USRE32982E - Mass soldering system - Google Patents
Mass soldering system Download PDFInfo
- Publication number
- USRE32982E USRE32982E US06/918,288 US91828886A USRE32982E US RE32982 E USRE32982 E US RE32982E US 91828886 A US91828886 A US 91828886A US RE32982 E USRE32982 E US RE32982E
- Authority
- US
- United States
- Prior art keywords
- solder
- board
- air
- wave
- molten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Definitions
- the present invention relates to systems for soldering electrical and electronic components onto substrate circuit boards, and more specifically to an improved apparatus and method for mass soldering electrical and electronic components by their leads, to printed circuit boards or the like.
- a typical prior art wave soldering system generally comprises a container adapted to hold a supply of molten solder and a sump partially submerged in the molten solder.
- the sump has an intake orifice below the surface of molten solder, and an elongate horizontal nozzle or slot above the surface of the solder.
- a positive displacement pump is submerged in the body of solder and is adapted to force molten solder into the sump intake orifice, where the molten solder then flows upward in the sump and out the horizontal nozzle to thereby produce a smoothly rounded standing wave of molten solder above the nozzle.
- Other techniques for mass soldering electrical and electronic components onto printed circuit boards are well known in the art and include cascade soldering, jet soldering and drag soldering. So-called "leadless" components such as flat packs can also be mass soldered to circuit boards by fixing the components to the bottom of a board, e.g.
- the prior art has devised various techniques to solve the problems of solder shorts, icicling and bridging.
- wave soldering one technique which has become virtually universally adopted by the industry is to incline the travel path of the circuit boards through the solder wave, i.e. from the horizontal, to increase the exit angle between a board being soldered and the solder wave.
- the art has also devised various wave geometries for further increasing the exit angle and/or changing the point where a circuit board exits the wave.
- Another system for reducing the incidence of solder shorts, icicling and bridging, which has achieved substantial commercial acceptance, is to intimately mix soldering oil in the solder wave in accordance with the teachings of Walker et al. U.S. Pat.
- Another object of the present invention is to provide an improved apparatus and process for mass soldering in which the problems of solder shorts, icicling and/or bridging are reduced.
- a more specific object is to provide an apparatus and process for mass soldering relatively high density circuit board assemblies.
- the invention accordingly comprises the processes involving the several steps and relative order of one or more of such steps with respect to each other and the apparatus possessing the features, properties and relations of elements which are exemplified in the following detailed description and the scope of the application of which will be indicated in the claims.
- the instant invention overcomes the foregoing and other problems by providing a method and apparatus for removing excess solder from mass soldered boards before the solder solidifies as shorts, icicles or bridges.
- the method comprises the step of directing a fluid stream onto the bottom of a soldered board substantially immediately following mass deposition of the molten solder onto the board.
- the fluid stream impinges onto the bottom of the board, and relocates excess solder on, and/or blasts excess solder from the bottom of the board and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges.
- the fluid may comprise a gas such as an inert gas, or a mixture of gases such as air. If desired, liquid droplets such as soldering oil may be included in the fluid stream.
- the fluid stream is pre-heated prior to contacting the board.
- solder removal is used to denote actual displacement of solder from a circuit board, and any interconnections, component leads and/or component bodies thereon, as well as relocation of solder on a circuit board, and any interconnections, component leads and/or component bodies thereon.
- the instant method is implemented with a mass soldering apparatus which essentially comprises a soldering station in which a quantity of molten solder can be mass deposited onto the bottom of the board to remove a portion of the solder deposited on the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder cools below liquidus temperature.
- FIG. 1 is a side elevational view, diagrammatically illustrating a mass soldering system according to the present invention
- FIG. 2 is a side elevational view, partly in section, of the soldering apparatus portion of the soldering system of FIG. 1;
- FIG. 3 is a top plan view of the soldering apparatus portion of FIG. 2;
- FIG. 4 is a schematic diagram of the electrical and pneumatic control means of the same apparatus
- FIG. 5 is an enlarged, side elevational view in section, of a portion of the apparatus of FIG. 2, showing a circuit board assembly at an intermediate stage in the process of the present invention, and showing how excess solder is removed in accordance with the present invention;
- FIG. 6 is a view similar to FIG. 5 illustrating an alternative soldering apparatus according to the present invention.
- FIGS. 7 and 8 are top plan and cross-sectional views, respectively showing one form of fluid stream directing nozzle structure useful in the soldering apparatus of the present invention
- FIG. 9 is a side elevational view in perspective showing another and preferred form of fluid stream directing nozzle structure in the soldering apparatus of the present invention.
- FIG. 10 is a side view in cross-section of the nozzle structure of FIG. 9.
- component refers to leadless components as well as components having conventional metallic conductors or leads.
- component lead refers to that part of metallic conductor of an electrical or electronic component that is joined to the printed circuit board pattern, i.e. the component leads, terminals, lugs, pins, etc.
- laminate refers to that part of the metallic pattern on the printed circuit board to which a component or component lead is joined by solder.
- fluid is to be understood to refer to a gas or mixture of gases. If desired, the gas or mixture of gases may also contain liquid droplets dispersed therein.
- mass soldering as used herein is intended to refer to any of the several soldering techniques known in the art in which liquid solder is applied to a circuit board from a reservoir of liquid solder, including, by way of example but not limitation: wave soldering, touch or dip soldering, pot soldering, jet soldering, cascade soldering and drag soldering.
- a printed circuit board 20 is loaded at an insertion station 22, with a plurality of electrical or electronic components 24 at predetermined positions on the board.
- the board comprises an insulated wiring board having one or more printed metallic conductors on the board underside, and a plurality of apertures 25 which extend through the board.
- Components 24 are loaded onto the top side of the board with their leads 26 protruding downward through the board apertures 25 in juxtaposition to the circuit lands to which they are to be joined.
- the components may be inserted in the board by any method known in the art which may include manual assembly, semi-automatic, or automatic assembly which may comprise single-station of multiple-station pantagraph or numerically controlled machines all of which are well known in the art and need not be described further.
- the next step involves treating the surfaces to be soldered with a so-called flux at a fluxing station 30.
- the flux may be any flux well known in the art and may include, for example, a water-white rosin flux, an activated rosin flux or a water soluble flux.
- the flux may be applied in fluxing station 30 by any manner well known in the art, for example, by spraying, foaming, brushing, or from a flux wave.
- Preheating station 32 may comprise infrared or convection heaters or a combination of infrared and convection heaters as are well known in the art.
- preheating station 32 is extended as compared with conventional preheating stations, and/or preheating station 32 may be operated at higher than normal temperatures so that the board 20 is heated to higher than normal top side temperatures.
- board 20 will be preheated to a minimum top side temperature of about 66° C.; preferably however, the board will be preheated to a top side temperature in the range of about 100° C.-125° C. or higher.
- the purpose of preheating the board to higher than normal top side temperatures is to increase the time the solder on the board remains molten after the board emerges from the solder wave. The reason for this will become clear from the description following.
- the wave soldering station includes a container of conventional design, indicated generally at 40, for holding a supply of molten solder 42.
- Conventional heating means may be secured to the bottom and/or side walls of container 40 or immersed in the solder to heat and maintain the supply of solder 42 in molten condition.
- a sump and nozzle assembly indicated generally at 44 is disposed interiorly of container 40.
- the sump and nozzle assembly 44 is of conventional design and typically comprises a rounded bottom wall 46, a pair of substantially vertically opposed end walls 48 and 50, and a pair of inclined side walls 52 and 54.
- the upper ends of end walls 48 and 50 and side walls 52 and 54 are spaced from one another to form a narrow elongated rectangular nozzle or slot 56 which extends above the molten solder level in container 40 for a suitable distance e.g. one inch above the molten solder level.
- the sump also includes a pair of adjustable sluice plates 58A, B spaced from the sump side walls 52 and 54 for controlling solder overflow from the nozzle 56, e.g. in accordance with the teachings of U.S. Pat. No. 3,398,873 to Kenneth G. Boynton.
- Completing the soldering station is a variable speed pump (not shown) which communicates through an intake orifice 59 in the lower end of sump and nozzle assembly 44 for pumping solder into the sump where it then rises and overflows the nozzle 56 as a standing solder wave.
- An important feature and critical requirement of the present invention is the ability to relocate excess solder on, and/or remove excess solder from the bottom of the circuit board, and from any interconnections, component leads and/or component bodies carried thereon before the solder can solidify as shorts, icicles and/or bridges. This is accomplished by treating the soldered circuit boards and depending component leads at an excess solder removal station 60. Excess solder removal station 60 follows soldering station 36 immediately in-line and is designed to relocate or blow off excess solder from the board underside before the solder solidifies as shorts, icicles and/or bridges.
- Solder removal station 60 comprises one or more fluid jets, fluid knives, slots, nozzle or the like indicated generally at 62, from which a fluid stream can be directed onto the underside of the board.
- a baffle plate 64 may be disposed under the path of travel of boards 20 at an angle of approximately 45° from the horizontal and serves as a deflector for the fluid stream issuing from the nozzle 62.
- the fluid is pre-heated prior to impinging on the board.
- Fluid flow rate, fluid pressure, and fluid temperature and the time elapsed between circuit board emersion from the solder wave and beginning of contact by the fluid stream may vary widely depending on the board temperature, ambient temperature, melting point of the solder, specific heat of fluid and heat transfer coefficient of fluid to the board, board size and shape, component density, amount of solder deposited and to be removed, conveyor speed, and distance between the soldering station and the excess solder removal station.
- nozzle 62 is disposed proximate the path of travel of the boards. Nozzle 62 of course must be spaced sufficiently below the path of travel of the boards to permit clearance of the longest depending lead, etc.
- Inert gas may be used as the fluid, but preferably the impinging fluid comprises air.
- the fluid may be at ambient temperature preferably however, the fluid is pre-heated to a temperature in the range of about 93° C. to 350° C., preferably about 290° C. to 300° C. (measured at the outlet of nozzle 62).
- the preferred fluid preheat temperature is about 290° C. (measured at the outlet of nozzle 62).
- the fluid stream impinging on still molten solder contained on the underside of the circuit board, the interconnections, and the component leads and/or bodies relocates excess solder on, and/or blasts excess solder from the underside of the board, interconnections, leads, and bodies, and in doing so also minimizes the possibility of solder bridging or icicling or short formation upon solidification.
- FIG. 4 illustrates a preferred form of electrical and pneumatic control means in accordance with the present invention and is particularly adapted to the use of hot air as the fluid stream in accordance with the present invention.
- nozzle 62 is connected via supply line 66 to one side of solenoid actuated valve 68.
- Valve 68 is connected via a line 70 to the outlet of a heater 72 which is adapted to heat air (or other gas) to a desired elevated temperature.
- Valve 68 is actuated by a photoelectric cell 74 connected through suitable relay means 76 to provide a blast of heated air when a printed circuit board 20 passes through the solder wave and the board leading edge interrupts a light beam from light sources 78 disposed above the path of travel of the printed circuit board.
- valve 68 is prevented from closing fully, i.e. so as to allow at least a small flow of heated air through the nozzle so that the nozzle will be maintained at the desired elevated temperature and thus eliminate thermal lag.
- circuit board conveyor 80 of conventional construction.
- the latter comprises a pair of spaced conveyor rails 82 and 84 and suitable drive means (not shown) for carrying a circuit board from the inserting station 22 through the fluxing station 30, wave soldering station 36 and excess solder removal station 60.
- FIG. 5 shows a printed circuit board in the excess solder removal station 60 and illustrates how the hot fluid flow removes molten solder 86 from a circuit board, interconnection and component leads in accordance with the present invention.
