JP4729453B2 - Hybrid wave forming method and hybrid wave forming apparatus - Google Patents

Description

  The present invention relates to a jet wave forming method and a forming apparatus used when flow soldering is performed by bringing a soldered work such as a printed wiring board on which electronic components are mounted into contact with a jet wave of molten solder.

  Lead-free solder has come to be used for soldering and mounting printed circuit boards due to the lead-free solder that originated from environmental problems. Tin-silver-copper lead-free solder is the most common lead-free solder, but tin-copper lead-free solder and tin-copper-nickel lead-free solder are also used. The melting point of these lead-free solders is about 220 ° C. The melting point of tin-lead solder that has been conventionally used is about 183 ° C.

  The temperature of the molten solder used for solder mounting is limited by the heat resistance temperature of the electronic component, and is about 255 ° C. at the maximum. When soldering and mounting is performed at a temperature higher than this, the reliability of the electronic component is greatly reduced, and the life of the electronic circuit formed on the printed wiring board by the soldering and mounting is significantly reduced. That is, the allowable temperature range in which the conventional tin-lead solder is melted is about 72 ° C., whereas the allowable temperature range in which the lead-free solder is melted is about 35 ° C.

  By the way, in order to perform good soldering when performing flow soldering, molten solder is surely supplied to the part to be soldered of the printed wiring board to ensure sufficient wetting, and molten solder is to be added to the through hole. Is required to be surely wetted. In order to ensure sufficient wettability and through-hole wetting, it is necessary to ensure a sufficient contact time between the printed wiring board and the molten solder. Is required. This contact time is longer than that of conventional tin-lead solder when lead-free solder is used.

  In addition to sufficient solder wetting of the part to be soldered and ensuring that the solder gets wet into the through hole, the fillet shape affects the soldering strength against stress due to temperature changes and vibrations. Therefore, it is also necessary to arrange the fillet shape of the part to be soldered.

  Therefore, when chip-type electronic components and lead-type electronic components are mounted, and when performing flow soldering on printed wiring boards with through-holes, jet waves and soldered parts to ensure solder wetting A jet wave for adjusting the fillet shape is used, and the soldering process is composed of two stages (usually called the primary soldering process and the secondary soldering process) by jet waves having different properties. Yes.

  As a flow soldering technique developed after understanding the characteristics of lead-free solder as described above, there is a technique of Patent Document 1. This technology mainly includes a first jet wave (dynamic pressure jet wave) for supplying a jet with a large dynamic pressure to the soldered part, and a second jet for finishing by adjusting the fillet shape of the soldered part. The contact width of the first jet wave is set to a width where the heat capacity of the printed wiring board is charged to the solder temperature, and the first jet wave and the second jet wave This is a technique in which the interval, that is, the period during which the printed wiring board is separated from the jet wave, is set to be within the range of a temperature drop that does not solidify the molten solder supplied to the soldered portion of the printed wiring board. is there. Thereby, the first jet wave and the second jet wave having different properties can be handled as being continuous.

On the other hand, there is a technique of Patent Document 2 as a technique for trying to combine two jet waves having different properties into one continuous jet wave. In this technology, “uneven wave forming means” for forming dynamic pressure jet waves and “laminar wave forming means” for forming shaped jet waves are continuously arranged. A “turbulent flow suppressing member” of “round bar shape” or “plate structure” is provided, and the effects of “turbulent flow” and waves generated by the molten solder jet generated by the “uneven wave forming means” are It is a technology that is considered to be difficult to propagate to the jet wave formed in the.
JP 2004-71785 A Japanese Utility Model Publication 4-104269

  However, in the technique of Patent Document 1 described above, the peel back point formed in the second jet wave (shaped jet wave) is formed on the “tray part” without heat supply from other parts. The temperature of the molten solder rapidly decreases due to the supply of heat from the molten solder to the printed wiring board, and the ice curl (icicle: poor soldering that causes the solder to hang down on the fillet) is applied to the fillet of the soldered part. There is a problem that it is likely to occur. In particular, it tends to occur in an electronic component having a large heat capacity, for example, in a lead terminal portion of a connector. This is also a problem that has occurred since the use of lead-free solder having a high melting point and, therefore, a narrower permissible temperature range compared to conventional tin-lead solder.

