GB738874A - Method of soldering an assembly of electrical conductors - Google Patents

Method of soldering an assembly of electrical conductors

Info

Publication number
GB738874A
GB738874A GB12921/53A GB1292153A GB738874A GB 738874 A GB738874 A GB 738874A GB 12921/53 A GB12921/53 A GB 12921/53A GB 1292153 A GB1292153 A GB 1292153A GB 738874 A GB738874 A GB 738874A
Authority
GB
United Kingdom
Prior art keywords
per cent
soldering
assembly
electrical conductors
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12921/53A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of GB738874A publication Critical patent/GB738874A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • B23K3/0684Solder baths with dipping means with means for oscillating the workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The following alloys may be used for soldering conductors to printed circuits, the latter being of copper or silver: (a) 60 per cent tin, 40 per cent lead; (b) 35 per cent tin, 65 per cent lead; (c) 82.5 per cent cadmium, 17.5 per cent zinc.
GB12921/53A 1952-05-24 1953-05-08 Method of soldering an assembly of electrical conductors Expired GB738874A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US738874XA 1952-05-24 1952-05-24

Publications (1)

Publication Number Publication Date
GB738874A true GB738874A (en) 1955-10-19

Family

ID=22116393

Family Applications (1)

Application Number Title Priority Date Filing Date
GB12921/53A Expired GB738874A (en) 1952-05-24 1953-05-08 Method of soldering an assembly of electrical conductors

Country Status (1)

Country Link
GB (1) GB738874A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3207128A (en) * 1962-04-27 1965-09-21 Western Electric Co Apparatus for coating electrical articles
US3267249A (en) * 1963-09-26 1966-08-16 George J Veth Optical soldering technique and apparatus
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3207128A (en) * 1962-04-27 1965-09-21 Western Electric Co Apparatus for coating electrical articles
US3267249A (en) * 1963-09-26 1966-08-16 George J Veth Optical soldering technique and apparatus
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards

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