GB1446636A - Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon - Google Patents

Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon

Info

Publication number
GB1446636A
GB1446636A GB5524773A GB5524773A GB1446636A GB 1446636 A GB1446636 A GB 1446636A GB 5524773 A GB5524773 A GB 5524773A GB 5524773 A GB5524773 A GB 5524773A GB 1446636 A GB1446636 A GB 1446636A
Authority
GB
United Kingdom
Prior art keywords
solder
board
bath
tank
tanks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5524773A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US311206A external-priority patent/US3893409A/en
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of GB1446636A publication Critical patent/GB1446636A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0002Soldering by means of dipping in a fused salt bath
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

1446636 Soldering XEROX CORP 28 Nov 1973 [1 Dec 1972 (2)] 55247/73 Heading B3R In a method of producing a uniform coating of solder on a printed circuit board, the board, coated with solder, is immersed in a heated bath of substance immiscible with the solder and is vibrated in an orbital motion within the bath which is at a temperature such that the solder on the board is flowable for at least part of the duration of the vibration, the board being then removed from the bath. In an embodiment an indexing plate carries outwardly directed arms each of which has a hook on its underside and the plate is rotatably and vertically movably mounted on a vertical shaft around which are arranged a number of tanks. A frame supporting a printed circuit board is hung on one of the hooks and the plate is indexed so that the board is lowered into each of the tanks in turn. The tanks provide (a) a phosphoric or hydrochloric acid solution dip; (b) a cold water spray; (c) a flux dip; (d) preheating to about 250‹F; (e) a solder spray and vibration in solder immiscible liquid; (f) a water rinse at 150‹F (g) a water spray rinse at 120‹F and (h) a drying air flow. In (e) the board in its frame 8, Fig. 4, is lowered between tracks 19, 20 mounted on a plate 21 supported by rods 22, 23 which extend through the wall of the tank 13 and are connected eccentrically to shafts driven by a motor 24. A bath 34 of heated solder, e.g. 63% tin-37% lead is provided in the bottom of the tank and solder is pumped by pump 26 from the bath 34 through pipes 28 providing nozzles 31 directed downwardly. A heated bath 35 of wax, e.g. polyethylene oxide wax or polyethylene glycol wax or an oil, e.g. peanut oil is provided to float above the solder bath 34. As the board is lowered into the tank 13 solder is sprayed upon both sides from the nozzles 31 and when the board reaches the bottom of the channels 19, 20 a switch is operated to cut off the spray from the nozzles. The motor 24 is energised to cause the board to be vibrated in a circular or elliptical orbital path while in the heated bath 35 for 15-20 sees. The orbital motion is stopped and the board is lifted from the tank or alternatively the orbital motion may be continued as lifting proceeds. The board may be wholly coated with solder before it is immersed in the wax bath and the tanks may be arranged in a row.
GB5524773A 1972-12-01 1973-11-28 Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon Expired GB1446636A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31120572A 1972-12-01 1972-12-01
US311206A US3893409A (en) 1972-12-01 1972-12-01 Apparatus for solder coating printed circuit boards

Publications (1)

Publication Number Publication Date
GB1446636A true GB1446636A (en) 1976-08-18

Family

ID=26977779

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5524773A Expired GB1446636A (en) 1972-12-01 1973-11-28 Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon

Country Status (4)

Country Link
CA (1) CA984522A (en)
FR (1) FR2209274B1 (en)
GB (1) GB1446636A (en)
NL (1) NL7316549A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
US4469716A (en) * 1980-09-09 1984-09-04 Sinter Limited Process for the application of solder on printed circuit boards and process for their placement in and removal from this device
GB2151528A (en) * 1983-12-22 1985-07-24 Peter Philip Andrew Lymn Solder leveller
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
GB2265101A (en) * 1992-03-17 1993-09-22 Sun Ind Coatings Soldering apparatus and method
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2021316A5 (en) * 1969-09-19 1970-07-17 Burroughs Corp Finishing process for welded junctions on a - printed circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
US4469716A (en) * 1980-09-09 1984-09-04 Sinter Limited Process for the application of solder on printed circuit boards and process for their placement in and removal from this device
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
GB2151528A (en) * 1983-12-22 1985-07-24 Peter Philip Andrew Lymn Solder leveller
US4599966A (en) * 1983-12-22 1986-07-15 Lymn Peter A P Solder leveller
GB2265101A (en) * 1992-03-17 1993-09-22 Sun Ind Coatings Soldering apparatus and method
US5361964A (en) * 1992-03-17 1994-11-08 Sun Industrial Coatings Private Limited Soldering apparatus and method
GB2265101B (en) * 1992-03-17 1995-05-10 Sun Ind Coatings Soldering apparatus and method
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards

Also Published As

Publication number Publication date
CA984522A (en) 1976-02-24
FR2209274A1 (en) 1974-06-28
NL7316549A (en) 1974-06-05
FR2209274B1 (en) 1979-05-04

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee