GB929836A - Making a semi-conductor device by a process that includes soldering - Google Patents
Making a semi-conductor device by a process that includes solderingInfo
- Publication number
- GB929836A GB929836A GB30937/59A GB3093759A GB929836A GB 929836 A GB929836 A GB 929836A GB 30937/59 A GB30937/59 A GB 30937/59A GB 3093759 A GB3093759 A GB 3093759A GB 929836 A GB929836 A GB 929836A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- making
- conductor device
- includes soldering
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01019—Potassium [K]
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- H01L2924/01025—Manganese [Mn]
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/01051—Antimony [Sb]
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- H01L2924/01058—Cerium [Ce]
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- H01L2924/01073—Tantalum [Ta]
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- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
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- H01L2924/01075—Rhenium [Re]
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- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Solders have the following compositions:- .Silver ............65% .Copper..........27% .Nickel............7.5% .Silicon..........0.5% .and.... .Silver ............65% .Copper..........27% .Nickel............4% .Manganese..........4%
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES59764A DE1176451B (en) | 1958-09-10 | 1958-09-10 | Process for the production of a semiconductor component |
DES62315A DE1170758B (en) | 1958-09-10 | 1959-03-26 | Method for producing a semiconductor device |
DES64746A DE1200102B (en) | 1958-09-10 | 1959-09-04 | Process for the production of a semiconductor component |
Publications (1)
Publication Number | Publication Date |
---|---|
GB929836A true GB929836A (en) | 1963-06-26 |
Family
ID=27212635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB30937/59A Expired GB929836A (en) | 1958-09-10 | 1959-09-10 | Making a semi-conductor device by a process that includes soldering |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH431722A (en) |
DE (3) | DE1176451B (en) |
FR (1) | FR1234698A (en) |
GB (1) | GB929836A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2251725A (en) * | 1990-12-19 | 1992-07-15 | Fuji Electric Co Ltd | Soldered electrodes for semiconducter chips |
CN109175783A (en) * | 2018-10-31 | 2019-01-11 | 无锡日月合金材料有限公司 | A kind of quaternary alloy solder |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003043082A1 (en) * | 2001-11-12 | 2003-05-22 | Sumitomo Special Metals C0., Ltd. | Package for electronic parts, lid thereof, material for the lid and method for producing the lid material |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE460241C (en) * | 1926-07-24 | 1928-07-07 | Deutsche Edelstahlwerke Ag | Lot for rust-proof steels |
DE501792C (en) * | 1926-12-23 | 1930-07-04 | Philips Nv | Soldering tungsten and molybdenum |
DE483275C (en) * | 1927-11-22 | 1929-09-26 | Leopold Rostosky Dr | Alloy for welding non-ferrous metals or their alloys and for brazing heavy metals |
GB671079A (en) * | 1949-11-16 | 1952-04-30 | Richard Chadwick | Improvements in or relating to solders |
DE925987C (en) * | 1952-10-28 | 1955-04-04 | Eugen Dr-Ing Duerrwaechter | Use of silver alloys as hard solder for high vacuum technology |
BE558969A (en) * | 1956-07-04 |
-
1958
- 1958-09-10 DE DES59764A patent/DE1176451B/en active Pending
-
1959
- 1959-03-26 DE DES62315A patent/DE1170758B/en active Pending
- 1959-09-04 DE DES64746A patent/DE1200102B/en active Pending
- 1959-09-09 FR FR804712A patent/FR1234698A/en not_active Expired
- 1959-09-10 GB GB30937/59A patent/GB929836A/en not_active Expired
- 1959-09-10 CH CH7805159A patent/CH431722A/en unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2251725A (en) * | 1990-12-19 | 1992-07-15 | Fuji Electric Co Ltd | Soldered electrodes for semiconducter chips |
US5381038A (en) * | 1990-12-19 | 1995-01-10 | Fuji Electric Co., Ltd. | Semiconductor device having passivation protrusions defining electrical bonding area |
GB2251725B (en) * | 1990-12-19 | 1995-01-25 | Fuji Electric Co Ltd | Semiconductor element including an electrode construction |
CN109175783A (en) * | 2018-10-31 | 2019-01-11 | 无锡日月合金材料有限公司 | A kind of quaternary alloy solder |
Also Published As
Publication number | Publication date |
---|---|
DE1170758B (en) | 1964-05-21 |
FR1234698A (en) | 1960-10-19 |
DE1176451B (en) | 1964-08-20 |
DE1200102B (en) | 1965-09-02 |
CH431722A (en) | 1967-03-15 |
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