  Further, in the technique of Patent Document 2, only “round bar shape” or “plate structure” “turbulent flow suppressing member” is provided in the “solder clamp”, and this “turbulent flow suppressing member” Since it is necessary not to contact the lead terminal of the lead type electronic component protruding on the soldered surface of the printed wiring board, that is, the lower surface, it is buried several millimeters below the surface of the jet wave. Therefore, the surface of the jet wave formed on the “laminar wave forming means” cannot be sufficiently attenuated due to the “turbulent flow” generated by the molten solder jet generated by the “uneven wave forming means” As a result, the peel-back point fluctuated, causing the problem that the fillet shape of the soldered portion changed in an unstable manner or caused an ice cream. Therefore, it cannot be said that the technique of Patent Document 2 is sufficient to solve the problem that the fillet shape of the part to be soldered changes in an unstable manner or causes an ice cream.

  It is an object of the present invention to mainly interfere with a dynamic pressure jet wave mainly intended to reliably supply molten solder to a soldered part and a shaped jet wave mainly adjusting the fillet shape of the soldered part. It should be formed as a continuous jet wave, that is, a hybrid wave without any decrease in the solder temperature until the printed wiring board is detached from the hybrid wave, and solder wetting and soldering up of the through-hole are surely generated. In addition, it is to enable soldering mounting of a printed wiring board with high reliability by preventing the occurrence of soldering defects such as ice cream with a stable fillet shape.

  Another object of the present invention is that two jet wave forming means have been used as a flow soldering method for lead-free solder so far. By making this possible with one jet wave forming means, a solder bath is provided. The initial cost is reduced by reducing the initial required amount of expensive lead-free solder, which is said to be 3 to 4 times that of tin-lead solder, and is necessary with the start of daily production. The melting energy of the solder (usually electric power energy) is also greatly reduced.

  The present invention makes it difficult for any location of the hybrid wave that contacts the printed wiring board to receive a heat supply from the solder before the newly supplied jet, and makes it difficult to cause a temperature drop, and a curtain jet (shield jet) There is a great feature in that the dynamic pressure jet wave and the shaped jet wave are shielded by.

  (1) A printed wiring board formed by adjoining a hydrodynamic jet wave in which a large number of mountain-shaped jets of lead-free molten solder and a shaped jet wave having a constant surface shape are formed on a blow body that jets molten solder A method for forming a hybrid wave for soldering, wherein a hole group portion provided with a large number of through holes for jetting molten solder to a blower body, and a shaping plate portion having a plate-like surface shape, Provided with a shielding part having a shielding jet hole that forms a curtain jet, and the influence of wave height fluctuation of many mountain-shaped jets formed on the hole group part is shielded by the curtain jet, and the surface shape on the shaping plate part To form a uniform shaped jet wave.

  By doing so, the dynamic pressure jet wave and the shaped jet wave are shielded by the curtain jet flow, and the influence of the turbulent flow and the wave generated in the dynamic pressure jet wave does not propagate to the shaped jet wave to form a stable shaped jet wave. Therefore, the peel back point can be maintained extremely stably, and a fillet having a stable shape can be formed on the soldered portion.

(2) When forming the hybrid wave of (1), the air outlet comprising a hole group part, a shielding part and a shaping plate part on the air outlet chamber for guiding the molten solder fed from the pump to the air outlet body providing the body, through the mouthpiece chamber to a shaping jet flow formed in the dynamic including fluid flow wave and fairing portion on which consists of a number of mountain-like jets are formed on Anagun portion of the mouthpiece body while heating the sheet from the molten solder so as to form a said dynamic including fluid flow wave and shaping the jet flows.
Further, the blower body having a hole group part, a shielding part, and a shaping plate part is provided on the blower chamber for guiding the molten solder fed from the pump to the blower body, and on the shaping plate part of the blower body. Then, heat is supplied to the shaped jet wave formed from the molten solder in the blowing chamber through the shaped plate portion .

  As a result, heat is always supplied to the shaped jet wave also through the shaped plate part, and the temperature of the solder itself forming this hybrid wave is lowered by the heat supplied to the printed wiring board in contact with the hybrid wave. Since there is no decrease in the solder temperature at the peel back point, no ice curl is generated.

