JPH01157763A - Presoldering device for electronic part lead - Google Patents
Presoldering device for electronic part leadInfo
- Publication number
- JPH01157763A JPH01157763A JP31692787A JP31692787A JPH01157763A JP H01157763 A JPH01157763 A JP H01157763A JP 31692787 A JP31692787 A JP 31692787A JP 31692787 A JP31692787 A JP 31692787A JP H01157763 A JPH01157763 A JP H01157763A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tank
- flux
- lead
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 77
- 230000004907 flux Effects 0.000 claims abstract description 44
- 238000005476 soldering Methods 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 abstract description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010931 gold Substances 0.000 abstract description 7
- 229910052737 gold Inorganic materials 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000833 kovar Inorganic materials 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 101100165177 Caenorhabditis elegans bath-15 gene Proteins 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔概 要〕
プリント基板に搭載する電子部品のリードの予備半田付
は装置に関し、
リードに予備半田が充分確実に付着できるのを目的とし
、
予備半田をすべきリードを有する電子部品を搬送手段に
設置し、前記電子部品のリードをフラックスを収容せる
フラックス槽、および溶融半田を収容せる半田槽内を通
過させて連続的に前記電子部品のリードに予備半田付け
をする装置であって、前記搬送手段の移動方向に沿って
フラックス槽と半田槽を組み合わせて二組配設し、第１
組のフラックス槽と半田槽にはそれぞれリードの表面に
メッキされている金属層の除去用フラックスと、前記メ
ッキ金属層の溶融除去用の組成の半田を収容し、続く第
２組のフラックス槽と半田槽にはそれぞれ半田付は用フ
ラックスと、リードの半田付は用の組成の半田を収容し
たことで構成する。[Detailed Description of the Invention] [Summary] Preliminary soldering of the leads of electronic components mounted on a printed circuit board is related to equipment, and the purpose is to ensure that the preliminary solder adheres to the leads sufficiently. The electronic component having the electronic component is placed on a conveyance means, and the lead of the electronic component is passed through a flux tank that stores flux and a solder tank that stores molten solder to continuously pre-solder the lead of the electronic component. The apparatus comprises two sets of flux tanks and solder tanks arranged along the moving direction of the conveying means, a first
The flux tank and solder tank of the set each contain a flux for removing the metal layer plated on the surface of the lead, and a solder having a composition for melting and removing the plated metal layer, and a second set of flux tank and Each of the solder tanks contains flux for soldering and solder having a composition for soldering leads.
本発明はプリント基板に搭載すべき電子部品のリードの
予備半田付は装置に関する。The present invention relates to an apparatus for preliminary soldering of leads of electronic components to be mounted on a printed circuit board.
プリント基板上に設けた電子部品の接続用パッド上に半
導体部品のような電子部品のリードを設置し、前記パッ
ドとリード間を半田付は接続する前に先立って、予め電
子部品のリードに予備半田付けを行う方法が採られてい
る。Place the lead of an electronic component such as a semiconductor component on the connection pad of the electronic component provided on the printed circuit board, and before soldering the pad and the lead, place a spare on the lead of the electronic component in advance. A soldering method is used.
従来の電子部品リードの予備半田付は装置は、第２図に
示すようにチェーンコンベア１を含ム搬送手段に、両端
部が前記したチェーンコンベア１にフック（図示せず）
等を用いて固定された電子部品設置治具２に、リードに
半田付けをすべき電子部品３を搭載し、この治具２をチ
ェーンコンベアと共に所定の方向に移動させている。A conventional pre-soldering device for electronic component leads includes a chain conveyor 1 as shown in FIG.
An electronic component 3 to be soldered to a lead is mounted on an electronic component installation jig 2 fixed using an electronic component installation jig 2, etc., and the jig 2 is moved in a predetermined direction together with a chain conveyor.
