4 of FIG. The carrierless automatic soldering device includes a fluxer 11, a preheater 12, a molten solder bath 13, a cooling device 14, and a conveyor 15. The conveyor 15 is shown in FIG.
As shown in FIG. 5, the printed wiring board 10 (see FIG. 7) is configured to be held by the plurality of claws 16.

The printed wiring board 10 conveyed from the previous step by the conveyor 15 is first coated with flux by the fluxer 11 and preheated by the preheater 12. Next, the printed wiring board 10 is the molten solder bath 1
3 to be soldered and cooled by the cooling device 14. The printed wiring board 10 thus soldered is conveyed to the next step by the conveyor 15.

The details of the molten solder bath 13 will be described with reference to FIG. The molten solder bath 13 has a container 21 for containing the molten solder and two jet forming devices 22 and 23 for forming jets of the molten solder. Such a jet forming device is called a former. The printed wiring board 10 (see FIG. 7) passes slightly above the liquid surface of the molten solder bath 13 by the conveyor 15. At this time, the lower surface of the printed wiring board 10 comes into contact with the jets formed by the jet forming devices 22 and 23 and the solder adheres thereto.

The primary jet forming device 22 provided on the introduction side of the printed wiring board 10 forms a comparatively rough jet and is used for soldering of chip parts, and the secondary jet forming device 23 produces a comparatively quiet jet. Used to finish forming and soldering. The quality of soldering is determined by the performance of the secondary jet forming device 23.

FIG. 6 shows an outline of the secondary jet forming device 23. The secondary jet forming device 23 includes three guide plates 31, 3 arranged in front and rear along the traveling direction of the printed wiring board 10.
2, 33 and a suitable pump or stirrer (not shown) disposed thereunder.

The configuration and operation of the secondary jet forming device 23 will be described with reference to FIG. This secondary jet forming device 23 has two
It has two guide plates 31, 32. Front side first guide plate 3
1 has a vertical plate 31A, a horizontal plate 31B, and a tip plate 31C. As shown, these are made of flat plate-like members and are connected so as to be substantially orthogonal to each other. The second guide plate 32 on the rear side has a vertical plate 32A and a curved plate 32B. The vertical plate 32A is made of a flat plate-shaped member,
2B is a curved plate member.

The printed wiring board 10 is moving in the direction of arrow A above the secondary jet forming device 23. A large number of electronic components 41 are arranged on the upper surface 10A and the lower surface 10B of the printed wiring board 10. The lead wire 42 of the electronic component 41 is exposed on the lower surface 10B of the printed wiring board 10, and solder is attached to the lead wire 42.

As shown, the printed wiring board 10 is slightly inclined with respect to the horizontal. As a result, the electronic component 41
The “break” between the solder attached to the lead wire 42 and the molten solder becomes good, and the generation of undesired flicker, bridge, etc. is avoided.

A pump or a stirrer (not shown) is arranged below the two guide plates 31 and 32 to form a jet flow. The jet flow rises between the two guide plates 31 and 32 and is discharged before and after the two guide plates 31 and 32. The top of the jet is in contact with the lower surface 10B of the printed wiring board 10.

The front end of the area where the lower surface 10B of the printed wiring board 10 is in contact with the jet, that is, the point where the lower surface 10B of the printed wiring board 10 first separates from the jet is called the peel back point (PBP). The peel back point is located at a position where the flow of the molten solder is changed to the direction of the guide plate 31 on the front side of the rising direction.

[0012]

Factors that influence the result of the soldering process include the inclination angle of the printed wiring board 10, the strength of the jet flow, the shapes and arrangements of the two guide plates 31, 32, and the like. The location of the peelback point and the flow there also influence the outcome of the soldering process.

When the size of the printed wiring board 10 and the type and number of electronic components 41 to be soldered are changed, it is necessary to change the soldering condition. For example, the positions of the two guide plates 31 and 32 of the secondary jet forming device 23 may be changed to change the position of the peel back point and the flow there.

However, conventionally, two guide plates 31,
32 was fixed and therefore unable to regulate the position of the peelback point and the flow there.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a carrierless automatic soldering apparatus capable of adjusting the position of a peel back point and the flow thereat by a simple method.

[0016]

According to the carrierless automatic soldering device of the present invention, in a carrierless automatic soldering device having a molten solder bath provided with a jet forming device, the jet forming device introduces a printed wiring board. Has a guide plate on the side of introduction and a guide plate on the side of exit that is provided on the side of exit, and the flow of the jet flow can be adjusted by adjusting the positions of the two guide plates. ing.

According to the present invention, in the carrierless automatic soldering device, the two guide plates are rotatable about a horizontal axis. Also, it can be moved in the vertical direction.

According to the present invention, in the carrierless automatic soldering device, the molten solder bath has a primary jet forming device further provided on the introduction side of the printed wiring board with respect to the secondary jet forming device. The position of the guide plate of the primary jet forming device can be adjusted.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS. 1 corresponds to FIG. 7 and shows the details of the secondary jet forming device 23 of the carrierless automatic soldering device of the present invention. According to the present example, the secondary jet forming device 23 has two guide plates 31, 32, which are adjustable.

