JPS59207688A - Method of soldering printed board - Google Patents
Method of soldering printed boardInfo
- Publication number
- JPS59207688A JPS59207688A JP8069383A JP8069383A JPS59207688A JP S59207688 A JPS59207688 A JP S59207688A JP 8069383 A JP8069383 A JP 8069383A JP 8069383 A JP8069383 A JP 8069383A JP S59207688 A JPS59207688 A JP S59207688A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- circuit board
- soldering
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（発明の利用分野）
本発明は電気部品を搭載したプリント基板の自動半田付
に係り、特にプリント基板の半田付に好適な半田付方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to automatic soldering of printed circuit boards on which electrical components are mounted, and particularly to a soldering method suitable for soldering printed circuit boards.
（従来技術）
従来、電気部品を搭載したプリント基板の自動半田付は
、以下３つの自動半田付の方法がある。(Prior Art) Conventionally, there are the following three automatic soldering methods for automatic soldering of printed circuit boards on which electrical components are mounted.
第１から第３図にその工程図を示す。The process diagrams are shown in FIGS. 1 to 3.
第１図において、電気部品を搭載したプリント基板１が
矢印の方向に一定の速度でコンベアで運ばれ、プリント
基板１の半田面が７ラツクス槽２を通過することにより
、フラックス３が塗布され、次にヒーター４によって半
田面が予熱され、やがて半田槽５の半田溶液６に漬けら
れた後、冷却され、半田付が完了するものである。しか
し、この方法だと、第４図に示すように、半田溶液６の
表面に出来た酸化膜８を部品の端子９でひつかくように
して半田槽５より引き上げられるため、第５図に示す如
く、端子９の先端には半田の酸化躾８が付着した状態で
固まる。従って、例えばバックボードのように接栓を沢
山搭載したプリント基板においては、該基板の裏面で端
子間をラッピング ツールで布線を行うものだが、前記
したように半田の酸化膜８の付着が妨害となり、ラッピ
ング ツールがスムースに端子９に入らないと言う欠点
があった。In FIG. 1, a printed circuit board 1 on which electrical components are mounted is conveyed by a conveyor at a constant speed in the direction of the arrow, and the solder surface of the printed circuit board 1 passes through a 7-lux bath 2, whereby a flux 3 is applied. Next, the soldering surface is preheated by a heater 4, and then immersed in a solder solution 6 in a solder bath 5, and then cooled to complete the soldering. However, with this method, as shown in FIG. 4, the oxide film 8 formed on the surface of the solder solution 6 is caught by the terminal 9 of the component and pulled up from the solder bath 5, as shown in FIG. As shown, the oxidized solder 8 adheres to the tip of the terminal 9 and hardens. Therefore, for example, in a printed circuit board with many connectors mounted on a backboard, wiring is carried out between the terminals on the back side of the circuit board using a wrapping tool, but as mentioned above, the adhesion of the solder oxide film 8 interferes with the wiring. Therefore, there was a drawback that the wrapping tool could not enter terminal 9 smoothly.
また、第２図において、第１図で説明したと同じように
７ラツクス塗布から予熱されたプリント基板１は、一旦
半田槽５の上で停止して半田溶液６の表面に垂直に降下
および上昇して冷却され、半田付が完了するものである
。従って、第６図に示す如く、部品の端子９の先端は、
図のような半田による突起１０がみられるが、これは端
子の垂直方向にあるのでラッピング ツールによる布線
作業には問題はない。また、前記した半田の酸化膜も多
少は付着するが、作業上問題にはならない。しかし、こ
の方法だと半田付時にプリント基板１が一旦停止し、該
基板が降下および−Ｆ昇するので、その停止時間のロス
が量産品においては問題となる。In addition, in FIG. 2, the printed circuit board 1, which has been preheated by applying 7 lux in the same way as explained in FIG. Then, the soldering process is completed. Therefore, as shown in FIG. 6, the tip of the terminal 9 of the component is
As shown in the figure, solder protrusions 10 can be seen, but since these are in the vertical direction of the terminals, there is no problem with wiring work using a wrapping tool. Further, although some of the oxide film of the solder described above may adhere, it does not pose a problem in terms of work. However, with this method, the printed circuit board 1 is temporarily stopped during soldering, and then the board is lowered and raised by -F, so the loss of the stopping time becomes a problem in mass-produced products.
