JPH01266792A - Method and apparatus for soldering printed board - Google Patents
Method and apparatus for soldering printed boardInfo
- Publication number
- JPH01266792A JPH01266792A JP9449588A JP9449588A JPH01266792A JP H01266792 A JPH01266792 A JP H01266792A JP 9449588 A JP9449588 A JP 9449588A JP 9449588 A JP9449588 A JP 9449588A JP H01266792 A JPH01266792 A JP H01266792A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- printed circuit
- circuit board
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 74
- 230000004907 flux Effects 0.000 claims abstract description 10
- 230000007547 defect Effects 0.000 abstract description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の属する技術分野〕
本発明はプリント基板のはんだ付け、特にチップ部品を
搭載したプリント基板を溶融はんだに接触させてはんだ
付けを行う方法および装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to soldering of printed circuit boards, and particularly to a method and apparatus for soldering a printed circuit board on which chip components are mounted by bringing it into contact with molten solder.
一般にリードのある電子部品を搭載したプリント基板の
はんだ付け方法は、フラックス塗布、予備加熱、そして
静止はんだ槽または静がな波を噴流するはんだ槽での溶
融はんだ接触により行うものである。しかるに、該はん
だ付け方法はチップ部品を搭載したプリント基板に対し
て、はんだの付着しない未はんだを多数発生させるため
使用できない。これはチップ部品とプリント基板のはん
だ付け部が直角の隅部となるため、リードのある電子部
品のはんだ付けに用いるはんだ槽では溶融はんだを該隅
部に侵入させることができないからである。The general method for soldering printed circuit boards with leaded electronic components is to apply flux, preheat, and contact with molten solder in a static solder bath or a solder bath with a static wave jet. However, this soldering method cannot be used for a printed circuit board on which chip components are mounted because it generates a large amount of unsolder to which no solder adheres. This is because the soldering part of the chip component and the printed circuit board form a corner at a right angle, and therefore, in a solder bath used for soldering electronic components with leads, molten solder cannot penetrate into the corner.
そこで、近時チップ部品を搭載したプリント基板のはん
だ付け（以下、チップ部品のはんだ付けという）方法と
しては、溶融はんだとの接触にダブルウェーブはんだ槽
を用いるようになってきたダブルウェーブはんだ槽とは
、荒れた溶融はんだを噴流させる荒波はんだ槽と、静か
な溶融はんだを噴流させる仕上げはんだ槽を備えたもの
である。Therefore, in recent years, as a method for soldering printed circuit boards mounted with chip components (hereinafter referred to as "chip component soldering"), a double wave solder bath has been used for contact with molten solder. This is equipped with a rough wave solder tank that jets out rough molten solder, and a finishing solder tank that jets calm molten solder.
ダブルウェーブはんだ槽を用いたチップ部品のはんだ付
け方法は、第２図に示すようにプリント基板（図示せず
）にフラクサーｌでフラックス塗布、ブリヒーター２て
予備加熱を施した後、荒波はんだ槽３と仕上げはんだ槽
４から噴流するｉ″２７融はんだに順次接触させて行う
。この時、荒波はんだ槽ては直角なはんだ付け部に溶融
はんだを侵入させろことはできるが、噴流波が荒れてい
るためツララやブリッヂのようなはんだ付け不良を多数
発生さけてしまう。そこで、荒波はんだ槽で発生したツ
ζララやブリッヂを静かな噴流波の仕上げはんだ槽で除
去するものである。The method for soldering chip components using a double wave soldering bath is as shown in Figure 2. After applying flux to a printed circuit board (not shown) using fluxer 1 and preheating it using preheater 2, soldering is performed using a rough wave soldering bath. 3 and the finishing solder bath 4 are sequentially brought into contact with the i''27 molten solder jetted from the solder bath 4. At this time, the rough wave solder bath allows the molten solder to penetrate into the soldering part at right angles, but the jet waves are rough. This avoids many soldering defects such as icicles and bridges.Therefore, the glazes and bridges that occur in rough wave soldering baths are removed in a finishing solder bath with quiet jet waves.
