JPH04130472U - printed wiring board - Google Patents

Abstract

(57) [Summary] [Purpose] To eliminate the occurrence of soldering defects in lands that require soldering and are placed at the leading edge of a printed wiring board in the direction of movement when soldering is performed using an automatic soldering device. To provide printed wiring boards that can. [Structure] A circuit pattern surface on which a printed circuit pattern 2 and a soldering land 4 for mounting electronic components are formed, and at the leading end 1a in the direction of movement of the printed wiring board when soldering is performed using an automatic soldering device. By providing the preliminary soldering land 5 to which solder adheres, the printed wiring board 1
When the printed wiring board 1 is supplied to an automatic soldering apparatus, the preliminary soldering land 5 provided at the leading end 1a in the direction of movement of the printed wiring board 1 is first dipped into the solder jet surface, and the solder is generated between the preliminary soldering land 5 and the solder 12. The printed wiring board 1 is drawn toward the solder jet surface by the surface tension, and sufficient solder adheres to the land 4a that requires soldering arranged at the tip, thereby eliminating solder defects.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention is a printed wiring board suitable for soldering with automatic soldering equipment. It is related to.

0002

[Conventional technology]

In recent years, printed wiring boards have been widely used in electrical products, etc. Electronic components are soldered to wiring boards using automatic soldering equipment located on the production line. Soldering is performed automatically depending on the location, improving production efficiency.

0003 An example of the conventional printed wiring board mentioned above will be explained below with reference to the drawings. Ru. FIG. 5 shows a plan view of the printed circuit pattern surface of a conventional printed wiring board. . In Fig. 5, 1 is a printed wiring board, 2 is a printed circuit pattern, and 3 is a printed circuit board for electronic components. Lead terminal insertion hole 4 is a hole for mounting electronic components provided around lead terminal insertion hole 3. This is a soldering land.

0004 FIG. 6 is a cross-sectional view showing an outline of an automatic soldering device installed on a production line. 11 is a solder tank, 12 is solder, 13 is a jet port through which the solder 12 is jetted, and 14 is a solder 12 15 is a heater for melting the solder 12. .

[0005] Automatic soldering of the printed wiring board configured as above will be explained. first , the printed wiring board 1 with the electronic components 16 mounted thereon is automatically conveyed by a conveyor (not shown). The solder jet surface of the solder 12 supplied to the dynamic soldering device and jetted from the jet port 13 The printed circuit pattern surface of the printed wiring board 1 is moved while being immersed sequentially from the end. carried out by.

[0006]

[Problem that the idea aims to solve] However, conventional automated soldering machines insert electronic components into printed wiring boards. When soldering is performed on the solder jet surface at the tip of the printed wiring board 1 shown in Apply enough solder to land 4a that requires soldering at the beginning. There was a problem in that the soldering did not stick and poor soldering occurred.

[0007] In view of the above-mentioned conventional problems, the present invention has been developed to perform all soldering using an automatic soldering device. The land that requires soldering is located at the leading edge of the printed wiring board in the direction of movement. To provide a printed wiring board capable of eliminating the occurrence of soldering defects. It was made for the purpose of

[0008]

[Means to solve the problem]

In order to solve the above problems, the printed wiring board of the present invention has a printed circuit pattern and A circuit pattern surface on which a soldering land for attaching sub-components is formed, and which is self-contained. When soldering using a dynamic soldering device, a solder is placed on the leading edge of the printed wiring board in the direction of movement. It has a configuration in which a preliminary soldering land is provided to which solder is attached.

[0009]

[Effect]

The present invention has the above-described configuration and is supplied to an automatic soldering device for printed wiring boards. When the preliminary soldering land provided at the leading edge of the printed circuit board in the direction of travel is first exposed to the solder jet. The solder is immersed into the surface and is marked by the surface tension generated between the pre-soldering land and the solder. The printed circuit board is drawn toward the solder jet surface and requires soldering at the tip. This ensures that sufficient solder adheres to the lands to which solder is applied, thereby eliminating soldering defects.

0010

【Example】

The details of the embodiments of the printed wiring board of the present invention will be explained below with reference to FIGS. 1 to 4. Explain. FIG. 1 shows a printed circuit pattern of a printed wiring board in the first embodiment of the present invention. 2 shows a plan view of the curved surface. In Figure 1, 1 is a printed wiring board, 2 is a printed circuit board, and 2 is a printed wiring board. Circuit pattern, 3 is the lead terminal insertion hole of the electronic component, 4 is the circumference of the lead terminal insertion hole 3 This is a soldering land for mounting electronic components, which is similar to the conventional example. be. In the present invention, printed circuit pattern 2 and solder for mounting electronic components are provided. A circuit pattern surface on which a ground land 4 is formed, and which is formed by an automatic soldering device. When soldering, prevent solder from adhering to the leading end 1a of the printed wiring board 1 in the direction of movement. A soldering land 5 is provided. 6 is the tip of the printed wiring board 1 after soldering This is a perforation for breaking off the end portion 1a.

