DE501792C - Soldering tungsten and molybdenum - Google Patents

Soldering tungsten and molybdenum

Info

Publication number
DE501792C
DE501792C DEN28030D DEN0028030D DE501792C DE 501792 C DE501792 C DE 501792C DE N28030 D DEN28030 D DE N28030D DE N0028030 D DEN0028030 D DE N0028030D DE 501792 C DE501792 C DE 501792C
Authority
DE
Germany
Prior art keywords
molybdenum
tungsten
solder
soldering
solders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEN28030D
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE501792C publication Critical patent/DE501792C/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent

Description

Die Erfindung bezieht sich auf das Löten von Wolfram und Molybdän.The invention relates to the soldering of tungsten and molybdenum.

Bekanntlich bietet das Löten dieser Metalle erhebliche Schwierigkeiten, insbesondere auch deshalb, weil sich an der Oberfläche der Metalle leicht ein Oxydhäutchen bildet, welches ein gutes Ausfließen des Lots auf der Metalloberfläche verhindert. Man hat infolgedessen schon besondere Flußmittel vorgeschlagen, welche diesen Übelstand verhindern sollen.As is well known, the brazing of these metals presents considerable difficulties, in particular also because an oxide membrane easily forms on the surface of the metal, which prevents the solder from flowing out well on the metal surface. One has as a result, special fluxes have already been proposed to prevent this inconvenience should.

Als Lot für Wolfram und Molybdän werden regelmäßig Lote verwendet, die aus Edelmetallen allein bestehen oder doch stark edelmetallhaltig sind; insbesondere werden hierzu Gold- und Silberlote verwendet.Solders made from precious metals are regularly used as solder for tungsten and molybdenum exist alone or contain a lot of precious metals; in particular, this will be Gold and silver solders used.

Diese Lote verlangen gelernte Arbeiter zu ihrer Verwendung und haben außerdem den Übelstand, daß sie beim Schmelzen Sauerstoff in reichlichem Maße aufnehmen, den sie beim Abkühlen (Spritzen) nicht völlig wieder abgeben. Infolgedessen bietet die Verwendung von Wolfram oder Molybdän in evakuierten oder mit Sondergasen unter sehr niedrigem Druck gefüllten Apparaten (z. B. Röhren, elektrischen Lampen) die Gefahr, daß nachträglich Sauerstoff aus dem Lot frei wird und das Vakuum verschlechtert oder die Gasfüllung verunreinigt.These solders require skilled workers to use them and also have the The problem is that when they melt they absorb oxygen in abundance, which they do not fully recover when they cool down (spraying) hand over. As a result, offers the use of tungsten or molybdenum in evacuated or with special gases under very apparatus filled with low pressure (e.g. tubes, electric lamps) the danger of that subsequently oxygen is released from the solder and the vacuum worsens or the Contaminated gas filling.

Die Erfindung besteht in der Anwendung eines Lots aus Kupfer mit einer reduzierenden Beimischung (z. B. Silicium oder Aluminium, oder beiden) zum Löten von Wolf ram und Molybdän.The invention consists in the use of a solder made of copper with a reducing Admixture (e.g. silicon or aluminum, or both) for soldering tungsten and molybdenum.

Man kann beim Löten mit diesem Lot eines der gewöhnlichen Lotflußmittel, wie Borax oder boraxhaltige Mischungen, benutzen. When soldering with this solder you can use one of the usual solder fluxes, such as Use borax or mixtures containing borax.

Die Anwendung des Kupferlots mit seinen reduzierenden Beimengungen bietet den Vortjeil, daß das Lot nicht nur selbst keinen Sauerstoff abgibt, sondern überdies auch das auf der Metalloberfläche schon gebildete Oxydhäutchen auflöst, so daß die zu lötende Metalloberfläche nicht vorher desoxydiert zu werden braucht.The use of copper solder with its reducing admixtures offers the advantage that the solder not only does not give off oxygen itself, but also that the metal surface dissolves already formed oxide skin, so that the metal surface to be soldered does not need to be deoxidized beforehand.

Die Anwendung des Lots gemäß der Erfindung kann mit besonderem Vorteil beispielsweise beim Befestigen von Wolframkontaktplättchen oder Wolframstäbchen an den Durchführungsdrähten in Senderöhren erfolgen. The use of the solder according to the invention can be particularly advantageous, for example when attaching tungsten contact pads or tungsten rods the lead-through wires in transmission tubes.

Gemäß der Erfindung wird eine besonders feste Lötverbindung erhalten, was nicht ohne weiteres zu erwarten war, da sonst mehrfach für eine gute Lötverbindung der Grundsatz betont worden ist, solche Lötmetalle zu nehmen, die eine Art von oberflächlicher LösungAccording to the invention, a particularly strong soldered connection is obtained, which is not without more was to be expected, otherwise the principle for a good soldered connection several times It has been emphasized to take such solders, which are some kind of superficial solution

in dem zu lötenden Metall ermöglichen bzw. in eine Legierung mit diesem eintreten, was zwischen Kupfer und Wolfram bzw. Molybdän praktisch nicht der Fall ist.enable in the metal to be soldered or enter into an alloy with this, what between copper and tungsten or molybdenum is practically not the case.

Ein weiterer Vorteil der Erfindung ist, daß das Lot wesentlich billiger ist als die sonst zum Löten von Wolfram und Molybdän benutzten Edelmetallote.Another advantage of the invention is that the solder is much cheaper than that precious metal solders otherwise used for soldering tungsten and molybdenum.

Claims (1)

Patentanspruch:Claim: Die Anwendung- eines Lots, bestehend aus Kupfer mit einer reduzierenden Beimischung (z. B. Silicium oder Aluminium, oder beiden), zum Löten von Wolfram und Molybdän.The application of a solder consisting of copper with a reducing admixture (e.g. silicon or aluminum, or both), for soldering tungsten and Molybdenum.
DEN28030D 1926-12-23 1927-11-08 Soldering tungsten and molybdenum Expired DE501792C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL501792X 1926-12-23

Publications (1)

Publication Number Publication Date
DE501792C true DE501792C (en) 1930-07-04

Family

ID=19786797

Family Applications (1)

Application Number Title Priority Date Filing Date
DEN28030D Expired DE501792C (en) 1926-12-23 1927-11-08 Soldering tungsten and molybdenum

Country Status (1)

Country Link
DE (1) DE501792C (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1080833B (en) * 1957-01-12 1960-04-28 Fabrikation Elektrotechnischer Process for producing a solderable glass bushing with molybdenum conductors
DE1176451B (en) * 1958-09-10 1964-08-20 Siemens Ag Process for the production of a semiconductor component
DE19750586B4 (en) * 1997-11-17 2007-05-16 Volkswagen Ag Laser soldering

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1080833B (en) * 1957-01-12 1960-04-28 Fabrikation Elektrotechnischer Process for producing a solderable glass bushing with molybdenum conductors
DE1176451B (en) * 1958-09-10 1964-08-20 Siemens Ag Process for the production of a semiconductor component
DE19750586B4 (en) * 1997-11-17 2007-05-16 Volkswagen Ag Laser soldering

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