−１−記従来のチップ部品のはんだ付け方法は、成る程
度、未はんだを無くすことはできるが、完全なものとは
言えず、少数の未はんだが発生（）ていた１゜
本発明はチップ部品のはんだ付けにおいて、未はんだの
発生を皆無にすることのできるはんだ付け方法および装
置を提供することにある。-1- The conventional soldering method for chip components can eliminate unsoldered parts to some extent, but it cannot be said to be perfect, and a small number of unsoldered parts are generated. It is an object of the present invention to provide a soldering method and device that can completely eliminate the occurrence of unsoldered parts when soldering parts.
本発明者が、荒波噴流はんだがチップ部品のはんだイ１
け部に侵入する機構について鋭意検討を宜ねた結果、荒
れた波の動きの激しい部分（激動部という）がはんだ付
け部に当たった時に溶融はんだは侵入しやすくなること
が分かった。そこで本発明者は、プリント基板のはんだ
付け部が激動部に当たるｎ会を多くすれば、未はんだの
発生を無くすことができることに着目して本発明を完成
させた。The present inventor has discovered that rough wave jet solder is a soldering method for chip components.
As a result of careful study of the mechanism by which molten solder penetrates into the soldering area, it was found that molten solder is more likely to penetrate when the violently moving parts of rough waves (referred to as turbulent parts) hit the soldering parts. Therefore, the inventor of the present invention has completed the present invention by focusing on the fact that the occurrence of unsolder can be eliminated by increasing the number of parts where the soldering part of the printed circuit board corresponds to the turbulent part.
本発明は２プリント基板のはんだ付け面にフラックス塗
布、予備加熱を行ってから荒れた状態で噴流寸ろ溶融は
んだに複数回接触させ、その後、静かな状態で噴流する
溶融はんだに接触させることを特徴とするプリント基板
のはんだ付け方法であり、プリント基板の進行方向に複
数の荒波はんだ槽が並設されているとともに、プリント
基板進行方向最前の荒波はんだ槽に隣接して仕上げはん
だ槽が設置されていることを特徴とするプリント基板の
はんだ付け製画である。The present invention involves applying flux to the soldering surface of a printed circuit board, preheating it, and then contacting the soldering surface of the printed circuit board several times with a jet of molten solder in a rough state, and then bringing it into contact with a jet of molten solder in a calm state. This method of soldering printed circuit boards is characterized by the fact that multiple rough wave solder baths are installed in parallel in the direction of travel of the printed circuit board, and a finishing solder bath is installed adjacent to the first rough wave solder bath in the direction of travel of the printed circuit board. This is a soldering drawing of a printed circuit board.
本発明プリント基板のはんだ付け装置は、フラクサー１
、ブリヒーター２、複数の荒波はんだ槽３、：３”、仕
上げはんだ槽４、冷却ｎ５、等から構成されている。The printed circuit board soldering device of the present invention includes a fluxer 1
, a preheater 2, a plurality of rough wave solder baths 3:3'', a finishing solder bath 4, a cooling n5, etc.