- the distance between the point where the circuit board emerges from the solder wave and begins to pass the hot air stream should be in the range of about 19 to 25 cm.
- the present invention has a number of advantages. For one, contacting the underside of a circuit board with a fluid stream in accordance with the present invention has been found to level the solder coating on the board conductors. Moreover, eyelets and unloaded plated through holes may be cleared by the fluid stream. Another advantage is that a solder board may emerge from the system somewhat cooler as compared with conventional mass soldering systems. This latter advantage results primarily from the removal of excess solder which is a major heat sink on conventionally soldered boards. Moreover, the fluid stream, if cooler than the solder on the board, may further speed cooling. Cooling the board facilitates handling of the board subsequent to soldering and also may result in reduced incidence of pad lift in solder-cut-solder systems. Cooling the board also may result in production of solder joints of finer grain.
- one or more banks of heaters similar to construction to the preheaters may be incorporated into the excess solder removal station 60 to extend the time the solder remains molten on the board.
- a minor amount e.g. up to about 20% by weight of liquid droplets may be dispersed in the gas stream, for example, by aspirating the liquid into the gas stream from one or more aspirator nozzles 98 as shown in FIG. 6.
- Aspirator nozzle 98 are connected through conduit means 100 to a supply 102 of the liquid to be dispersed into the gas stream.
- the liquid droplets could be injected into the gas stream using one or more atomizing nozzles.
- the liquid should comprise a material which is compatible with the soldering operation.
- the liquid may comprise a conventional soldering oil or mixture of oils.
- the liquid droplets increase the fluid flow mass of the gas stream and thus in turn may result in an increased rate of solder removal from the board and leads.
- employing a soldering oil as the liquid may facilitate post-soldering clean-up and may also produce shinier solder joints.
- conventional wetting agents and/or fluxing agents may also be dispersed in the fluid stream.
- one or more heater elements may be incorporated integrally with nozzles 62, e.g. as shown in FIGS. 7 to 10 to supplement and/or in place of heater 72.
- the illustrated heater/nozzle combination comprises a manifold in the form of a flat, elongate trapezoidal hollow chamber indicated generally at 104.
- An intake orifice 106 is formed in the short side wall 108 of manifold 104, and is coupled through conduit means (not shown) to a source of pressurized air (not shown).
- One of the long walls 110 of manifold 104 is tapered to form an elongate knife-edged orifice 112. The latter defines the nozzle outlet for directing a fluid stream onto a circuit board in accordance with the present invention.
- Manifold 104 is formed of a heat resistant material such as welded steel plate.
- a heating means such as one or more electrical resistance heater elements 114.
- Electrical resistance heater elements 114 are known in the art and are available commercially. If desired, the manifold walls may be thermally insulated in known manner. In operation the fluid stream is heated by passing over the resistance heaters 114.
- FIGS. 9 and 10 Another and preferred embodiment of heater/nozzle combination is shown in FIGS. 9 and 10.
- the nozzle comprises a generally rectangular block 116.
- Block 116 is formed of a heat resistant material such as steel.
- a plurality of blind holes 118 are formed in one side wall 120 of block 116 and accommodate a like number of cartridge heaters 122.
- Cartridge heaters are well known in the art and are available commercially.
- a hollow chamber 124 is formed in the interior of block 116, and an inlet orifice 125 is formed in one end wall of block 116 and connects hollow chamber 124, through conduit means (not shown) to a source of pressurized air (not shown).
- the nozzle outlet orifice is formed in the side wall 126 opposite the wall 120 in which cartridge heaters 122 are mounted.
- wall 126 is believed so as to form a pair of parallel end edge surfaces 128 formed at the intersection of inclined surfaces 130 with elongate passageway 132.
- the latter communicates with hollow chamber 124.
- Edge surfaces 128 should be substantially flush with one another, and may be substantially knife edges as shown or may have a more substantial width as would be produced by truncating the end of the nozzle outlet along a plane as represented by dotted line 134.