そして第３図に示すように、この電子部品を設置した治
具を搭載したチェーンコンベア１は、ポンプによりバブ
リングされているフラックス４が収容されているフラッ
クス槽５、およびポンプにより噴流されている半田６が
収容さている半田槽７の上部を通過する。そして前記し
たチェーンコンベア１がフラックス付着領域８、予備加
熱領域９および半田付は領域１０を通過し、前記した設
置治具の電子部品のリードが各槽内を通過し、自動的に
連続的に該電子部品のリードに予備半田を付着形成して
いた。As shown in FIG. 3, the chain conveyor 1 equipped with the jig in which the electronic components are installed has a flux tank 5 containing flux 4 bubbled by a pump, and solder jetted by the pump. 6 is housed in the solder tank 7. Then, the chain conveyor 1 described above passes through the flux application area 8, the preheating area 9, and the soldering area 10, and the leads of the electronic components of the installation jig described above pass through each tank, automatically and continuously. Preliminary solder was attached to the leads of the electronic component.
ところで従来の予備半田付は装置は、リードの表面に形
成されている金メッキ層を半田槽７内の溶融半田と共に
溶融除去して、後の工程でリードに半田が付着し易くし
ている機能は有るものの、リードに付着される半田層が
充分でない場合があり、後のプリント基板と電子部品を
確実に結合させるリフロー半田付けの時点で、リードと
プリント基板との接続パッドとが、確実に半田によって
結合されないため、高品質なプリント基板が得られない
問題がある。By the way, the function of conventional pre-soldering equipment is to melt and remove the gold plating layer formed on the surface of the lead together with the molten solder in the solder tank 7, making it easier for the solder to adhere to the lead in the later process. However, there are cases where the solder layer attached to the leads is not sufficient, and when reflow soldering is performed to reliably connect the printed circuit board and electronic components, the connection pads between the leads and the printed circuit board are reliably soldered. There is a problem that a high quality printed circuit board cannot be obtained because the bonding is not performed by the bonding process.
本発明は上記した問題点を除去し、予備半田層が確実に
リード線に形成されるようにしたプリント基板の予備半
田付は装置の提供を目的とする。The present invention aims to eliminate the above-mentioned problems and provide an apparatus for pre-soldering a printed circuit board in which a pre-solder layer is reliably formed on the lead wires.
Ｌ記問題点を解決する本発明のプリント基板の予備半田
付は装置は、搬送手段の移動方向に沿ってフラックス槽
と半田槽を組み合わせて二組配設し、第１組のフラック
ス槽と半田槽にはそれぞれリードの表面にメッキされて
いる金属層の除去用フラックスと、前記メッキ金属層の
溶融除去用の組成の半田を収容し、続（第２ｍのフラッ
クス槽と半田槽にはそれぞれ半田付は用フラックスと、
リードの半田付は用の組成の半田を収容したことで構成
する。The apparatus for pre-soldering printed circuit boards of the present invention, which solves the problem described in item L, has two sets of flux tanks and solder tanks combined along the moving direction of the conveyance means, and the first set of flux tanks and solder tanks. Each tank contains a flux for removing the metal layer plated on the surface of the lead and a solder having a composition for melting and removing the plated metal layer. Comes with flux,
Soldering of the leads consists of containing solder of the desired composition.
本発明の半田付は装置は、搬送手段の移動方向に沿って
フラックス槽と半田槽を組み合わせて二組配設し、各半
田槽、各フラックス槽内にそれぞれ予備半田すべきリー
ドに対して、リード表面の金属メッキ層除去用フラック
ス槽、リード表面の金属メッキ層を合金の状態にして溶
融除去できるようにした半田槽、リードの半田付けに適
したフラックスが収容されているフラックス槽、リード
の半田付けに適した半田が収容されている半田槽のよう
に、各々働きの異なるフラックス、および半田を収容し
た槽を設けることで、リード表面の金属メッキ層が確実
に除去され、かつリード表面に確実に半田付けされるよ
うにして、リードに確実に予備半田ができるようにする
。The soldering apparatus of the present invention has two sets of flux tanks and solder tanks arranged along the moving direction of the conveying means, and each lead to be pre-soldered is placed in each solder tank and each flux tank. A flux tank for removing the metal plating layer on the lead surface, a solder tank that melts and removes the metal plating layer on the lead surface into an alloy state, a flux tank containing flux suitable for lead soldering, and a flux tank for removing the metal plating layer on the lead surface. By providing a solder bath containing solder suitable for soldering, the metal plating layer on the lead surface can be reliably removed and the metal plating layer on the lead surface can be removed. To ensure soldering and to ensure that preliminary solder is applied to the leads.
