JPH0524156U - Flaxer - Google Patents

Abstract

(57) [Summary] [Structure] In the fluxer 5 for previously fluxing the article 20 to be soldered, two or more tanks 10A and 10B for accumulating the flux are provided. [Effect] Even if the conveying speed of the product 20 is increased, the flux can be reliably applied to the product 20.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a fluxer for applying flux to a product to be soldered in advance.

[0002]

[Prior Art]

 Normally, when soldering is performed, flux is applied to the parts to be soldered where they are to be soldered. Flux melts at a temperature lower than the melting point of solder, reacts with metal oxides to form slag, and acts to shield the molten metal from air and prevent its oxidation.

FIG. 3 shows an example of a jet soldering apparatus equipped with a fluxer. This soldering apparatus 1 is for soldering electronic components mounted on a printed circuit board to the printed circuit board. In this soldering apparatus 1, reference numeral 2 is a conveyor for conveying an article to be soldered (printed circuit board) to be soldered. The transfer conveyor 2 is composed of two tracks 2a, 2a that are provided in parallel and face each other. The printed circuit board (product to be soldered) is conveyed in a state of being installed between the tracks 2a, 2a. The transport conveyor 2 has an inlet side on the near side and an outlet side on the opposite side, and is inclined so as to be slightly upward from the inlet side to the outlet side. Below the transfer conveyor 2, along the extending direction of the transfer conveyor 2 from the inlet side to the outlet side, the fluxer 5, the warm air heater 6, the preheater 7, the solder bath 8, the cooling fan 9, etc. Are sequentially arranged. With this configuration, the printed board carried into the soldering apparatus 1 from the entrance side of the conveyor 2 is first coated with flux by the fluxer 5 and then fluxed by the warm air heater 6. After being dried by the preheater 7 and then preheated by the preheater 7, soldered in the solder bath 8, cooled by the cooling fan 9 and then carried out and moved to the next step. Becomes

Here, the fluxer 5 includes a flux tank that stores flux, a nozzle that is provided inside the flux tank and that blows up the stored flux upward, and further below the nozzle. It is configured with a foam tube that generates bubbles. The printed circuit board (the product to be soldered) passes over the flux tank so as to gaze over it, and at that time, the flux sprayed from the nozzle is applied to the bottom surface of the printed circuit board.

[0005]

[Problems to be solved by the device]

 By the way, the above-mentioned conventional fluxer has the following problems. That is, the product yield can be increased by increasing the line speed. For this reason, recently, there is a plan to increase the line speed from about 1.5 m to 3 m / s in the jet type soldering apparatus as described above to about 6 m / s. However, when the line speed is increased, there is a problem that the absolute time during which the soldered product is in contact with the flux is shortened. Not only that, since the flux has a relatively high viscosity, it is difficult for the flux to wrap around the entire soldering part that moves in the flux. Adhesion, etc., creates voids, which causes adverse effects such as the flux becoming incomplete.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a fluxer which is effective when applied to a high-speed soldering apparatus.

[0007]

[Means for Solving the Problems]

 The fluxer according to claim 1 is arranged in a preceding stage of a soldering process in a series of soldering lines so as to apply flux to a product to be soldered in advance, a flux tank for storing flux, and an inside of the flux tank. A fluxer having a nozzle for injecting the flux upwardly, the flux tank is constituted by two or more tanks in the extending direction of the soldering line, and In contrast, the nozzle is provided.

A fluxer according to a second aspect is the fluxer according to the first aspect, wherein at least one of the flux tanks stores a flux having a viscosity different from that stored in another flux tank. It is a feature.

[0009]

[Action]

 In the fluxer according to the present invention, the contact time and the frequency of contact with the flux of the soldered product are increased, and the flux coatability is improved. At that time, the above operation can be further enhanced by changing the viscosity of the flux stored in each flux tank.

[0010]

【Example】

 An embodiment of the fluxer of the present invention will be described below with reference to FIG. This embodiment shows an example in which the fluxer according to the present invention is applied to the jet type soldering apparatus as shown in FIG. In FIG. 1, the same components as those shown in FIG. 3 are designated by the same reference numerals. As shown in FIG. 1, the fluxer 5 according to the present embodiment includes flux tanks 10A and 10B provided in two stages in the extending direction of a conveyor (soldering line) 2. These flux tanks 10A and 10B are located immediately below the conveyor 2 and are formed slightly wider than the tracks 2a and 2a of the conveyor 2. Further, these flux tanks 10A and 10B correspond to the inclined conveyor conveyor 2, and the latter flux tank 10B is located slightly above the front flux tank 10A.

Liquid fluxes F1 and F2 are stored in the flux tanks 10A and 10B, respectively. In this embodiment, the flux F1 and the flux F2 have different viscosities, and the flux F2 stored in the latter-stage flux tank 10B is the same as the conventional one, while the flux stored in the front-stage flux tank 10A is the same. The viscosity of F1 is set lower than that of the flux F2.

Foaming tubes 11A and 11B for generating bubbles are provided near the inner bottom surfaces of the flux tanks 10A and 10B, respectively. Further, nozzles 12A and 12B are formed on the tops of the foamed tubes 11A and 11B so as to be upwardly tapered. These nozzles 12A and 12B are also slightly wider than the conveyor 2.

Next, the operation of the fluxer 5 having the above structure will be described. In FIG. 1, reference numeral 20 is a printed board (soldered product) that has been carried on the track 2 a of the carrying conveyor 2. Although not shown, electronic components are already mounted on the printed circuit board 20.

The printed circuit board 20 first passes above the flux tank 10 A in the front stage of the fluxer 5. At this time, the back surface 20b of the printed circuit board 20 comes into contact with the flux F1 jetted from the nozzle 12A slightly above the stored liquid surface of the flux tank 10A, and the flux F1 is applied to the back surface 20b.