フラクサー１はフラックスをプリント基板のはんだ１ｔ
け面に塗布するもので、発泡式、スプレー式、浸漬式等
がある。ブリヒーター２は次工程のプリント基板の溶融
はんだ浸漬時、プリント基板＋；＝ 液体成分が付着し
ていると溶融はんだが飛散して危険となるため、これを
蒸発させるものであり；’ｃ 、； Ｎこプリント基板
や電子部品は高温の溶融はんだに急に接触させるとヒー
トショックを受けて破損する虞があることから、これを
緩和させるためのｔ）のである。複数の荒波はんだ槽３
．３′はプリント基板の進行方向（矢印）に並設されて
おり、各荒波はんだ槽には噴流する溶融はんだの波を荒
らす手段が施されている。また、仕上げはんだ槽４はプ
リント基板の進行方向最前の荒波はんだ槽３′に隣接し
て設置されている。仕上げはんだ槽はノズルから噴流す
る溶融はんだがフォーマに沿って静かに流れろようにな
っている。なお、複数の荒波はんだ槽および仕上げはん
だ槽は、複数の荒波はんだ槽のノズルあるいは複数の荒
波はんだ槽のノズルと仕上げはんだ槽のノズルが一つの
大きなはんだ槽の中に設置されているものや、或いはそ
れぞれのノズルが独立したはんだ槽に設置されているも
のでも良い。また、荒波はんだ槽コ３２と仕上げはんだ
槽４の間にフラクサーを設置すると、複数の荒波はんだ
槽の溶融はんだに接触して流されたフラックスを補うこ
とができる。冷却機５は、はんだ付け後のプリント基板
を早急に冷却して、付着した溶融はんだを凝固させると
ともに電子部品の熱影響を少なくするようにするもので
ある４
次にＬ記はんだ付け装置を用いた本発明プリント基板の
はんだ付け方法について説明する。Fluxer 1 applies flux to 1 ton of solder on a printed circuit board.
It is applied to the surface, and there are foaming type, spray type, dipping type, etc. The bri-heater 2 is used to evaporate the molten solder when the printed circuit board is immersed in the molten solder in the next step, since if the liquid component adheres to the printed circuit board, the molten solder will scatter and become dangerous. t) This is to alleviate the risk that printed circuit boards and electronic components may be damaged by heat shock if they are brought into sudden contact with high-temperature molten solder. Multiple rough wave solder baths 3
．． 3' are arranged in parallel in the traveling direction (arrow) of the printed circuit board, and each rough wave solder tank is provided with means for roughening the waves of the molten solder jetting out. Further, the finishing solder bath 4 is installed adjacent to the rough wave solder bath 3' at the forefront in the traveling direction of the printed circuit board. The finishing solder bath is designed so that the molten solder jetted from the nozzle flows quietly along the former. Note that multiple rough wave solder tanks and finishing solder tanks are those in which multiple rough wave solder tank nozzles or multiple rough wave solder tank nozzles and finishing solder tank nozzles are installed in one large solder tank, Alternatively, each nozzle may be installed in an independent solder bath. Furthermore, if a fluxer is installed between the rough wave solder bath 32 and the finishing solder bath 4, it is possible to supplement the flux that has flowed in contact with the molten solder of the plural rough wave solder baths. The cooler 5 quickly cools the printed circuit board after soldering, solidifies the adhered molten solder, and reduces the heat effect on the electronic components. 4 Next, the soldering equipment listed in L is used. A method of soldering a printed circuit board according to the present invention will be explained.
図示しないプリント基板は矢印の如く走行し、先ずフラ
クサー１でフラックス塗布され、次いでブリヒーター２
で予備加熱がなされる。そして、プリント基板は複数の
荒波はんだ槽３．３′を通過して、はんだ付け部に溶融
はんだが付着させられる。この時、従来のように一つの
荒波はんだ槽だけにプリント基板を接触させる方法はプ
リント基板が噴流する溶融はんだの激動部に接触する時
間が短いが、本発明では荒波はんだ禮の激動部に接触す
る機会が多くなるため、未はんだが少なくなるものであ
る。荒波はんだ槽てのはんだ付け後直ぐに仕上げはんだ
槽４の静かな流れではんだ付け不良が修正されろ。The printed circuit board (not shown) runs as shown by the arrow, and is first coated with flux using fluxer 1, and then is coated with flux using preheater 2.
Preheating is performed. Then, the printed circuit board passes through a plurality of rough solder baths 3.3', and molten solder is applied to the soldered parts. At this time, in the conventional method of contacting the printed circuit board with only one rough wave solder bath, the time during which the printed circuit board comes into contact with the turbulent part of the jetting molten solder is short, but in the present invention, the printed circuit board contacts the turbulent part of the rough wave soldering. Since there are more opportunities to solder, there are fewer unsoldered pieces. Immediately after soldering in the rough wave solder bath, the soldering defects are corrected by the quiet flow in the finishing solder bath 4.