以下、図面を用いながら本発明の一実施例につき詳細に
説明する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図は本発明の装置の概略図である。FIG. 1 is a schematic diagram of the apparatus of the invention.
図示するように矢印Ａに示す方向に沿って移動するチェ
ーンコンベア１１の下部には、矢印の方向に沿って第１
のフラックス槽１２、第１の半田槽１３、第２のフラッ
クス槽１４、第２の半田槽１５が設置され、フラックス
槽１２．１４の各々はモータ等を用いて槽内の液体をバ
ブリングさせ、泡１６をたてた状態にしている。As shown in the figure, at the bottom of the chain conveyor 11 moving along the direction shown by arrow A, there is a first belt along the direction of the arrow.
A flux tank 12, a first solder tank 13, a second flux tank 14, and a second solder tank 15 are installed, and each of the flux tanks 12 and 14 uses a motor or the like to bubble the liquid in the tank. It is in a state where bubbles 16 are formed.
また半田槽１３はモータにより半田を噴流させ、半田槽
１５内の半田は噴流させない状態として静止の状態に保
つ。Further, the solder tank 13 is driven by a motor to jet solder, and the solder in the solder tank 15 is maintained in a stationary state without jetting.
前記した第１のフラックス槽１２内にはリードの表面に
形成されている金層が除去されやすい状態にする組成の
フラックスが収容されている。The first flux tank 12 described above contains a flux having a composition that makes it easy to remove the gold layer formed on the surface of the lead.
また第１の半田槽１３内にはリードの表面の金メッキ層
が溶融半田と共に除去され得るような組成の半田を収容
する。Further, the first solder tank 13 contains solder having a composition such that the gold plating layer on the surface of the lead can be removed together with the molten solder.
更に第２のフラックス槽１４内にはリードに半田付けを
行い易くするための組成のフラツクスが収容されている
。Further, the second flux tank 14 contains a flux having a composition to facilitate soldering to the leads.
更に第２の半田槽１５内にはリードに半田メッキをする
ための組成を有する半田が収容されている。Further, the second solder tank 15 contains solder having a composition for solder plating the leads.
このような本発明の装置の各種１２．１３．１４．１５
を通過したリードの状態を説明すると、まず第１図のフ
ラックス槽１２を通過したり一ド１２Ａはその表面が次
の槽１３内にリードが入った時にその表面の金メッキ層
が容易に除去できるような状態に成っており、第１の半
田槽１３を通過したり一ド１３Ａは噴流する半田１６に
より表面の金メッキ層１７が洗われて除去された状態に
成っており、第２のフラックス槽１４を通過したり一ド
１４Ａは表面に半田が付着し易いフラックス層１８が形
成されており、更に第２の浸漬式の半田槽１５を通過し
たり一ド１５Ａは、リードの材質のコバールと半田槽内
の錫との間で合金１９を形成し、この合金１９に半田槽
１５内の半田層２０が所定の厚さで付着するようになる
。Various types of such devices of the present invention 12.13.14.15
To explain the state of the lead that has passed through the flux tank 12 in FIG. After passing through the first solder bath 13, the gold plating layer 17 on the surface of the solder 13A has been washed away by the jetting solder 16, and the solder 13A passes through the first flux bath 13. The lead 14A that passes through the lead 14 has a flux layer 18 formed on its surface to which solder easily adheres, and the lead 15A that passes through the second immersion type solder bath 15 is made of Kovar, which is the material of the lead. An alloy 19 is formed with the tin in the solder bath, and the solder layer 20 in the solder bath 15 adheres to this alloy 19 to a predetermined thickness.
尚、本実施例の第２の半田槽１５内でリード１５Ａを半
田融液に対して垂直方向に浸漬させて静止するようなギ
ア２１等によるチェーンコンベア１１の搬送手段を設け
ることで、従来の噴流方式の半田槽内を水平方向に移動
させる装置に比較して、リードに均一に且つ確実に半田
層が付着するようになる。In addition, by providing a conveyance means for the chain conveyor 11 using a gear 21 or the like, which allows the leads 15A to be immersed vertically into the solder melt in the second solder tank 15 of this embodiment and to stand still, the conventional method can be improved. Compared to a jet type device that moves horizontally in a solder tank, the solder layer adheres to the leads evenly and reliably.