  (3) A printed wiring board formed by adjoining a hydrodynamic jet wave in which a large number of mountain-shaped jets of lead-free molten solder and a shaped jet wave having a constant surface shape are formed on a blow body that jets molten solder An apparatus for forming a hybrid wave for soldering, wherein a molten solder supplied from a pump has a flow path that is supplied to a blower body through a blower chamber and is provided on the blower chamber. The blower body is provided, and the blower body has a hole group portion provided with a large number of through holes for jetting molten solder, a shaped plate portion having a plate-like surface shape, and a shield jet that forms a curtain jet. A shielding part having a hole is provided, and the hole group part and the shaping plate part are arranged adjacent to each other with the shielding part interposed therebetween.

  As a result, the dynamic pressure jet wave and the shaped jet wave are shielded by the curtain jet that jets from the shielded jet hole, and the influence of the turbulent flow and wave generated in the dynamic pressure jet wave does not propagate to the shaped jet wave and is stabilized. Waves can be formed. In addition, since the heat is always supplied to the shaped jet wave from the molten solder in the blower chamber, the temperature of the solder itself forming this hybrid wave is also applied by the heat supplied to the printed wiring board in contact with the hybrid wave. Does not drop.

  Therefore, when the peelback point is maintained extremely stably and a fillet having a stable shape can be formed on the soldered portion, the ice temperature does not occur because the solder temperature does not decrease at the peelback point. Further, the lead terminals of the lead type electronic components mounted on the printed wiring board do not come into contact with the constituent members.

  (4) The hybrid wave forming apparatus according to (3) is configured such that the shielding portion has shielding jet holes formed of a row of holes provided at a narrower interval than the interval between the slit-shaped holes or the hole group portions. .

  The curtain jet that jets from the slit-shaped hole has a strong shielding power, so that it is possible to prevent (very greatly attenuate) the turbulent flow and the wave generated by the dynamic pressure jet wave from propagating to the shaped jet wave. Moreover, the curtain jet which fully prevents the wave produced by a hole group part can be formed also by the hole row provided in the space | interval narrower than the hole space | interval of a hole group part.

  (5) In the hybrid wave forming apparatus according to (3) and (4), the hole group portion is provided on a swinging body that is swingably fitted to the blower body, and further includes swinging means for the swinging body. The configuration is as follows.

  As a result, when the printed wiring board is in contact with the hybrid wave, the dynamic pressure jet wave oscillates, and in addition to the actions (3) and (4), the oscillating force also causes a fine soldered portion. In addition, it is possible to reliably supply molten solder. Furthermore, it becomes possible to easily release the atmosphere and gas that want to stay between the printed wiring board and the hybrid wave, and it is possible to prevent a portion that does not cause solder wetting from occurring in the soldered portion.

  According to the present invention, a dynamic pressure jet wave having a violent jet force and a shaped jet wave having a quiet and gentle flow and having a stable surface shape are reliably partitioned by a curtain jet (shielded jet) to prevent mutual interference. Therefore, the dynamic pressure jet wave and the shaped jet wave can be formed as a continuous jet wave, that is, as a hybrid wave. Further, since the heat is supplied to the shaped jet wave from the molten solder newly supplied one after another from the pump, the solder temperature does not decrease until the printed wiring board is detached from the hybrid wave.

  Therefore, in the printed wiring board that is soldered and mounted by this hybrid wave, it is possible to surely cause solder wetting to occur in the soldered portion and also to cause solder wetting up to the through hole. In addition, the fillet shape of the part to be soldered is stable and does not cause poor soldering such as ice cream, and it is possible to perform soldering mounting of a printed wiring board with good quality and high reliability.

  In addition, since the printed wiring board can be soldered and mounted with one jet wave forming means, the required volume of the solder bath is greatly reduced, the initial required amount of expensive lead-free solder is reduced, and the initial cost is reduced. In addition, it is possible to significantly reduce the melting power energy of the solder required for the daily production start.

  Hereinafter, a configuration example of a hybrid wave forming method and a hybrid wave forming apparatus according to the present invention will be described.