Subsequently, the printed circuit board 20 passes above the flux bath 10B in the subsequent stage. As a result, the back surface 20b of the printed circuit board 20 contacts the flux F2 sprayed from the nozzle 12B, and the flux F2 is applied to the back surface 20b.

At this time, since the flux F1 has already been applied to the back surface 20b by passing through the flux tank 10A in the previous stage, the flux F2 is in a so-called overcoated state with respect to the flux F1. Become. In addition, in this case, since the flux F1 is generally lower in viscosity than the general flux F2, the flux F1 can be spread all over the back surface 20b of the printed circuit board 20. Since the flux F1 has a low viscosity, the fixability to the back surface 20b is not so good, but since the flux F2 is immediately overcoated, the flux F2 is eventually applied to the entire back surface 20b.

Therefore, according to the above-mentioned fluxer 5, even when the moving speed of the printed board 20 is high, the flux F2, or at least F1 can be completely applied to the entire back surface 20b of the printed board 20. Become. Therefore, the speed of the transfer conveyor 2, that is, the line speed can be increased without causing any problems in the flux coating work, and the yield of soldered products can be significantly increased.

In the above embodiment, the flux F2 of the latter-stage flux tank 10B is the same as the conventional one, and the flux F1 of the former-stage flux tank 10A is lower in viscosity than the flux F2. No. 5 does not necessarily require that the viscosity of the flux F1 and the viscosity of the flux F2 be different. That is, according to the fluxer 5, the flux F1 may be the same as the flux F2, for example. Even in such a case, the printed circuit board 20 is in contact with the flux twice, and the contact frequency with the flux is simply increased. Therefore, the flux coating property is improved.

In that case, if the contact time of the printed circuit board 20 with respect to the flux is simply extended, one flux tank may be formed to be long in the line direction, and the nozzles provided inside may be formed to be wide in the line direction. Conceivable. However, almost no effect can be obtained with such a configuration. This is because the uncoated portion of the flux once formed when the printed circuit board 20 contacts the flux does not disappear even if the printed circuit board 20 is slightly (temporally) contacted with the flux for a long time. .. In the above-mentioned fluxer 5, since the printed circuit board 20 is coated with the flux F1 in the flux tank 10A (nozzle 12A), then once separated from the flux F1 and again comes into contact with the flux F2 in the flux tank 10B (nozzle 12B). In addition, the flux comes into every corner due to a kind of impact action when the printed substrate 20 comes into contact with the flux.

In the above embodiment, the flux tank 10A and the flux tank 10B are both configured to store the flux. However, for example, the A liquid and the B liquid that act as a flux by being mixed with each other. If there is any, it is possible to store the respective liquids in the flux tanks 10A and 10B, respectively. In that case, the flux is formed on the printed circuit board 20 only when the printed circuit board 20 sequentially passes through the flux tank 10A (solution A) and the flux tank 10B (solution B).

Further, in the above-described embodiment, the flux tank 10A and the flux tank 10B are configured as separate bodies, but as shown in FIG. 2, for example, the inside of one tank body 13 is separated by the partition wall 14 in the line direction. Needless to say, the flux tank 10A and the flux tank 10B may be configured by dividing into front and rear.

Further, in the above-mentioned embodiment, the example in which the flux layer is constituted by two tanks has been described, but the flux tank may be three or more tanks. In that case, the coating property of the flux is further enhanced.

Further, in the embodiment, an example in which the present invention is applied to a fluxer of a jet soldering device has been described, but the fluxer according to the present invention is not limited to this, and all flux coating processes are required. The present invention can be applied to the soldering apparatus or the soldering process described above and has the same effects as described above.

[0024]

[Effect of the device]

 As described above, according to the fluxer of claim 1, the contact frequency of the soldered product with respect to the flux is increased, and even when the soldered product moves at a high speed, the flux is removed from the soldered product. The flux can be completely applied to the entire surface to be applied. Therefore, the line speed related to the soldering process can be increased without causing any problems in the flux application work, and the yield of the soldered products can be significantly increased, which is an excellent effect.

Further, according to the fluxer of the second aspect, the product to be soldered is contacted with the fluxers having different viscosities a plurality of times, whereby the flux coatability can be further enhanced. In particular, the effect can be further enhanced by storing the flux whose viscosity is lower in the front-stage flux tank.

[Brief description of drawings]

FIG. 1 is a side view showing a fluxer according to an embodiment of the present invention together with a soldering line and the like.

FIG. 2 is a side view showing another configuration example of the fluxer according to the present invention.

FIG. 3 is a perspective view showing an example of a soldering device including a fluxer.

[Explanation of symbols]

 2 Transport conveyor (soldering line) 5 Fluxer 10A, 10B Flux tank 12A, 12B Nozzle 20 Printed circuit board (soldered product) F1, F2 Flux

Continuation of the front page (72) Inventor, Yoshihei Hayami, Kogo Giken Co., Ltd. 1 No. 142, Ko Amatsucho, Komatsu City, Ishikawa Prefecture

Claims (2)

[Scope of utility model registration request] 1. A flux tank, which is arranged in a series of soldering lines before a soldering step to pre-coat the soldered product with the flux and which stores the flux,
A fluxer having a nozzle provided inside the flux tank for injecting the flux upward, wherein the flux tank is constituted of two or more tanks in the extending direction of the soldering line, and each of them is provided. A fluxer characterized in that the nozzle is provided for a flux tank. 2. The fluxer according to claim 1, wherein at least one of the flux tanks stores a flux having a viscosity different from that of a flux stored in another flux tank.