According to this example, the first guide plate 31 is rotatably mounted around the horizontal axis 31D as shown by an arrow 101. The horizontal axis 31D of the first guide plate 31 is connected to the vertical plate 31A and the horizontal plate 31B, that is, the vertical plate 31.
A horizontal axis 34D of the second guide plate 32, which is arranged at the upper end of A
Is arranged at the connection between the vertical plate 32A and the curved plate 32B, that is, at the upper end of the vertical plate 32A.

Further, according to this example, the first and second guide plates 31 and 32 are constructed so as to be movable in the vertical direction as shown by the arrow 102. That is,
Horizontal shafts 31D, 3 of the first and second guide plates 31, 32
2D can move up and down.

In this example, the first guide plate 31 is rotatable and movable in the vertical direction, but the second guide plate 32 is movable in the vertical direction. However, the second guide plate 32 may also be configured to be rotatable around the horizontal axis 32D.

FIG. 2 shows the appearance of the molten solder bath 13 equipped with a jet forming device. This jet forming device has three guide plates 3
1, 32, and 34. These guide plates are arranged in a container 21 containing molten solder. First and second
Guide plates 31, 32 of the secondary jet forming device 23,
The third guide plate 34 constitutes the primary jet forming device 22.

The three guide plates 31, 32, 34 have a position adjusting mechanism. In this example, the first guide plate 31 is movable in the vertical direction and rotatable about the horizontal axis 31D. The second and third guide plates 32 and 34 are movable in the vertical direction.

The first guide plate 31 may be supported by a suitable bearing, with a handle 35 at the end of the horizontal shaft 31D.
Is attached. Such a handle 35 is a container 21.
It is arranged outside. Further, the horizontal shaft 31D of the first guide plate 31 is engaged with an appropriate vertical groove so that it can move in the vertical direction. Second and third guide plates 3
The two 33 horizontal shafts 32D, 33D are engaged in suitable vertical grooves for vertical movement.

According to the invention, the guide plates 31, 32, 34
May have the same configuration as the conventional carrierless automatic soldering apparatus of the present invention, except that has a position adjusting mechanism. Moreover, although the guide plates 31, 32, and 34 have been described as examples of the rotation and movement device as the position adjusting mechanism, other devices may be used.

Although the embodiments of the present invention have been described in detail, the present invention is not limited to these examples, and various modifications can be made within the scope of the invention described in the claims. It will be understood by those skilled in the art.

[0028]

According to the present invention, there is an advantage that the jet flow can be adjusted with a simple structure in the jet forming device provided in the molten solder bath of the carrierless automatic soldering device.

According to the present invention, the peel back point (PB) is formed by the simple structure in the jet forming device provided in the molten solder bath of the carrierless automatic soldering device.
It has the advantage that P) can be adjusted.

According to the present invention, the jet flow and the peel back point (PBP) can be adjusted with a simple structure in the jet forming device provided in the molten solder bath of the carrierless automatic soldering device, so that the solder can be efficiently soldered. This has the advantage that the attachment conditions can be changed.

[Brief description of the drawings]

FIG. 1 is a partial detailed view of a jet forming device (former) of a molten solder bath of a carrierless automatic soldering device according to the present invention.

FIG. 2 is a partial detailed view of the jet forming device (former) of the molten solder bath of the carrierless automatic soldering device according to the present invention.

FIG. 3 is an external view of a conventional carrierless automatic soldering device.

4 is a cross-sectional view of the carrierless automatic soldering device taken along line 4-4 of FIG.

FIG. 5 is a diagram showing an example of a conventional molten solder bath.

FIG. 6 is a diagram showing an outline of a conventional secondary jet forming device.

FIG. 7 is a diagram showing a partial detail of a conventional secondary jet forming device.

[Explanation of symbols]

 10 Printed Wiring Board 11 Fluxer 12 Preheater 13 Molten Solder Tank 14 Cooling Device 15 Conveyor 16 Claw 21 Container 22, 23 Jet Flow Forming Device 31, 32, 33, 34 Guide Plate 31D Horizontal Axis 35 Handle 41 Electronic Component 42 Lead Wire 51, 52 flow

Claims (4)

[Claims] 1. In a carrierless automatic soldering device having a molten solder bath equipped with a jet forming device, the jet forming device is provided on an introduction side guide plate provided on the introduction side of a printed wiring board and an exit side. It has an exit side guide plate,
A carrierless automatic soldering device, characterized in that the flow of the jet flow can be adjusted by adjusting the positions of the two guide plates. 2. The carrierless automatic soldering device according to claim 1, wherein the two guide plates are rotatable about a horizontal axis. 3. The carrierless automatic soldering device according to claim 1 or 2, wherein the two guide plates are vertically movable. 4. The carrierless automatic soldering device according to claim 1, wherein the molten solder bath is a primary jet forming device further provided on the introduction side of the printed wiring board with respect to the secondary jet forming device. A carrierless automatic soldering device having a guide plate of the primary jet forming device.