JPS58184868U - Excess solder removal device - Google Patents
Excess solder removal deviceInfo
- Publication number
- JPS58184868U JPS58184868U JP8238682U JP8238682U JPS58184868U JP S58184868 U JPS58184868 U JP S58184868U JP 8238682 U JP8238682 U JP 8238682U JP 8238682 U JP8238682 U JP 8238682U JP S58184868 U JPS58184868 U JP S58184868U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- excess
- flow
- molten
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は作業試料の縦断面図、第２図は本考案装置の一
実施例の側面図、第３図はハンダ装置縦断面図、第４図
は本考案装置の動作待状態図である。
１・・・多層セラミック基板、２・・・ハンダ、３・・
・電極、４・・・論理変更用パッド、５・・・半導体チ
ップ、６・・・論理変更用ワイヤ、７・・・搭載領域、
訃・・支持台、９・・・２軸可動台、１０・・・カム駆
動モータ、１１・・・カム、１２・・・バネ、１３・・
・ケージ、１４・・・第１モータ、１５・・・第２モニ
タ、１６・・・ハンダ槽、 、１７・・・留め金、
１８・・・固定ネジ、１９・・・モジュール、２０・・
・試料固定台、２１・・・ＸＹテーブル、２２・・・傾
き調節ネジ、２３・・・顕微鏡、２４・・・顕微鏡支持
台、２５・・・しきり、２６・・・ヒータ、２７・・・
第１スクリユウ、２８・・・第２スクリユウ、２９・・
・溶融ハンダ、３０・・・高さ調節ネジ、３１・・・ハ
ンダ ′ 。
漏出防止蓋、３２・・・固定ピン。Fig. 1 is a longitudinal sectional view of a working sample, Fig. 2 is a side view of an embodiment of the device of the present invention, Fig. 3 is a longitudinal sectional view of the soldering device, and Fig. 4 is a diagram of the device of the present invention in a standby state. . 1...Multilayer ceramic board, 2...Solder, 3...
- Electrode, 4... Pad for logic change, 5... Semiconductor chip, 6... Wire for logic change, 7... Mounting area,
Support stand, 9... 2-axis movable stand, 10... Cam drive motor, 11... Cam, 12... Spring, 13...
・Cage, 14... First motor, 15... Second monitor, 16... Solder bath, , 17... Clasp,
18...Fixing screw, 19...Module, 20...
・Specimen fixing stand, 21...XY table, 22...Tilt adjustment screw, 23...Microscope, 24...Microscope support stand, 25...Shikiri, 26...Heater, 27...
1st screen, 28... 2nd screen, 29...
- Molten solder, 30...Height adjustment screw, 31...Solder'. Leakage prevention lid, 32...Fixing pin.
Claims (1)
を搭載したモジュールから、電子部品または半導体チッ
プを機械的、または熱的に取除いた後、前記電子部品ま
たは半導体チップ位置に対応する前記印刷回路基板の電
極部に残留する過剰ハンダを取り除く過剰ハンダ除去装
置において、溶融ハンダ流を前記過剰ハンダ部に接触さ
せる開口部を有するハンダ槽と、前記溶融ハンダ流を発
生させ前記開口部からの前記溶融ハンダ流の厚みを調整
し、かつ前記電極部のハンダ量を制御する為に前記溶融
ハヅダ流の流速を調整する第１の手段と、前記溶融ハン
ダ流と前記過剰ハンダ部との接触角を調整する第２の手
段と、前記溶融ハンダ流を前記過剰ハンダ部を含む前記
印刷回路基板上に接触させる第３の手段とから成り、前
記開口部より露出した前記溶融ハンダ流を、処理すべき
前記印刷回路基板上の一部分にのみ限定的に接触し過剰
ハンダを溶融吸引し前記電極部のハンダ量を制御するこ
とを特徴とする過剰ハンダ除去装置。After mechanically or thermally removing an electronic component or semiconductor chip from a module having a plurality of electronic components or semiconductor chips mounted on a printed circuit board, the printed circuit corresponding to the position of the electronic component or semiconductor chip is removed. An excess solder removal device for removing excess solder remaining on an electrode portion of a substrate includes a solder tank having an opening that brings a flow of molten solder into contact with the excess solder portion, and a solder tank that generates the flow of molten solder and removes the melted solder from the opening. A first means for adjusting the flow rate of the molten solder flow in order to adjust the thickness of the solder flow and control the amount of solder on the electrode portion, and adjusting the contact angle between the molten solder flow and the excess solder portion. and third means for contacting the molten solder stream onto the printed circuit board containing the excess solder portion, the molten solder stream exposed through the opening being connected to the molten solder stream to be treated. 1. An excess solder removal device that controls the amount of solder on the electrode portion by contacting only a portion of a printed circuit board and melting and suctioning excess solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8238682U JPS58184868U (en) | 1982-06-04 | 1982-06-04 | Excess solder removal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8238682U JPS58184868U (en) | 1982-06-04 | 1982-06-04 | Excess solder removal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58184868U true JPS58184868U (en) | 1983-12-08 |
Family
ID=30091453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8238682U Pending JPS58184868U (en) | 1982-06-04 | 1982-06-04 | Excess solder removal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58184868U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62211991A (en) * | 1986-03-10 | 1987-09-17 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of levelling solder on circuit board |
-
1982
- 1982-06-04 JP JP8238682U patent/JPS58184868U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62211991A (en) * | 1986-03-10 | 1987-09-17 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of levelling solder on circuit board |
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