  FIG. 1 is a view for explaining a configuration example of a soldering apparatus employing the hybrid wave forming method of the present invention, and shows a side cross section thereof. The soldering apparatus shown in FIG. 1 is composed of a preheating step 1 and a soldering step 2, and a conveyor 8 is provided so that a printed wiring board 9 is conveyed in the direction of arrow A and passes therethrough. . The conveyer 8 is schematically shown using a one-dot chain line.

  In the preheating step 1, in order to reduce the heat shock when the printed wiring board 9 comes into contact with the molten solder (hybrid wave), in addition to pre-activation of the flux applied to the printed wiring board 9 Perform preliminary heating. Here, the infrared rays from the heater 3 and hot air are used in combination for heating, the infrared rays are radiated from the heater surface, and the air blowing atmosphere from the blower fan 4 is heated by the heater 3 to produce hot air as the printed wiring board 9. Be blown into.

  In the next soldering step 2, the molten solder is brought into contact with the surface to be soldered of the printed wiring board 9, that is, the lower surface in the figure, and the molten solder is supplied to the soldered portion. The hybrid wave and the printed wiring board 9 are brought into contact with each other and soldering is performed.

(1) Hybrid Wave Forming Apparatus The configuration of the hybrid wave forming apparatus of the present invention will be described in detail with reference to FIG. The solder tank 6 contains lead-free solder 7 which is heated and melted by a heater (not shown), and its temperature is determined in advance by controlling the power supplied to the heater by a temperature sensor and a temperature control device (not shown). Maintained at a predetermined temperature.

  This lead-free molten solder 7 (hereinafter simply referred to as “molten solder”) is sent to the blower chamber 101 by the pump 5, and the flow is adjusted by the current plate 102 at that time, and then supplied to the blower body 110. . The solder supply cross-sectional area of the blower chamber 101 and the planar area of the blower body 110 are substantially the same, and the blower body 110 is connected to the blower chamber 101 so that the interior of the blower chamber 101 faces upward in the figure. The flowing molten solder is always configured to heat the blown body 110 and the molten solder flowing above it, that is, the molten solder forming a hybrid wave.

  The printed wiring board 9 is normally transported at an elevation angle θ in order to enhance the peel-back effect, and the plane of the blower body 110 is also inclined to the right in the figure slightly in accordance with it. A large number of dynamic pressure jet holes 112 are provided on the side of the blower body 110 where the printed wiring board 9 is carried to form the hole group part 111, and subsequently a shield jet hole 117 such as a slit is provided to provide a shield part. 116, followed by providing a flat shaped plate portion 114 with a flat surface for collecting molten solder at the end of the shaped plate portion 114 from which the printed wiring board 9 is unloaded. A weir plate 103 is provided. The barrier plate 103 is provided so that its position can be adjusted in the direction of arrow B by a long hole 105 and a screw 104. Moreover, a hole group part, a shielding part, and a shaping board part may be integrally formed in a blower body, or you may comprise a part with another member.

  With the above configuration, the dynamic pressure jet wave 113 is formed by the molten solder jetted from the hole group part 111, and the curtain jet 118 is formed from the shield jet hole 117. These jetted molten solder flows separately on the carry-in side and the carry-out side of the printed wiring board 9, but the wave of the dynamic pressure jet wave 113 is shielded by the curtain jet 118, and the printed wiring board 9 is taken out from the curtain jet 118. It is suppressed that it is transmitted to. As a result, a dynamic pressure jet wave 113 is generated on the shielding part 116 while forming a strong jet force on the soldered part of the printed wiring board 9 to cause solder wetting on the hole group part 111 of the blower body 110. Forms a curtain jet 118 with excellent wave shielding power, and a shaped jet wave 115 having a stable shape and a gentle flow for giving a stable peel back action is formed on the shaping plate portion 114. A hybrid wave is formed.

  Next, a specific example of the configuration of the main part of the blower body, which is the key to forming the hybrid wave of the present invention, will be described with reference to FIGS. In the following description, the same reference numerals are given to the same components throughout the drawings.

  Fig.2 (a) is a top view which shows one specific example of a blower body, FIG.2 (b) is a figure which shows the side cross section. In this example, the hole group part 111 is composed of a large number of dynamic pressure jet holes 112 arranged in three rows in a staggered manner, the shielding part 116 is composed of slit-like shielding jet holes 117a, and the shaping plate part 114 is a flat plate. It is configured as a face plate. The side plate 201 is a means for preventing molten solder from flowing out to the side.