本発明プリント基板のはんだ付け装置は、従来のダブル
ウェーブはんだ槽を用いたはんだ付け装置と大きさがあ
まり変わらないものであり、また従来のダブルウェーブ
はんだ槽に荒波はんだ槽を増；９するだけでも良いとい
う簡便さを有している。The printed circuit board soldering device of the present invention is not much different in size from a conventional soldering device using a double wave soldering bath, and only requires adding a rough wave soldering bath to the conventional double wave soldering bath. It is so convenient that it can be used even if
また、本発明プリント基板のはんだ付け方法は未はんだ
の発生を皆無にすることができるため、信頼あるはんだ
付け部が得られるものであ乙５．Furthermore, since the printed circuit board soldering method of the present invention can completely eliminate the occurrence of unsoldered parts, reliable soldered parts can be obtained.
第１図は本発明プリント基板のはんだ付け方法を説明す
る図、第２図は従来のプリント基板のはんだ付け方法を
説明する図である。
ｌ・・・フラクサー ２・・・ブリヒーター
３．３゛・・・荒波はんだ槽 ４・・・仕上げはんだ
槽５・・・冷却機FIG. 1 is a diagram illustrating a method of soldering a printed circuit board according to the present invention, and FIG. 2 is a diagram illustrating a conventional method of soldering a printed circuit board. l...Fluxer 2...Brie heater 3.3゛...Rough wave solder bath 4...Finish solder bath 5...Cooler
Claims (2)
予備加熱を行ってから荒れた状態で噴流する溶融はんだ
に複数回接触させ、その後、静かな状態で噴流する溶融
はんだに接触させることを特徴とするプリント基板のは
んだ付け方法。(1) Apply flux to the soldering surface of the printed circuit board,
A method for soldering a printed circuit board, which is characterized in that after preheating, the method is brought into contact with molten solder jetting in a rough state several times, and then brought into contact with molten solder jetting out in a quiet state.
並設されているとともに、プリント基板進行方向最前の
荒波はんだ槽に隣接して仕上げはんだ槽が設置されてい
ることを特徴とするプリント基板のはんだ付け装置。(2) A printed circuit board characterized in that a plurality of rough wave solder baths are arranged in parallel in the direction of travel of the printed circuit board, and a finishing solder bath is installed adjacent to the rough wave solder bath at the forefront in the direction of travel of the printed circuit board. soldering equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9449588A JPH01266792A (en) | 1988-04-19 | 1988-04-19 | Method and apparatus for soldering printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9449588A JPH01266792A (en) | 1988-04-19 | 1988-04-19 | Method and apparatus for soldering printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01266792A true JPH01266792A (en) | 1989-10-24 |
Family
ID=14111881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9449588A Pending JPH01266792A (en) | 1988-04-19 | 1988-04-19 | Method and apparatus for soldering printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01266792A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04258370A (en) * | 1991-02-06 | 1992-09-14 | Matsushita Electric Ind Co Ltd | Device and method for dip soldering |
| JPH0513661U (en) * | 1991-08-09 | 1993-02-23 | 東京生産技研株式会社 | Automatic soldering equipment |
| US11130188B2 (en) | 2017-12-25 | 2021-09-28 | Senju Metal Industry Co., Ltd. | Jet solder bath and jet soldering device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61289965A (en) * | 1985-06-17 | 1986-12-19 | Meisho Kk | Jet type solder tank |
-
1988
- 1988-04-19 JP JP9449588A patent/JPH01266792A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61289965A (en) * | 1985-06-17 | 1986-12-19 | Meisho Kk | Jet type solder tank |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04258370A (en) * | 1991-02-06 | 1992-09-14 | Matsushita Electric Ind Co Ltd | Device and method for dip soldering |
| JPH0513661U (en) * | 1991-08-09 | 1993-02-23 | 東京生産技研株式会社 | Automatic soldering equipment |
| US11130188B2 (en) | 2017-12-25 | 2021-09-28 | Senju Metal Industry Co., Ltd. | Jet solder bath and jet soldering device |
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