このようにすれば、リードに予備半田層が確実に付着さ
れることになり、後の工程でリードとプリント基板との
接続パッドとが確実に半田により接続されるので電子部
品を搭載した高信頼度のプリント基板が得られる。In this way, the preliminary solder layer will be reliably attached to the leads, and the leads and the connection pads of the printed circuit board will be reliably connected by solder in the later process, resulting in high reliability when mounting electronic components. A printed circuit board of 100% is obtained.
以上の説明から明らかなように本発明によれば、電子部
品のリードとプリント基板の接続パッドとが確実に接続
された高信頼度のプリント基板が得られる効果がある。As is clear from the above description, the present invention has the effect of providing a highly reliable printed circuit board in which the leads of electronic components and the connection pads of the printed circuit board are reliably connected.
第１図は本発明の装置の構成図、
第２図は従来の装置の要部平面図、
第３図は従来の装置の構成図である。
図において、
１１はチェーンコンベア、１２は第１フラツクス槽、１
２Ａ、 １３Ａ、 １４Ａ、 １５八はリード、１３は
第１半田槽、１４は第２フラツクス槽、１５は第２半田
槽、１６は泡、１６Ａは噴流半田、１７は金メッキ層、
１８はフラックス層、１９は合金層、２０は半田層、２
１はギア、Ａはチェーンコンベアの移動方向を示す矢印
である。FIG. 1 is a block diagram of the device of the present invention, FIG. 2 is a plan view of the main parts of the conventional device, and FIG. 3 is a block diagram of the conventional device. In the figure, 11 is a chain conveyor, 12 is a first flux tank, 1
2A, 13A, 14A, 158 are leads, 13 is a first solder tank, 14 is a second flux tank, 15 is a second solder tank, 16 is a bubble, 16A is a jet solder, 17 is a gold plating layer,
18 is a flux layer, 19 is an alloy layer, 20 is a solder layer, 2
1 is a gear, and A is an arrow indicating the moving direction of the chain conveyor.
Claims (1)
設置し、前記電子部品のリードをフラックスを収容せる
フラックス槽、および溶融半田を収容せる半田槽内を通
過させて連続的に前記電子部品のリードに予備半田付け
をする装置であって、前記搬送手段（１１）の移動方向
に沿ってフラックス槽と半田槽を組み合わせて二組配設
し、第１組のフラックス槽（１２）と半田槽（１３）に
はそれぞれリードの表面にメッキされている金属層の除
去用フラックスと、前記メッキ金属層の溶融除去用の組
成の半田を収容し、続く第２組のフラックス槽（１４）
と半田槽（１５）にはそれぞれ半田付け用フラックスと
、リードの半田付け用の組成の半田を収容したことを特
徴とする電子部品リードの予備半田付け装置。An electronic component having leads to be pre-soldered is placed on a conveying means, and the lead of the electronic component is passed through a flux tank containing flux and a solder tank containing molten solder to continuously solder the electronic component. A device for pre-soldering leads, comprising two sets of a flux tank and a solder tank arranged along the moving direction of the conveying means (11), and a first set of a flux tank (12) and a solder tank. (13) respectively contain flux for removing the metal layer plated on the surface of the lead and solder having a composition for melting and removing the plated metal layer, followed by a second set of flux tanks (14).
and a solder tank (15) respectively contain flux for soldering and solder having a composition for soldering the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31692787A JPH01157763A (en) | 1987-12-14 | 1987-12-14 | Presoldering device for electronic part lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31692787A JPH01157763A (en) | 1987-12-14 | 1987-12-14 | Presoldering device for electronic part lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157763A true JPH01157763A (en) | 1989-06-21 |
Family
ID=18082472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31692787A Pending JPH01157763A (en) | 1987-12-14 | 1987-12-14 | Presoldering device for electronic part lead |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157763A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0524156U (en) * | 1991-09-06 | 1993-03-30 | ソニー株式会社 | Flaxer |
-
1987
- 1987-12-14 JP JP31692787A patent/JPH01157763A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0524156U (en) * | 1991-09-06 | 1993-03-30 | ソニー株式会社 | Flaxer |
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