  The weir plate 103 is a means for forming the shaped jet wave 115 having a stable planar shape on the shaping plate portion 114, and the overflow flow rate of the molten solder is adjusted by adjusting the height in the arrow B direction. The inclination angle (a slight angle but an important angle) of the surface of the shaped jet wave 115 and the flow velocity of the shaped jet wave 115 can be adjusted. That is, it is possible to adjust the separation angle and separation speed of the molten solder at the peel back point. Moreover, the height of the entire hybrid wave can be adjusted by adjusting the molten solder supply flow rate per unit time by adjusting the rotational speed of the pump and the like. In addition, it is also possible not to provide a weir plate by appropriately adjusting the wave height of the entire hybrid wave and the inclination angle of the blower body.

  Fig.3 (a) is a top view which shows another specific example of a blower body, FIG.3 (b) is a figure which shows the side cross section. In this example, the shielding jet holes 117 b constituting the shielding part 116 are constituted by a plurality of jet holes provided in a row at intervals narrower than the hole pitch of the dynamic pressure jet holes 112 constituting the hole group part 111. Also with this configuration, it is possible to form a turbulent flow of the dynamic pressure jet wave 113 and a curtain jet that shields the wave. In addition, it is good also as a structure which provided the several oblong hole in the row | line | column with the shielding jet hole.

  Fig.4 (a) is a top view which shows another example of a blower body, FIG.4 (b) is a figure which shows the side cross section. In this example, a slit-like shielding jet hole 117c constituting the shielding portion 116 is provided with a jet hole similar to the dynamic pressure jet hole 112 so as to overlap, and the curtain jet formed by this, that is, the shielding jet wave is also slightly present. Although it has the characteristics of dynamic pressure jet waves.

  FIG. 5 is a view for explaining an example of the structure of a blower body for enhancing the action of a curtain jet, that is, a shield jet wave, and FIG. FIGS. 5B, 5C, and 5D are diagrams showing examples of the side cross-sections, respectively.

  In order to enhance the shielding action of the curtain jet, that is, the shielding jet wave, the directivity of the curtain jet may be increased. For this reason, in the example of FIG. 5B, a directing portion 520a having a rise on the ejection side of the shielding jet hole and having a rectifying action is provided. Further, FIG. 5C is devised so that the molten solder flowing through the shaping plate portion flows gently by making the shape of the directing portion 520b of FIG. 5B gentle, and further, FIG. The part 520c is provided on the lower side of the shaping plate portion so that the solder flow on the shaping plate portion is further stabilized without being influenced by the directing portion.

(2) Soldering mounting of printed wiring board by hybrid wave Next, soldering mounting of the printed wiring board using the hybrid wave of the present invention will be described with reference to FIG. When the printed wiring board 9 preheated in the preheating process 1 is carried into the soldering process 2 in which the hybrid wave is formed, the printed wiring board 9 is first formed with a plurality of mountain-shaped jets. The molten solder that comes into contact with the dynamic pressure jet wave 113 and jets violently to the soldered portion is supplied to cause solder wetting reliably.

  Subsequently, the shaped jet wave 115 which is passed through the curtain jet portion while being in contact with the hybrid wave, contacts the shaped jet wave 115 and is continuously heated by the flow of the molten solder rising up the blower chamber 101. The printed wiring board 9 having received sufficient heat from the substrate surely wets the molten solder into the through hole. Since the shaped jet wave 115 heated to the printed wiring board 9 is also heated from the molten solder in the blow-out chamber 101 through the shaped board, the temperature does not decrease. When the printed wiring board 9 is separated from the gentle and stable flow and the shaped shaped jet wave 115 having a stable shape, the position of the peel back point does not change, and the molten solder is applied to the supplied soldered portion. It becomes possible to provide a stable peel-back effect, and a fillet with a uniform shape can be formed. At this time, since the soldering temperature of the shaped jet wave 115 does not decrease, a defective fillet such as an ice car does not occur at the time of separation.

  As described above, according to the hybrid wave of the present invention, the two jet waves are independently formed as conventionally performed, and the primary wave soldering process and the secondary soldering process are included. Better soldering quality than soldering mounting.

