JPS59121894A - Method of mounting parts on printed circuit board - Google Patents
Method of mounting parts on printed circuit boardInfo
- Publication number
- JPS59121894A JPS59121894A JP23176882A JP23176882A JPS59121894A JP S59121894 A JPS59121894 A JP S59121894A JP 23176882 A JP23176882 A JP 23176882A JP 23176882 A JP23176882 A JP 23176882A JP S59121894 A JPS59121894 A JP S59121894A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は印刷配線基板に電気部品等を実装する際、部品
を取υ付けた部品のみのはんだ付けを可能とするもので
、後付は部品の取付く部分は部品実装を行うまでははん
だ付けされない印刷配線基板への部品の実装方法に関す
るものである。[Detailed Description of the Invention] When mounting electrical components etc. on a printed wiring board, the present invention enables soldering of only the components to which the components are attached. The present invention relates to a method for mounting components onto a printed wiring board in which soldering is not performed until mounting.
従来、印刷配線基板に後付は部品がある場合にははんだ
付は面の当該部分にテープ等を貼る、あるいは当該スル
ーホール部にはんだの付かないピンを挿入するなどして
はんだ槽によるはんだ付は時にはんだが付かないような
工法（以下マスキング工事という）を採っているためテ
ープ等の貼付、剥し、ピンの取付け、取外し等の作業が
必要なため経済的に大きな負担が生じるという欠点があ
った。Conventionally, if there are parts to be retrofitted to a printed wiring board, soldering is done by pasting tape or the like on the relevant part of the surface, or by inserting a non-solder pin into the relevant through-hole part, and soldering using a solder bath. Since it uses a construction method (hereinafter referred to as masking work) that prevents solder from attaching to the surface, it requires work such as pasting and peeling off tape, attaching and removing pins, etc., which has the disadvantage of creating a large economic burden. Ta.
本発明は部品実装部のスルーホールに相当する位置にス
ルーホールのランド径と同じまたは若干大きめに圧痕、
または切れ目により脱落し易いように加工を施したフィ
ルム状のソルダーレジストを印刷配線基板のはんだ面に
貼り付は部品実装時に部品のリードによりスルーホール
を覆っているソルダーレジストを挿入力によシ削除し、
はんだ付けを可能とさせることによシ上記欠点を除去し
異物付着等の無い品質のよい製品を得ると共に経済的効
果の大きな印刷配線基板への部品実装方法を提供するこ
とにある。In the present invention, an indentation is made at a position corresponding to the through hole of the component mounting part with the same or slightly larger diameter than the land of the through hole.
Alternatively, when attaching a film-like solder resist that has been processed so that it easily falls off due to cuts to the solder surface of a printed wiring board, the solder resist that covers the through-holes is removed by the component leads using insertion force during component mounting. death,
It is an object of the present invention to provide a method of mounting components on a printed wiring board that eliminates the above-mentioned drawbacks by making soldering possible, obtains high-quality products free of foreign matter adhesion, and has a large economic effect.
本発明は後付は部品のスルーホール部マスキングエ事を
省く手段として印刷配線基板のはんだ面側に取り付ける
ソルダーレジストを部品取付時の挿入力により部品のリ
ードで容易に脱落できる様、当該スルーホール部に相当
する部分を圧痕または切れ目を施したフィルム状のソル
ダーレジストを用いる事によシ通常マスキングされた状
態のものを部品を取付ける事ではんだ付けを可能とする
。The present invention is designed to eliminate the need for masking the through-hole portions of components in retrofitting, so that the solder resist attached to the solder side of the printed wiring board can be easily removed by the leads of the component by the insertion force when mounting the component. By using a film-like solder resist with indentations or cuts in the corresponding parts, it is possible to solder parts that are normally masked by attaching them.
次に本発明の実施例について図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
本発明による印刷配線基板のスルーホール部の切断面を
示す第１図を参照すると、本発明の一実施例は印刷配線
基板１に設けられたスルーホール２のはんだ面側３にあ
るソルダーレジスト４け、電気部品５取付時の挿入力に
よりリード６の先端で図中下方に押され、あらかじめ施
されているソルダーレジスト４の圧痕部７の部分より脱
落する。Referring to FIG. 1 showing a cross section of a through hole portion of a printed wiring board according to the present invention, one embodiment of the present invention shows a solder resist 4 on a solder side 3 of a through hole 2 provided in a printed wiring board 1. Then, the tip of the lead 6 is pushed downward in the figure by the insertion force when the electrical component 5 is attached, and falls off from the impression portion 7 of the solder resist 4 that has been applied in advance.
尚第２図は部品挿入後、はんだ付けを行ったスルーホー
ル部を示す。Note that FIG. 2 shows the through-hole portion to which soldering was performed after parts were inserted.
本発明は以上説明した様なフィルム状のレジストを使用
することによシ後付部品あるいは一時的に実装部品が入
手できない場合などに必要であったマスキング工事を省
略する事ができると共に、テープ貼り等による糊残りあ
るいはピン挿入によるスルーホールの傷付等の無い良好
な品質を得ることが出来かつ経済的効果が犬である。By using a film-like resist as described above, the present invention makes it possible to omit the masking work that is necessary when retrofitted parts or mounted parts are temporarily unavailable, and also makes it possible to omit the masking work that is required when retrofitted parts or mounted parts are temporarily unavailable. It is possible to obtain good quality without adhesive residue due to etc. or damage to through holes due to pin insertion, etc., and the economical effect is excellent.
第１図は本発明になる印刷配線基板の切断面、第２図は
本発明になる印刷配線基板をはんだ付けした図を示す。
なお図において１・・川・印刷配線基板、２・・・・・
・スルーホール、３・・・・・・はんだ面、４・・・・
・・ソルダーレジスト、訃・・・・・電気部品、６・・
・・・・リード、７・・・・・・圧痕部、８・・・・・
・はんだ、である。FIG. 1 shows a cross section of a printed wiring board according to the invention, and FIG. 2 shows a soldered view of the printed wiring board according to the invention. In the figure, 1...river/printed wiring board, 2...
・Through hole, 3...Solder surface, 4...
...Solder resist, Death...Electrical parts, 6...
...Lead, 7...Indentation part, 8...
・Solder.
Claims (1)
にソルダーレジストを形成し、前記部品のリードが前記
スルーホールを貫挿することにより前記ソルダーレジス
トを除去せし後、前記リード部にはんだ付けすることを
特徴とする印刷配線基板への部品実装方法。To solder electrical components, etc. to through-holes on a printed wiring board, a solder resist is formed on the printed wiring board, and the leads of the component are inserted through the through-holes to remove the solder resist, and then soldered to the lead portions. A method for mounting components on a printed wiring board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23176882A JPS59121894A (en) | 1982-12-27 | 1982-12-27 | Method of mounting parts on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23176882A JPS59121894A (en) | 1982-12-27 | 1982-12-27 | Method of mounting parts on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59121894A true JPS59121894A (en) | 1984-07-14 |
Family
ID=16928719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23176882A Pending JPS59121894A (en) | 1982-12-27 | 1982-12-27 | Method of mounting parts on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121894A (en) |
-
1982
- 1982-12-27 JP JP23176882A patent/JPS59121894A/en active Pending
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