また、第３図においては、第１図と同じようにフラック
ス塗布から予熱されたプリント基板１は半田溶液６をポ
ンプ〈図示していない。）によって矢印のような流れに
した噴流式の半田水槽５を通過して冷却され、半［口付
が完了するものである。しかし、この方法だと、第７図
に示す如く、前記部品の端子９の先端に半田溶液６の流
れる方向に添うで半田のフラグ１１が生ずる。これは前
記同様ラッピング ツールによる布線作業を困難にさせ
るばかりか、著しい場合は端子間の半田１ブリッヂを生
ずる等の欠点があった。Further, in FIG. 3, the printed circuit board 1, which has been preheated from flux application in the same manner as in FIG. 1, is pumped with solder solution 6 (not shown). ), it passes through a jet-type solder water tank 5 that flows as shown by the arrow, and is cooled, completing half the soldering process. However, with this method, as shown in FIG. 7, a solder flag 11 is formed at the tip of the terminal 9 of the component along the direction in which the solder solution 6 flows. This not only makes the wiring work using the wrapping tool difficult as described above, but also has disadvantages such as the formation of solder bridges between the terminals in severe cases.
本発明の目的は、半田付の際、上記したように端子の先
端に付着する酸化膜や、半田フラグを防止し、かつプリ
ント基板が搬送時に停止することなく半田付を行うこと
を提供するものである。An object of the present invention is to prevent oxide films and solder flags from adhering to the tips of terminals as described above during soldering, and to perform soldering without stopping the printed circuit board during transportation. It is.
（発明の概要）
本発明は、例えばプリント基板の半田付に於て第２図で
説明したように静止された半田槽の中へ半田付しようと
するプリント基板を垂直方向に下降、および上昇して半
田付を行えば、端子の先端に問題となるフラグや酸化膜
の付着が生じないことは、前述の通りである。従って、
このことから半田槽の半田の流れが、半田付するプリン
ト基板の搬送方向と同方向であれば、半田槽の半田とプ
リント基板は動いてはいるが相対的に静止された状態で
半田付されるのと同じ状態になることを要旨とした発明
である。(Summary of the Invention) For example, in soldering a printed circuit board, the printed circuit board to be soldered is vertically lowered and raised into a stationary solder tank as explained in FIG. As mentioned above, if soldering is performed using the terminal, there will be no flag or oxide film attached to the tip of the terminal. Therefore,
From this, if the flow of solder in the solder bath is in the same direction as the conveyance direction of the printed circuit board to be soldered, the solder in the solder bath and the printed circuit board will be soldered while moving but relatively stationary. The purpose of this invention is to achieve the same state as when
以下、本発明の一実施例を第８図により具体的に説明す
る。Hereinafter, one embodiment of the present invention will be explained in detail with reference to FIG.
図において、プリント基板１が７ラツクス塗布から予熱
されるまでは第１図で説明したと同じであるが、半田槽
５には、図示の如く、プリント基板１がコンベアー（図
示していない。）等によって搬送される方向、即ち矢印
Ａに対し、半田溶液６の流れる方向、矢印Ｂがプリント
基板の半ｆＪ１面で同じ方向になるよう半田槽５の半田
溶液６中に複数個の羽車状の回転体１２を配置、或いは
第９図に示す如く幅広のベルト１３を配置して回転走行
させるか、または第１０に示す如く半田槽５の一端から
対向する他端に通うパイプ１４の一部にポンプ１５を配
置し、該ポンプ１５により半田溶液６を矢印Ｃ１即ちプ
リント基板１の搬送される方向、矢印Ａの速度に一致す
るようコンベアの速度を調整するか、若しくは羽車状の
回転体１２、ベルｌ−１３、ポンプ１５等の速度を調整
し、前記したように全く静止された半田槽の中で半田付
を行うと同じにしたプリント基板の半田付方法である。In the figure, the process from coating the printed circuit board 1 with 7 lux to preheating is the same as that described in FIG. The solder solution 6 in the solder bath 5 has a plurality of impeller shapes so that the flow direction of the solder solution 6, arrow B, is the same direction on the half fJ1 plane of the printed circuit board with respect to the direction in which the solder solution 6 is conveyed, that is, the arrow A. or a wide belt 13 as shown in FIG. A pump 15 is disposed at the pump 15, and the speed of the conveyor is adjusted to match the speed of the arrow A in the direction of the arrow C1, that is, the direction in which the printed circuit board 1 is conveyed, or the speed of the conveyor is adjusted to match the speed of the arrow A. 12, the speed of the bell l-13, the pump 15, etc. is adjusted, and the soldering method is the same as that of soldering in a completely stationary solder tank as described above.
ここで半田溶液６の流れを全面的に行うもよいが、特に
プリント基板１が半田溶液面から離れる位置に於てのみ
該プリント基板と半田溶液の速度を一致させても前記と
同じ作用並びに効果の得られることは言うまでもない。At this point, the solder solution 6 may flow over the entire surface, but even if the speed of the printed circuit board and the solder solution are made to match only in the position where the printed circuit board 1 is away from the solder solution surface, the same effect and effect as described above can be obtained. Needless to say, the benefits of
以上述べたように本発明によれば、従来技術による接栓
端子の先端に半田の酸化膜が付着するとか、半田フラグ
が生ずる等の問題がなくなるばかりか、半田付の際、プ
リント基板の一時停止もなくなり、品質の良い半田付と
作業能率の向上を計る等の効果がある。As described above, according to the present invention, not only does it eliminate the problems of the prior art, such as the adhesion of solder oxide film to the tip of the plug terminal or the generation of solder flags, but also the temporary This eliminates stoppages, improves soldering quality, and improves work efficiency.