[0011] The function of the printed wiring board configured as described above will be explained below. Ru. First, as shown in FIG. 2, the printed wiring board 1 is automatically transferred by a conveyor (not shown). When supplied to the dynamic soldering device, the preliminary soldering lamp provided at the tip 1a in the advancing direction The solder land 5 is first dipped into the solder jet surface, and the solder adheres to this preliminary soldering land 5. surface tension of the solder is generated between the land 5 and the solder 12, and the arrow shown in FIG. 2(b) Adsorption force in the direction of mark A is applied to the printed wiring board 1, and the printed wiring board 1 is placed behind the preliminary soldering land 5. Land 4a at the tip that requires soldering to solder the placed electronic component 16 This allows sufficient solder to adhere to the surface and avoids the soldering defects that occur in conventional methods. be.

0012 In addition, Figures 3 and 4 show the pattern of the preliminary soldering land 5, which is triangular. Arrange the shaped lands in the width direction of the printed wiring board, and place all the lands that need to be soldered at the tips. I am trying to cover some parts. Also, by arranging two rows of lands 5, 1 The space a between each land in the row is covered by the width b of the land 5 in the second row. Ru. In addition, the land 5 has a triangular shape that becomes narrower from the front end to the rear end. This is because there are icicle-like protrusions on land 5 and bumps between lands 5 when soldering is completed. This is to prevent the formation of solder lumps. Note that in this example, the Although the shape is triangular, other shapes may be used. Also, land 5 in 2 rows However, due to the size of the printed circuit board, there is no room to arrange the lands 5 in two rows. In this case, it is possible to have only one column, but it is better to make the space a as small as possible. Also , as shown in Figure 4, connect a pattern such as a ground pattern and a preliminary soldering land. It can also serve as both. In this embodiment, the pre-soldering land 5 is made using the perforations 6. Although it is provided on the disposable board, it can also be provided on the main board.

[0013] As described above, according to this embodiment, the printed circuit pattern 2 and the A circuit pattern surface on which a soldering land 4 is formed, and an automatic soldering device When soldering with By providing a preliminary soldering land 5, an automatic soldering device for printed wiring boards 1 can be used. When the printed wiring board 1 is supplied to Dip the solder land 5 into the solder jet surface first, and the solder is generated between the preliminary soldering land 5 and the solder 12. The printed wiring board 1 is drawn toward the solder jet surface by the generated surface tension, and the printed wiring board 1 is pulled toward the tip. Sufficient solder adheres to the placed lands 4a that require soldering, preventing soldering defects. It can be eliminated.

[0014]

[Effect of the idea]

As described above, the present invention provides printed circuit patterns and soldering labels for mounting electronic components. A circuit pattern surface on which a soldering pattern is formed, and which is soldered by an automatic soldering device. Pre-soldering tape that allows solder to adhere to the leading edge of the printed wiring board in the direction of travel. By providing a soldering pad, printed circuit boards can be easily soldered when supplied to automatic soldering equipment. Dip the preliminary soldering land provided at the tip of the wire board in the direction of travel into the solder jet surface first. , a printed wiring board due to the surface tension generated between its preliminary soldering land and the solder. A land that requires soldering is drawn toward the solder jet surface and placed at the tip. Enough solder adheres to the surface, eliminating solder defects and improving solderability. This has the effect of increasing the quality of the product.

[Brief explanation of drawings]

FIG. 1 is a plan view of a printed circuit pattern surface of a printed wiring board in an embodiment of the present invention.

FIG. 2 (a) A cross-sectional view showing a part of the soldering process of a printed wiring board in an embodiment of the present invention. (b) A cross-sectional view showing a part of the soldering process of a printed wiring board in an embodiment of the present invention.

FIG. 3 is a plan view showing a pattern of preliminary soldering lands on a printed wiring board in an embodiment of the present invention.

FIG. 4 is a plan view showing a pattern of preliminary soldering lands on a printed wiring board in another embodiment of the present invention.

[Fig. 5] Plan view of the printed circuit pattern surface of a conventional printed wiring board

[Figure 6] Cross-sectional view showing an overview of automatic soldering equipment

[Fig. 7] Cross-sectional view showing the soldering process part of a conventional printed wiring board

[Explanation of symbols]

1 Printed wiring board 1a The leading edge of the printed wiring board in the direction of movement 2 Printed circuit pattern 3 Lead terminal insertion hole for electronic components 4 Soldering land for mounting electronic components 5 Preliminary soldering land 12 Solder

Claims (1)

[Scope of utility model registration request] Claim 1: A circuit pattern surface on which a printed circuit pattern and a soldering land for attaching electronic components are formed, and the solder is applied to the tip of the printed wiring board in the direction of movement when soldering is performed using an automatic soldering device. 1. A printed wiring board characterized by having a preliminary soldering land to which is attached.