- An interesting feature and advantage of truncating the nozzle outlet to give it a substantial width is that the working gas stream emerging from the nozzle is found to be especially smooth.
- secondary air streams have been observed to form to either side of the working gas stream. These secondary air streams provide fluid insulating sheets for the working gas stream and may also directly assist in relocating or removing solder.
- solder removal station in accordance with the present invention has been illustrated in conjunction with a mass wave soldering system one skilled in the art will recognize that similar advantages may be achieved by employing a solder removal station in conjunction with other types of mass soldering systems such as dip, cascade, jet and drag soldering systems. Still other changes will be obvious to one skilled in the art. Accordingly, it is intended that all matter contained in the above description or shown in the accompanying drawings shall be interpreted in an illustrative and not in a limiting sense.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/918,288 USRE32982E (en) | 1978-04-18 | 1986-10-10 | Mass soldering system |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89749278A | 1978-04-18 | 1978-04-18 | |
US05/951,052 US4401253A (en) | 1978-04-18 | 1978-10-12 | Mass soldering system |
US06/918,288 USRE32982E (en) | 1978-04-18 | 1986-10-10 | Mass soldering system |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/951,052 Continuation US4401253A (en) | 1978-04-18 | 1978-10-12 | Mass soldering system |
US06/409,849 Reissue US4410126A (en) | 1978-10-12 | 1982-08-20 | Mass soldering system |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE32982E true USRE32982E (en) | 1989-07-11 |
Family
ID=27420573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/918,288 Expired - Lifetime USRE32982E (en) | 1978-04-18 | 1986-10-10 | Mass soldering system |
Country Status (1)
Country | Link |
---|---|
US (1) | USRE32982E (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6168065B1 (en) | 1998-02-17 | 2001-01-02 | Soltec B.V. | Movable selective debridging apparatus for debridging soldered joints on printed circuit boards |
US6315189B1 (en) * | 1998-10-13 | 2001-11-13 | Texas Instruments Incorporated | Semiconductor package lead plating method and apparatus |
US20040060960A1 (en) * | 2002-09-30 | 2004-04-01 | Becker Eric Wayne | Selective gas knife for wave soldering |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB738874A (en) * | 1952-05-24 | 1955-10-19 | Rca Corp | Method of soldering an assembly of electrical conductors |
GB967708A (en) * | 1962-08-13 | 1964-08-26 | Ibm | Removal of unwanted alloy from a manufactured article |
GB1181421A (en) * | 1966-02-25 | 1970-02-18 | Lear Siegler Inc | Improvements in and relating to Coating Electrical Conductors |
US3500536A (en) * | 1966-11-17 | 1970-03-17 | Burroughs Corp | Process for finishing solder joints on a circuit board |
US3515330A (en) * | 1968-01-30 | 1970-06-02 | Collins Radio Co | Continuous flow mass pin-to-board hot air soldering device |
US3603329A (en) * | 1968-11-06 | 1971-09-07 | Brown Eng Co Inc | Apparatus for manufacturing printed circuits |
US3605244A (en) * | 1966-04-20 | 1971-09-20 | Electrovert Mfg Co Ltd | Soldering methods and apparatus |
US3705457A (en) * | 1970-11-02 | 1972-12-12 | Electrovert Mfg Co Ltd | Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces |
US3724418A (en) * | 1971-08-20 | 1973-04-03 | Lain J Mc | Solder coating apparatus |
