JPH03120551U - - Google Patents
Info
- Publication number
- JPH03120551U JPH03120551U JP2991590U JP2991590U JPH03120551U JP H03120551 U JPH03120551 U JP H03120551U JP 2991590 U JP2991590 U JP 2991590U JP 2991590 U JP2991590 U JP 2991590U JP H03120551 U JPH03120551 U JP H03120551U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- solder
- molten solder
- transfer part
- workpiece transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
Description
第１図はこの考案の一実施例の半田メツキ装置
の要部概略斜視図、第２図および第３図は半田メ
ツキ動作を説明するワーク移送部の断面図、第４
図はワークの一例としてのオシレータ用気密端子
の平面図、第５図は第４図の気密端子Ａ−Ａ側断
面図、第６図は半田メツキ装置の外観斜視図、第
７図、第８図は従来のワーク移送部の断面図であ
る。
１……第１プレート、２……ワーク、３……ガ
イドレール、４……第２プレート、５……第１エ
アシリンダ、６……半田槽、７……第２エアシリ
ンダ、８……シリンダ取付板、９……ストツパ、
１０……ストツパ受け板、１１……ワーク移送部
、１２……治具位置決め部、１３……フラツクス
槽、１４……半田槽、２０……ワーク（気密端子
）、２３……リード線、Ｐ１……搬送位置、Ｐ２
……半田槽液面、Ｐ３……予備加熱位置。
FIG. 1 is a schematic perspective view of the main parts of a solder plating device according to an embodiment of this invention, FIGS. 2 and 3 are sectional views of a work transfer section for explaining the solder plating operation, and FIG.
The figure is a plan view of an airtight terminal for an oscillator as an example of a workpiece, FIG. 5 is a sectional view taken along the line A-A of the airtight terminal in FIG. The figure is a sectional view of a conventional work transfer section. 1...First plate, 2...Work, 3...Guide rail, 4...Second plate, 5...First air cylinder, 6...Solder bath, 7...Second air cylinder, 8... Cylinder mounting plate, 9...stopper,
10...Stopper receiving plate, 11...Work transfer part, 12...Jig positioning part, 13...Flux bath, 14...Solder bath, 20...Work (airtight terminal), 23...Lead wire, P 1 ...Transportation position, P 2
... Solder tank liquid level, P 3 ... Preheating position.
Claims (1)
田中に浸漬して半田メツキを施す半田メツキ装置
において、 前記ワーク移送部に溶融半田液面から一定の高
さにワークを所定時間保持する位置決め部品と、
溶融半田に浸漬させるワークの深さを一定に保つ
ストツパとを有する予備加熱機構を具備すること
を特徴とする半田メツキ装置。[Scope of Claim for Utility Model Registration] In a soldering device that performs solder plating by immersing a workpiece chucked in a workpiece transfer part in molten solder, the workpiece is placed at a certain height above the molten solder liquid level in the workpiece transfer part. a positioning component that is held for a predetermined time;
1. A solder plating device comprising a preheating mechanism having a stopper that keeps the depth of a work immersed in molten solder constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2991590U JPH03120551U (en) | 1990-03-23 | 1990-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2991590U JPH03120551U (en) | 1990-03-23 | 1990-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120551U true JPH03120551U (en) | 1991-12-11 |
Family
ID=31532659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2991590U Pending JPH03120551U (en) | 1990-03-23 | 1990-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120551U (en) |
-
1990
- 1990-03-23 JP JP2991590U patent/JPH03120551U/ja active Pending
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