JPS6025292A - Method of soldering electronic part - Google Patents
Method of soldering electronic partInfo
- Publication number
- JPS6025292A JPS6025292A JP13310683A JP13310683A JPS6025292A JP S6025292 A JPS6025292 A JP S6025292A JP 13310683 A JP13310683 A JP 13310683A JP 13310683 A JP13310683 A JP 13310683A JP S6025292 A JPS6025292 A JP S6025292A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- soldering
- lead wires
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
技術分野
本発明は、電子部品に対する半田付着方法の改良に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to improvements in methods for attaching solder to electronic components.
背景技術
従来、電子部品に半田を付着するにあたっては、例えば
第１図示の如く必要数のリード線ｌ。BACKGROUND ART Conventionally, when attaching solder to electronic components, a necessary number of lead wires l are used, for example, as shown in FIG.
■・・・を−組にしてテープ２で連結したものを位置決
めパンチ孔３に応じてフラックス槽４内にジャブ付は通
過した後、更に溶融半田槽５内にジャブ伺り通過させる
ことにより半田付けをし、それを各種の素子６に取付は
固定することが行われている。然し、この半田付けでは
溶融半田槽に加えてフラックス槽に重ねてリード線をジ
ャブ付けしなければならず、しかも各槽内で滞留した溶
融半日またはブラシクスにリード線をジャブ付けするた
め各リード線に均一な半田を付着することが困難である
。■ After passing the jab attached into the flux tank 4 according to the positioning punch hole 3 by making a set of - and connecting them with the tape 2, the solder is soldered by passing the jab into the molten solder tank 5. It is practiced to attach and fix it to various elements 6. However, in this soldering, it is necessary to jab the lead wires in a flux bath in addition to the molten solder bath, and in addition, each lead wire must be jabbed to the molten half-day or brass that has accumulated in each bath. It is difficult to apply uniform solder to the surface.
発明の開示
本発明は、半田付は工程の簡略化を図ると共に均一な半
田の付着を可能にする電子部品に対する半田の付着方法
を提供すること、を目的とする。DISCLOSURE OF THE INVENTION An object of the present invention is to provide a method for attaching solder to electronic components, which simplifies the soldering process and enables uniform solder attachment.
即ち、本発明に係る半田の付着方法においては、回転ロ
ーラの周面にリード線またはリードフレームを水平また
は垂直に摺接通過することにより半田付けするものであ
り、そのローラの回転で半田とフシックスとを混合した
ペーストをリード線またはリードフレームに付着するよ
うにされている。That is, in the solder adhesion method according to the present invention, soldering is carried out by sliding a lead wire or a lead frame horizontally or vertically on the circumferential surface of a rotating roller, and the rotation of the roller causes the solder and the solder to separate. A paste mixed with the above is applied to the lead wire or lead frame.
実施例
以下、第２及び３図を参照して説明すれば、次の通りで
ある。An embodiment will be described below with reference to FIGS. 2 and 3.
この実施例では、第１図示と同様に必要数のリード線１
．１・・・を−組にしてテープ２で連結したものを位置
決めパンチ孔３で一定間隔に水平移動する途上半田付け
をすることが行われている。In this embodiment, the required number of lead wires 1 is used as shown in the first diagram.
．． 1, .
その搬送路上には一定速度で回転するローラ１０が配置
され、このローラ１０の周側面と摺接するようリード線
１．１・・・が水平に移動されている。A roller 10 rotating at a constant speed is arranged on the conveyance path, and the lead wires 1.1... are moved horizontally so as to come into sliding contact with the circumferential surface of the roller 10.
そのローラ１０では半田粉末とフラックス、溶剤とを混
合した半田ペース）Ａを回転と共に周面に抄い取って付
着できるものであり、常に新たな半田ペーストＡを周面
に抄い取れるためリード線１．１・・・には均一な量で
付着することができる。The roller 10 can scrape and adhere solder paste (A), which is a mixture of solder powder, flux, and solvent, to the circumferential surface as it rotates, and since new solder paste A can always be scraped onto the circumferential surface, the lead wire 1.1... can be attached in a uniform amount.
この半田付は処理は第３図に示すように、ローラ１０を
半田ペーストＡを収容し横方向（図中の矢印方向）に回
転する半田槽ｌｌ内で縦方向に回転し、その上側に周側
面と摺接させつつテープ２で連結したリード線１．１・
・・を水平に走行することにより行うことができる。そ
のローラ１０は位置合せダイヤル１２．１３でスケール
１４に沿って上下または左右に調整可能なフレーム１５
に軸承支持され、その支軸にモータ１６を連繋装備する
ことにより回転可能に構成されている。また、その周側
面に抄い取る半田ペーストＡは支持フレーム１５に突出
装着したブレード１７で均一厚みに均して供給するよう
にでき、その頂面位置にリード線１．１・・・を水平に
摺接移動すれば確実に半田を均一に付着することができ
る。半田ペーストＡを収容する半田槽１１はモータ（図
示せず）で回転し、その内部に撹拌ブレード１８を挿置
して撹拌すれば表面を硬化せずに常に練られた状態にあ
る半田ペーストＡを供給するようにできる。この半田ペ
ーストＡを付着したリード線１．１・・・に対しては、
セラミックフィルターやレゾネータ−を構成する素子６
を挾み込めばリード線１．１・・・を半田付は固定する
ことができ、接着不良や半田の余剰付着を生じないよう
にできる。As shown in FIG. 3, this soldering process is carried out by rotating the roller 10 vertically in a solder tank 11 containing solder paste A and rotating in the horizontal direction (in the direction of the arrow in the figure), and applying the circumference to the upper side. Lead wire 1.1 connected with tape 2 while making sliding contact with the side surface
... can be done by driving horizontally. The roller 10 is arranged in a frame 15 which can be adjusted vertically or horizontally along the scale 14 with a positioning dial 12.13.