US3726007A (en) * | 1971-02-02 | 1973-04-10 | Martin Marietta Corp | Component side printed circuit soldering |
US3765591A (en) * | 1972-01-19 | 1973-10-16 | Dynamics Corp America | Wave soldering electrical connections |
US3773261A (en) * | 1969-06-13 | 1973-11-20 | North American Rockwell | Material removing device |
US3841557A (en) * | 1972-10-06 | 1974-10-15 | Nat Steel Corp | Coating thickness control and fluid handling |
US3865298A (en) * | 1973-08-14 | 1975-02-11 | Atomic Energy Commission | Solder leveling |
US3948212A (en) * | 1972-03-30 | 1976-04-06 | Robert Bosch G.M.B.H. | Coating apparatus |
GB1446636A (en) * | 1972-12-01 | 1976-08-18 | Xerox Corp | Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon |
GB1478768A (en) * | 1974-10-07 | 1977-07-06 | Electrovert Ltd | Method of and apparatus for applying solder to circuit boards and circuit components |
GB1483257A (en) * | 1973-08-22 | 1977-08-17 | Fortune William S | Air heating apparatus |
US4083323A (en) * | 1975-08-07 | 1978-04-11 | Xerox Corporation | Pneumatic system for solder leveling apparatus |
US4410126A (en) * | 1978-10-12 | 1983-10-18 | Cooper Industries, Inc. | Mass soldering system |
JPH05122650A (en) * | 1991-10-28 | 1993-05-18 | Matsushita Electric Ind Co Ltd | Video signal recording and reproducing device with copy prevention function |
-
1986
- 1986-10-10 US US06/918,288 patent/USRE32982E/en not_active Expired - Lifetime
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB738874A (en) * | 1952-05-24 | 1955-10-19 | Rca Corp | Method of soldering an assembly of electrical conductors |
GB967708A (en) * | 1962-08-13 | 1964-08-26 | Ibm | Removal of unwanted alloy from a manufactured article |
GB1181421A (en) * | 1966-02-25 | 1970-02-18 | Lear Siegler Inc | Improvements in and relating to Coating Electrical Conductors |
US3605244A (en) * | 1966-04-20 | 1971-09-20 | Electrovert Mfg Co Ltd | Soldering methods and apparatus |
US3500536A (en) * | 1966-11-17 | 1970-03-17 | Burroughs Corp | Process for finishing solder joints on a circuit board |
US3515330A (en) * | 1968-01-30 | 1970-06-02 | Collins Radio Co | Continuous flow mass pin-to-board hot air soldering device |
US3603329A (en) * | 1968-11-06 | 1971-09-07 | Brown Eng Co Inc | Apparatus for manufacturing printed circuits |
US3773261A (en) * | 1969-06-13 | 1973-11-20 | North American Rockwell | Material removing device |
US3705457A (en) * | 1970-11-02 | 1972-12-12 | Electrovert Mfg Co Ltd | Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces |
US3726007A (en) * | 1971-02-02 | 1973-04-10 | Martin Marietta Corp | Component side printed circuit soldering |
US3724418A (en) * | 1971-08-20 | 1973-04-03 | Lain J Mc | Solder coating apparatus |
US3765591A (en) * | 1972-01-19 | 1973-10-16 | Dynamics Corp America | Wave soldering electrical connections |
US3948212A (en) * | 1972-03-30 | 1976-04-06 | Robert Bosch G.M.B.H. | Coating apparatus |
US3841557A (en) * | 1972-10-06 | 1974-10-15 | Nat Steel Corp | Coating thickness control and fluid handling |
GB1446636A (en) * | 1972-12-01 | 1976-08-18 | Xerox Corp | Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon |
US3865298A (en) * | 1973-08-14 | 1975-02-11 | Atomic Energy Commission | Solder leveling |
GB1483257A (en) * | 1973-08-22 | 1977-08-17 | Fortune William S | Air heating apparatus |
GB1478768A (en) * | 1974-10-07 | 1977-07-06 | Electrovert Ltd | Method of and apparatus for applying solder to circuit boards and circuit components |
US4083323A (en) * | 1975-08-07 | 1978-04-11 | Xerox Corporation | Pneumatic system for solder leveling apparatus |