  This is because the lead-free solder has a high melting point of about 220 ° C., and even with a slight temperature drop, the fluidity is lowered and the wettability is also rapidly lowered, but if the hybrid wave of the present invention is used, It is possible to suppress the temperature drop of molten solder as much as possible, and when supplying molten solder to the printed wiring board, supply the solder continuously so that the heat supply to the printed wiring board does not stagnate, and to the soldered part This is because reliable supply, shaping, and finishing of the molten solder are performed as one continuous process. In other words, it can be concluded that it is extremely suitable to perform soldering by one hybrid wave capable of supplying sufficient heat to perform flow soldering using lead-free solder. Therefore, the solder wave mounting technology using the hybrid wave of the present invention can be positioned as a technical standard for flow soldering mounting using lead-free solder.

(3) Hybrid Wave Forming Device Having Swinging Dynamic Pressure Jet Wave FIG. 6 is a diagram for explaining a configuration example of a hybrid wave forming device configured so that the position of the dynamic pressure jet wave is swung. (A) is a top view of a blower body, FIG.6 (b) is a figure which shows the side cross section, FIG.6 (c) is a perspective view explaining the whole blower body.

  A configuration example of a hybrid wave forming apparatus in which the effect is further enhanced by swinging the dynamic pressure jet wave will be described with reference to FIG. That is, a hole group portion 111 composed of the dynamic pressure jet holes 112 forming the dynamic pressure jet wave 113 is provided in the rocking body 601, and this rocking body 601 can be swung in the fitting portion 602 of the blower body 110 in the direction of arrow C. The rocking body 601 is configured to reciprocate continuously in the direction of arrow C by a crank mechanism 605 including a motor 603, a reduction gear 607, a disk 606 (rotation direction D), and an arm 604.

  The shielding part 116 of the blower body 110 is provided with a slit-like shielding jet hole 117 as an example, and a shaping plate part 114 and a weir plate 103 are provided at the subsequent stage. Further, in FIG. 6C, the side plate is not provided in the hole group, but this is for suppressing the oscillation wave of the oscillating dynamic pressure jet wave from propagating to the shaped jet wave. A side plate may be provided as long as the wave solder flow rate is small and the oscillation speed is low so that interference due to propagation is negligible.

  In this way, by bringing the hydrodynamic jet wave 113 of the hybrid wave into contact with the printed wiring board 9 while swinging in the direction of arrow C, a further fine soldered part or chip-type electronic component is mounted by this swinging force. Thus, it is possible to reliably supply the molten solder to the soldered portion that has a three-dimensional shape. Moreover, the atmosphere and gas which are going to stay between the printed wiring board 9 and the hybrid wave can be easily released, and such a defect that solder wet does not occur due to the residual atmosphere or gas can be eliminated.

(4) Hybrid wave forming device capable of changing the characteristics of the shaped jet wave FIG. 7 shows a hybrid wave forming device capable of adjusting the flow direction of the molten solder at the tilted state and peel back point of the shaped wave of the hybrid wave. FIG. 7A is a plan view of the blower body, and FIG. 7B is a side cross-sectional view thereof.

  In the example shown in FIG. 7, an equilibrium jet hole 702 having the same shape as the shield jet hole 117 is also provided on the side of the shaping plate 114 on the dam plate 103 side, and its position is adjusted in the direction of arrow E by a long hole and a screw. This is an example of a hybrid wave forming apparatus configured such that the opening degree of the shielding jet hole 117 and the opening degree of the balanced jet hole 702 can be adjusted differentially by the opening degree adjusting plate 701 that can be used.

  This makes it possible to adjust the ratio between the molten solder flow rate per unit time jetted from the shield jet hole 117 and the molten solder flow rate per unit time jetted from the balanced jet hole 702. For example, FIG. Assuming that the peel-back point is located at the black point, the flow direction of the shaped jet wave 115 flowing at the peel-back point can be adjusted in the direction of arrow F or arrow G. In addition, the inclination state of the shaped jet wave 115 can be adjusted accordingly.

  In other words, this makes it possible to control the flow direction and flow velocity of the molten solder at the position where the soldered portion of the printed wiring board 9 is detached from the hybrid wave, that is, the position of the peel back point. A fillet shape can be formed.

