BE558969A - - Google Patents

Info

Publication number: BE558969A
Authority: BE; Belgium

Application number

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1956-07-04

Publication of BE558969A publication Critical patent/BE558969A/xx

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Die Bonding (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

BE558969D 1956-07-04 BE558969A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DEP16581A DE1035782B (en)	1956-07-04	1956-07-04	Method for fastening semiconductor arrangements on a carrier with good thermal conductivity

Publications (1)

Publication Number	Publication Date
BE558969A true BE558969A (en)

Family

ID=7366113

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BE558969D BE558969A (en)	1956-07-04

Country Status (5)

Country	Link
BE (1)	BE558969A (en)
CH (1)	CH353459A (en)
DE (1)	DE1035782B (en)
FR (1)	FR1182331A (en)
GB (1)	GB859005A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1106878B (en) *	1958-08-08	1961-05-18	Siemens Ag	Semiconductor device and method for its manufacture
DE1176451B (en) *	1958-09-10	1964-08-20	Siemens Ag	Process for the production of a semiconductor component
DE1110322B (en) *	1958-11-26	1961-07-06	Siemens Ag	Surface rectifier arrangement with a massive cooling element equipped with cooling vanes
DE1205626B (en) *	1959-01-28	1965-11-25	Bosch Gmbh Robert	Semiconductor device
DE1151324B (en) *	1960-04-11	1963-07-11	Elektronik M B H	Process for the production of semiconductor devices
DE1221532B (en) *	1960-07-08	1966-07-21	Licentia Gmbh	Use of a gold-antimony solder to solder parts made of tungsten or Moylbdaen with parts made from the same different material
DE1242758B (en) *	1961-04-07	1967-06-22	Siemens Ag	Semiconductor arrangement, especially for high performance, in which a thin, disk-shaped semiconductor body is attached to a carrier plate
NL129350C (en) *	1962-12-26
GB8522159D0 (en) *	1985-09-06	1985-10-09	Lucas Elect Electron Syst	Connection of electrical component
BRPI0914048B1 (en)	2008-10-14	2019-04-09	Philips Lighting Holding B.V.	SYSTEM FOR REMOVABLELY CONNECTING A FIRST MEMBER TO A SECOND MEMBER, LED LAMP FOR USE IN A SYSTEM AND SOCKET FOR USE IN A SYSTEM
DE102012207470B3 (en) *	2012-05-04	2013-10-10	Infineon Technologies Ag	Method for manufacturing semiconductor module arrangement i.e. converter, involves cooling body such that recess is reduced and composite is developed between semiconductor module and body, where sides exhibit surface of preset size
DE102015115133B3 (en) *	2015-09-09	2016-11-03	Infineon Technologies Ag	Method for connecting a heat sink with at least one circuit carrier by shrinking

0
- BE BE558969D patent/BE558969A/xx unknown
1956
- 1956-07-04 DE DEP16581A patent/DE1035782B/en active Pending
1957
- 1957-07-01 GB GB2069357A patent/GB859005A/en not_active Expired
- 1957-07-02 FR FR1182331D patent/FR1182331A/en not_active Expired
- 1957-07-02 CH CH353459D patent/CH353459A/en unknown

Also Published As

Publication number	Publication date
GB859005A (en)	1961-01-18
CH353459A (en)	1961-04-15
FR1182331A (en)	1959-06-24
DE1035782B (en)	1958-08-07

Publication	Publication Date	Title
AT197311B (en)	1958-04-25
AT202855B (en)	1959-04-10
AT216255B (en)	1961-07-25
AT199361B (en)	1958-08-25
AT202354B (en)	1959-03-10
AT198114B (en)	1958-06-10
AT196732B (en)	1958-03-25
AT194202B (en)	1957-12-27
AT213780B (en)	1961-02-27
AT202279B (en)	1959-02-25
AT195843B (en)	1958-02-25
AT197702B (en)	1958-05-27
AT198677B (en)	1958-07-25
AT199054B (en)	1958-08-11
AT196945B (en)	1958-04-10
AT197107B (en)	1958-04-10
AT197110B (en)	1958-04-10
AT196778B (en)	1958-03-25
AT194662B (en)	1958-01-10
AT198038B (en)	1958-06-10
AT198039B (en)	1958-06-10
AT198051B (en)	1958-06-10
AT196060B (en)	1958-02-25
AT198347B (en)	1958-06-25
AT194974B (en)	1958-01-25