The motor 16 is rotatably supported by a shaft and a motor 16 is connected to the support shaft. In addition, the solder paste A to be scraped onto the peripheral side surface can be supplied to a uniform thickness by a blade 17 protruding from the support frame 15, and the lead wires 1.1... If you slide it into contact with the solder, you can ensure that the solder adheres evenly. The solder tank 11 containing the solder paste A is rotated by a motor (not shown), and by inserting a stirring blade 18 inside the tank 11 and stirring it, the solder paste A is constantly kneaded without hardening the surface. can be supplied. For the lead wires 1.1... to which this solder paste A is attached,
Element 6 that composes a ceramic filter or resonator
By sandwiching the lead wires 1, 1, etc., the soldering can be fixed, and it is possible to prevent poor adhesion and excessive solder adhesion.
なお、上述した実施例ではリード線１．１・・・に半田
を付着する場合を示したが、これを電子部品のリードフ
レームに適用しても同様に均一な半田付けを行うことが
できる。また、上述の実施例では、リード線１．１・・
・を水平に摺接移動させる場合を示したが、水平に限ら
ず、垂直方向或いは斜め等、ローラｌＯの接続方向であ
ればよい。また、半田付けに代えて、ディップタイプの
樹脂モールドや接着剤の塗布にも同様に適用できるもの
である。In the above-described embodiment, the case where solder is applied to the lead wires 1.1, . In addition, in the above-mentioned embodiment, the lead wires 1.1...
Although the case in which the rollers 10 and 10 are moved horizontally in sliding contact is shown, it is not limited to the horizontal direction, and may be in any direction in which the rollers 10 are connected, such as vertically or diagonally. Furthermore, instead of soldering, the present invention can be similarly applied to dip-type resin molding and adhesive application.
発明の効果
以上の如く、本発明に係る半田の付着方法に依れば、常
に新たな半田ペーストを供給してリード線やリードフレ
ームに均一な半田を付着でき、また半田とフラックスと
を混合したペーストを直に付着できるため工程の簡略化
をも可能にするものである。Effects of the Invention As described above, according to the solder adhesion method according to the present invention, it is possible to constantly supply new solder paste to apply uniform solder to lead wires and lead frames, and it is also possible to adhere uniform solder to lead wires and lead frames. Since the paste can be applied directly, the process can also be simplified.
第１図ａ−ｄは従来例に係る半田伺けの各工程を示す説
明図、第２図ａ−ｄは未発ＩＪＩに係る半田付け工程を
示す説明図、第３図は同半田付けに用いる装置の斜視図
である。
１．１・・・：リード線、リードフレーム、１０：回転
ローラ、Ａ：半田ペースト。
第１図
Ｑ。
。、第２図Figures 1 a to d are explanatory diagrams showing each process of soldering according to the conventional example, Figures 2 a to d are explanatory diagrams showing the soldering process related to unoccupied IJI, and Figure 3 is an explanatory diagram showing the soldering process according to the conventional example. It is a perspective view of the apparatus used. 1.1...: Lead wire, lead frame, 10: Rotating roller, A: Solder paste. Figure 1 Q. . , Fig. 2
Claims (1)
するにあたり、半田ペーストを抄い取って回転するロー
ラの周面にリード線またはリードフレームを摺接通過す
るようにしたことを特徴とする電子部品に対する半田付
着方法An electronic component characterized in that when attaching solder to the lead wire or lead frame of the electronic component, the solder paste is removed and the lead wire or lead frame is slid onto the circumferential surface of a rotating roller. Solder attachment method
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13310683A JPS6025292A (en) | 1983-07-21 | 1983-07-21 | Method of soldering electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13310683A JPS6025292A (en) | 1983-07-21 | 1983-07-21 | Method of soldering electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6025292A true JPS6025292A (en) | 1985-02-08 |
Family
ID=15096952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13310683A Pending JPS6025292A (en) | 1983-07-21 | 1983-07-21 | Method of soldering electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025292A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62154765A (en) * | 1985-12-27 | 1987-07-09 | Murata Mfg Co Ltd | Creamy solder feeding method for lead frame |
| JPS62194654A (en) * | 1986-02-20 | 1987-08-27 | Nec Corp | Lead frame |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939467A (en) * | 1982-08-30 | 1984-03-03 | Nichiden Mach Ltd | Coater for creamy solder |
-
1983
- 1983-07-21 JP JP13310683A patent/JPS6025292A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939467A (en) * | 1982-08-30 | 1984-03-03 | Nichiden Mach Ltd | Coater for creamy solder |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62154765A (en) * | 1985-12-27 | 1987-07-09 | Murata Mfg Co Ltd | Creamy solder feeding method for lead frame |
| JPS62194654A (en) * | 1986-02-20 | 1987-08-27 | Nec Corp | Lead frame |
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