  It should be noted that only the opening degree of the balanced jet hole 702 may be adjusted without providing the opening degree adjusting means of the shield jet hole 117, and the opening degree of the shield jet hole 117 and the opening of the balanced jet hole 702 may be adjusted. The degree may be adjusted by different means.

  The hybrid wave forming method and hybrid wave forming apparatus according to the present invention satisfy all the necessary conditions when performing flow soldering of a printed wiring board using a lead-free solder having a high melting point, and lead-free solder It can be used as a technical standard for flow soldering.

It is a figure explaining an example of the composition of the soldering device using the hybrid wave of the present invention. It is a figure explaining an example of the composition of the principal part of the blower which forms the hybrid wave of the present invention. It is a figure explaining another example of a structure of the principal part of the blower body which forms the hybrid wave of this invention. It is a figure explaining another example of the composition of the principal part of the blower which forms the hybrid wave of the present invention. It is a figure explaining the structural example for improving the effect | action of the curtain jet of the blowing body which forms the hybrid wave of this invention. It is a figure explaining the structural example made to rock | fluctuate the position of a dynamic pressure jet wave in the hybrid wave formation apparatus of this invention. It is a figure explaining the structural example which enabled it to change the characteristic of a shaping jet wave in the hybrid wave formation apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Blow-out chamber 103 Dam plate 110 Blow-off body 111 Hole group part 112 Dynamic pressure jet hole 113 Dynamic pressure jet wave 114 Shaping board part 115 Shaping jet wave 116 Shielding part 117 Shielding jet hole 118 Curtain jet 601 Oscillator 602 Fitting part 701 Opening adjustment plate 702 Equilibrium jet hole

Claims (6)

For printed circuit board soldering, formed by adjoining a hydrodynamic jet wave that forms a number of mountain-shaped jets of lead-free molten solder and a shaped jet wave with a constant surface shape on the blower that jets the molten solder A method of forming a hybrid wave,
A hole group provided with a large number of through holes for jetting molten solder in the blower body and a shaped plate having a plate-like surface shape are provided with a shield having a shield jet hole forming a curtain jet. , Forming a shaped jet wave with a constant surface shape on the shaping plate part by shielding the influence of wave height fluctuations of a large number of mountain shaped jets formed on the hole group part by a curtain jet,
A method of forming a hybrid wave characterized by the above. Formed on the hole group part of the blower body by providing the blower body composed of a hole group part, a shielding part and a shaping plate part on the blower hole chamber for guiding the molten solder fed from the pump to the blower body. numerous mountain-like movement including fluid flow waves consisting of jet and the dynamic including fluid flow wave while heating the sheet from the molten solder flowing mouthpiece chamber to a shaping jet flow to be formed on the fairing portion and the shaping jet flow to be Forming,
The method of forming a hybrid wave according to claim 1. Formed on the shaping plate portion of the blowing body by providing the blowing body comprising the hole group, the shielding portion and the shaping plate portion on the blowing chamber for guiding the molten solder fed from the pump to the blowing body. Heating the shaped jet wave from the molten solder in the blower chamber through the shaped plate portion ,
Method of forming a hybrid wave according to claim 1 or 2 wherein. For printed circuit board soldering, formed by adjoining a hydrodynamic jet wave that forms a number of mountain-shaped jets of lead-free molten solder and a shaped jet wave with a constant surface shape on the blower that jets the molten solder A hybrid wave forming device,
The blower body is provided on the blower chamber and has a flow path through which the molten solder supplied from the pump is supplied to the blower body through the blower chamber. A hole group portion provided with a large number of through holes for jetting a gas, a shaping plate portion having a plate-like surface shape, and a shielding portion having a shielding jet hole for forming a curtain jet, the hole group portion and the shaping The board part and the adjacent arrangement with the shielding part in between,
A device for forming a hybrid wave characterized by the above. The shielding part has shielding jet holes composed of a row of holes provided at a narrower interval than the hole interval of the slit-like hole or hole group part;
The hybrid wave forming apparatus according to claim 4 . The rocking body constituting the hole group is fitted to the blower body so as to be rockable, and further provided with rocking means for the rocking body.
The hybrid wave forming apparatus according to claim 4 or 5, wherein:

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