JPS5911699A - Method of soldering printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field The present invention relates to a method for soldering printed circuit boards, and in particular to a soldering method for soldering mounted components to a printed circuit board or for filling through holes for interlayer wiring with solder. O (b) Regarding a method of selectively applying solder by masking undesired parts in the process (b) From the conventional technology, each component is placed on a printed wiring board and dipped in an HD solder bath or brought into contact with the flow surface. Although automatic soldering is practiced, in which parts are passed through and soldered, due to the assembly order in the manufacturing process, in the process of manufacturing a finished printed board, parts or parts that are attached to a specific part of the printed board are By changing the unit, the previous process may be the same, but the subsequent processes may have different specifications.
Sometimes there are parts that will be revised in the final version, parts that need to be installed after being automatically soldered, or parts that you don't want to solder. In such a case, it is very inefficient to apply solder to the entire surface and then remove the solder partially using a solder tip and a cow suction tool.
The method of adhering a side heating sheet having a glaze layer J- on one side to the undesired part for masking and soldering is rejected. These are illustrated in Figures 1 and 2. 1 and 2 are explanatory diagrams of a conventional example, where FIG. 1 is a plan view and FIG. 2 is a sectional view.

In the figure, 1 is a printed circuit board, 2 is a component, 3 is a masking chip 1a, which is the side to be brought into contact with solder, and a part B to be subjected to AVi soldering is a part where no soldering is desired. In this way, you can attach a masking chip to the part where you do not want solder burnout, and contact the bath melted solder from the LD side, and prevent the solder from rising in the part where the masking chip is located.
It is difficult to peel off the tape and it is necessary to peel it off afterwards, which is not only inconvenient in terms of molding cost and material cost but also in terms of work efficiency.In addition, the present invention is designed to solve the problem of adhesiveness and peeling. Originally, the purpose was to partially prevent solder build-up and make the work more efficient, and the purpose of this article is to achieve the above objectives by attaching components to printed wiring boards. (In the process of performing contact soldering on a +-bath-te solder, a wire hole is used in a through-hole that does not cause solder smear due to the contact of the grid/grid wiring board.
! 'iJ diameter Teflon wire is used for soldering.

-I μchi masking is a printed part of the main plow.

B) Embodiment FIGS. 3 and 4 show a plan view and a disconnection circuit 1, respectively, in Shikoku, Shikoku, one of the inventors of the present invention.

The difference from the conventional work shown in FIGS. 1 and 2 is that the through-holes 1b, IC, and ld of the printed circuit board exist in the part B in contrast to the masking chip 3 that masks the part B.

. . . A Teflon wire 4 having approximately the same diameter as the through hole is inserted through the hole.

Note that there are two ways to thread the wires, as shown in the diagram, by connecting the wires and passing them through, or by cutting them and tracing each wire one by one, but it is better to connect the wires to some extent so that it will be easier to remove the wires later. It's easy to do.

In addition, in the soldering process, as in the configuration of the embodiment, a Teflon wire is inserted into the through-hole where soldering is not desired, and after contacting surface 1a of the printed circuit board with the melted solder using an automatic soldering machine, the Teflon wire is inserted into the through hole where soldering is not desired. If you pull it out, only the through-holes that do not require soldering will remain without being filled with solder, so make sure to have as many holes as you need to cover up missing parts in the later process.
That's why.

(e) Effects To the above-mentioned colleagues, + according to the invention, it is possible to very efficiently mask parts where solder burnout is not desired in the process of automatically applying solder to a printed circuit board.

As long as the surface of the Teflon wire is Teflon, it is fine, and wires with copper wire or the like in the core are easier to work with when inserted into holes.

[Brief explanation of drawings]

1 and 2 are explanatory diagrams of a conventional example. FIGS. 1 and 4 are explanatory diagrams of an embodiment of the present invention. In the figure, l is a printed circuit board, 2Vi parts, 3 is a masking chip, 4 is Teflon a, 1a is the side of the printed board that will be in contact with the solder, lb, lc... are 'A' where no soldering is desired, Through hole.

Claims (1)

[Claims] In the process of soldering a printed wiring board with components mounted on it by bringing it into contact with a solder bath, a Teflon wire with approximately the same diameter as the hole is inserted into the through hole of the printed wiring board where soldering is not desired due to the above contact. A method of soldering a printed circuit board, which is characterized by performing soldering through the soldering.