US4410126A (en) * | 1978-10-12 | 1983-10-18 | Cooper Industries, Inc. | Mass soldering system |
JPH05122650A (en) * | 1991-10-28 | 1993-05-18 | Matsushita Electric Ind Co Ltd | Video signal recording and reproducing device with copy prevention function |
Non-Patent Citations (2)
Title |
---|
Donovan, IBM Technical Disclosure Bulletin, vol. 5, No. 4, Sep. 1962, pp. 19 20. * |
Donovan, IBM Technical Disclosure Bulletin, vol. 5, No. 4, Sep. 1962, pp. 19-20. |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6168065B1 (en) | 1998-02-17 | 2001-01-02 | Soltec B.V. | Movable selective debridging apparatus for debridging soldered joints on printed circuit boards |
US6315189B1 (en) * | 1998-10-13 | 2001-11-13 | Texas Instruments Incorporated | Semiconductor package lead plating method and apparatus |
US20040060960A1 (en) * | 2002-09-30 | 2004-04-01 | Becker Eric Wayne | Selective gas knife for wave soldering |
US6913183B2 (en) | 2002-09-30 | 2005-07-05 | Speedline Technologies, Inc. | Selective gas knife for wave soldering |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4410126A (en) | Mass soldering system | |
US4401253A (en) | Mass soldering system | |
US4402448A (en) | Mass soldering system | |
EP0193321B1 (en) | Mass soldering system | |
US4566624A (en) | Mass wave soldering system | |
US3865298A (en) | Solder leveling | |
US4451000A (en) | Soldering apparatus exhaust system | |
US4530457A (en) | Wave-soldering of printed circuit boards | |
CA1332890C (en) | Mass soldering system providing an improved fluid blast | |
KR100738499B1 (en) | Soldering method and automatic soldering apparatus | |
CA1248241A (en) | Apparatus and process for the continuous hot tinning of printed circuit boards | |
GB1602779A (en) | Methods and apparatus for mass soldering of printed circuit boards | |
US3825164A (en) | Apparatus for soldering printed circuit cards | |
US4664308A (en) | Mass soldering system providing an oscillating air blast | |
US20020027157A1 (en) | Solder dross removal apparatus and method | |
US3924794A (en) | Solder leveling process | |
USRE32982E (en) | Mass soldering system | |
CA1091102A (en) | Mass wave soldering system | |
CA1096241A (en) | Mass wave soldering system | |
US4697730A (en) | Continuous solder system | |
GB2159084A (en) | Vapour phase soldering | |
EP0163677B1 (en) | Plant for tinning printed circuit boards | |
JPS6257428B2 (en) | ||
EP0147000A1 (en) | Mass wave soldering system I | |
WO1992019416A1 (en) | Solder leveller |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: CONTINENTAL BANK N.A., ILLINOIS Free format text: SECURITY INTEREST;ASSIGNOR:HOLLIS AUTOMATION, INC.;REEL/FRAME:005743/0426 Effective date: 19910217 |
|
AS | Assignment |
Owner name: HOLLIS AUTOMATION CO., A CORPORATION OF DE Free format text: CHANGE OF NAME;ASSIGNOR:HOLLIS AUTOMATION, INC., A CORPORATION OF DE;REEL/FRAME:005805/0377 Effective date: 19910314 |
|
AS | Assignment |
Owner name: HOLLIS AUTOMATION CO. Free format text: CHANGE OF NAME;ASSIGNOR:HOLLIS AUTOMATION, INC.;REEL/FRAME:006066/0640 Effective date: 19910314 |
|
AS | Assignment |
Owner name: HOLLIS AUTOMATION CO. F/K/A HOLLIS AUTOMATION, I Free format text: PARTIAL RELEASE BY SECURED PARTY;ASSIGNOR:CONTINENTAL BANK N.A.;REEL/FRAME:006080/0167 Effective date: 19920303 |
|
AS | Assignment |
Owner name: ELECTROVERT U.S.A. CORP., RHODE ISLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:HOLLIS AUTOMATION CO., A DE CORP.;REEL/FRAME:006066/0212 Effective date: 19920330 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 12 |