FR1234698A - Bonding by welding between an element of molybdenum, tantalum or tungsten and another element of a different metal and welding to effect this bond - Google Patents

Bonding by welding between an element of molybdenum, tantalum or tungsten and another element of a different metal and welding to effect this bond

Info

Publication number
FR1234698A
FR1234698A FR804712A FR804712A FR1234698A FR 1234698 A FR1234698 A FR 1234698A FR 804712 A FR804712 A FR 804712A FR 804712 A FR804712 A FR 804712A FR 1234698 A FR1234698 A FR 1234698A
Authority
FR
France
Prior art keywords
welding
tantalum
molybdenum
tungsten
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR804712A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Application granted granted Critical
Publication of FR1234698A publication Critical patent/FR1234698A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01019—Potassium [K]
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    • H01L2924/01025—Manganese [Mn]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01042—Molybdenum [Mo]
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    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
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    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
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    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
FR804712A 1958-09-10 1959-09-09 Bonding by welding between an element of molybdenum, tantalum or tungsten and another element of a different metal and welding to effect this bond Expired FR1234698A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DES59764A DE1176451B (en) 1958-09-10 1958-09-10 Process for the production of a semiconductor component
DES62315A DE1170758B (en) 1958-09-10 1959-03-26 Method for producing a semiconductor device
DES64746A DE1200102B (en) 1958-09-10 1959-09-04 Process for the production of a semiconductor component

Publications (1)

Publication Number Publication Date
FR1234698A true FR1234698A (en) 1960-10-19

Family

ID=27212635

Family Applications (1)

Application Number Title Priority Date Filing Date
FR804712A Expired FR1234698A (en) 1958-09-10 1959-09-09 Bonding by welding between an element of molybdenum, tantalum or tungsten and another element of a different metal and welding to effect this bond

Country Status (4)

Country Link
CH (1) CH431722A (en)
DE (3) DE1176451B (en)
FR (1) FR1234698A (en)
GB (1) GB929836A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2841940B2 (en) * 1990-12-19 1998-12-24 富士電機株式会社 Semiconductor element
CN1292474C (en) * 2001-11-12 2006-12-27 株式会社新王材料 Package for electronic parts, lid thereof, material for the lid and method for producing the lid material
CN109175783A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of quaternary alloy solder

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE460241C (en) * 1926-07-24 1928-07-07 Deutsche Edelstahlwerke Ag Lot for rust-proof steels
DE501792C (en) * 1926-12-23 1930-07-04 Philips Nv Soldering tungsten and molybdenum
DE483275C (en) * 1927-11-22 1929-09-26 Leopold Rostosky Dr Alloy for welding non-ferrous metals or their alloys and for brazing heavy metals
GB671079A (en) * 1949-11-16 1952-04-30 Richard Chadwick Improvements in or relating to solders
DE925987C (en) * 1952-10-28 1955-04-04 Eugen Dr-Ing Duerrwaechter Use of silver alloys as hard solder for high vacuum technology
BE558969A (en) * 1956-07-04

Also Published As

Publication number Publication date
CH431722A (en) 1967-03-15
DE1176451B (en) 1964-08-20
DE1200102B (en) 1965-09-02
GB929836A (en) 1963-06-26
DE1170758B (en) 1964-05-21

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