第１図から第３図は、従来のプリント基板の半ＩＴＩ付
装置を示す図、第４図から第７図は、第１図から第３図
におけるそれぞれの半田付の状態図、第８図は本発明に
よるプリント基板の半田付方法を示す図、第９図および
第１０図はいずれも本発明による他の実施例を示す図で
ある。
符号の説明
１・・・・プリント基板
３・・・・フラックス
４・・・・ヒーター
６・・・・半田溶液
８・・・・酸化膜
９・・・・端 子
１０・・・・半田突起
１１・・・・半田フラグ
１２・・・・回転体
１３・・・・ベルト
１４・・・・バイブ
１５・・・・ポンプ
第１）凶
が
拓ユ）Ａ
俤３１ハ
ど ｊFigures 1 to 3 are diagrams showing a conventional semi-ITI attachment device for printed circuit boards, Figures 4 to 7 are state diagrams of soldering in Figures 1 to 3, and Figure 8. 9 is a diagram showing a printed circuit board soldering method according to the present invention, and FIGS. 9 and 10 are diagrams showing other embodiments according to the present invention. Explanation of symbols 1...Printed circuit board 3...Flux 4...Heater 6...Solder solution 8...Oxide film 9...Terminal 10...Solder protrusion 11...Solder flag 12...Rotating body 13...Belt 14...Vibrator 15...Pump 1) Bad luck) A 31 Had j
Claims (1)
液の流れる方向および速度を一致させたことを特徴とす
るプリント基板の半田付方法。 ２、半田溶液の流れる方向および速度を該半田溶液の全
体若しくはプリント基板が前記半田溶液面から離れ、部
分だけを該プリント基板の搬送する方向および速度に一
致させることを特徴とする特許請求範囲第１項記載のプ
リント基板の半田付方法。 ３、半田槽の半田溶液中に別車状の回転体を配置したこ
とを特徴とする特許請求範囲第１項記載のプリント基板
の半田付方法。 ４、半田槽の半田溶液中にベルトを配置して、回転走行
させたことを特徴とする特許請求範囲第１項記載のプリ
ント基板の半田付方法。 ５、半田槽の一端から対向する他端に通うパイプの一部
にポンプを配置し、半田溶液を一方向一定速度で流れる
ようにしたことを特徴とする特許請求範囲第１項記載の
プリント基板の半田付方法。[Scope of Claims] 1. A method for soldering a printed circuit board, characterized in that the direction and speed in which the printed circuit board is conveyed are matched with the direction and speed in which the solder solution flows. 2. The flow direction and speed of the solder solution are adjusted such that the entire solder solution or the printed circuit board is separated from the solder solution surface, and only a portion of the solder solution is made to match the direction and speed in which the printed circuit board is conveyed. The method for soldering a printed circuit board according to item 1. 3. The printed circuit board soldering method according to claim 1, characterized in that a separate wheel-shaped rotating body is placed in the solder solution of the solder tank. 4. The method for soldering a printed circuit board according to claim 1, characterized in that a belt is placed in a solder solution in a solder tank and rotated. 5. The printed circuit board according to claim 1, characterized in that a pump is disposed in a part of the pipe leading from one end of the solder tank to the opposite end so that the solder solution flows in one direction at a constant speed. soldering method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8069383A JPS59207688A (en) | 1983-05-11 | 1983-05-11 | Method of soldering printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8069383A JPS59207688A (en) | 1983-05-11 | 1983-05-11 | Method of soldering printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59207688A true JPS59207688A (en) | 1984-11-24 |
Family
ID=13725406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8069383A Pending JPS59207688A (en) | 1983-05-11 | 1983-05-11 | Method of soldering printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59207688A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5281042A (en) * | 1975-12-29 | 1977-07-07 | Tamura Seisakusho Kk | Automatic soldering method and device thereof |
| JPS5661196A (en) * | 1979-10-25 | 1981-05-26 | Matsushita Electric Ind Co Ltd | Soldering method |
-
1983
- 1983-05-11 JP JP8069383A patent/JPS59207688A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5281042A (en) * | 1975-12-29 | 1977-07-07 | Tamura Seisakusho Kk | Automatic soldering method and device thereof |
| JPS5661196A (en) * | 1979-10-25 | 1981-05-26 | Matsushita Electric Ind Co Ltd | Soldering method |
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