JPH0274097A - Soldering method of electronic component lead terminal - Google Patents
Soldering method of electronic component lead terminalInfo
- Publication number
- JPH0274097A JPH0274097A JP22711588A JP22711588A JPH0274097A JP H0274097 A JPH0274097 A JP H0274097A JP 22711588 A JP22711588 A JP 22711588A JP 22711588 A JP22711588 A JP 22711588A JP H0274097 A JPH0274097 A JP H0274097A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- glycerin
- lead terminal
- soldered
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 16
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 56
- 235000011187 glycerol Nutrition 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 abstract description 24
- 230000000694 effects Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
表面実装部品のリード端子をプリント基板等に半田付け
する方法に関し、
リード端子の半田付は不良の発生を防止する方法の提供
を目的とし、
電子部品のパッケージの側面より導出したリード端子を
プリント基板に半田付けするに際し、当該リード端子の
半田付けすべき部分を除く全面にグリセリンを塗布した
後に半田付けを行い、半田付は完了後に前記グリセリン
を洗浄除去するように構成する。[Detailed Description of the Invention] [Summary] Regarding the method of soldering lead terminals of surface mount components to printed circuit boards, etc., the purpose of soldering lead terminals is to provide a method for preventing the occurrence of defects. When soldering the lead terminals led out from the side of the package to the printed circuit board, apply glycerin to the entire surface of the lead terminals except for the parts to be soldered, and then solder, and after soldering is completed, wash off the glycerin. Configure it to do so.
本発明は、表面実装部品のリード端子をプリント基板等
に半田付けする方法に関する。The present invention relates to a method for soldering lead terminals of a surface-mounted component to a printed circuit board or the like.
第３図は従来の半導体部品のＪ形す−ド端子の形状図で
あって、第３図（ａ）は正面図、第３図（ｂ）は要部側
面図を示す。両図において、１は半導体部品のパッケー
ジ、２は帯板状のＪ形す−ド端子を示す。このＪ形す−
ド端子は、互いに内側に湾曲させる形状の時はプリント
基板に実装する場合にその半導体部品の実装面積を少な
くできる効果がある。FIG. 3 is a diagram showing the shape of a conventional J-shaped SD terminal of a semiconductor component, with FIG. 3(a) showing a front view and FIG. 3(b) showing a side view of the main part. In both figures, reference numeral 1 indicates a package for a semiconductor component, and reference numeral 2 indicates a strip-shaped J-shaped terminal. This J-type
When the terminals are shaped so as to be curved inwardly, they have the effect of reducing the mounting area of the semiconductor component when it is mounted on a printed circuit board.
第４図は従来のＪ形す−ド端子の半田付は工程図を示し
、第４図（ａｌは準備完了状態、第４図（ｂ）は正常な
半田付は完了状態、第４図（Ｃ）は異常な半田付は開始
状態、第４図（ｄｌは異常半田付けの途中状態、第４図
ｔｅｌは異常半田付は完了状態をそれぞれ示している。Figure 4 shows a process diagram for soldering a conventional J-type square terminal. C) shows the abnormal soldering in the starting state, FIG. 4 (dl shows the state in the middle of the abnormal soldering, and FIG. 4 tel shows the abnormal soldering in the completed state, respectively.
第４図（ａｌにおいて、３は半田付けを行うプリント基
板、４はプリント基板３の半田付けを行う個所に加工さ
れた銅メツキでその厚みは略３０〜５０−１５は銅メツ
キ４の表面に加工された半田メツキでその厚みは略２０
ｔｔｍｚ ６は半田メツキ５の表面に塗布された半田ペ
ーストでその厚みは略３５０Ｊ！ｒａあり、その半田ペ
ースト６に若干埋め込まれるようにＪ形す−ド端子２の
先端の湾曲部が載置されている。In Figure 4 (al), 3 is a printed circuit board to be soldered, 4 is a copper plating processed on the part of the printed circuit board 3 to be soldered, and the thickness is approximately 30 to 50-15 on the surface of the copper plating 4. The thickness is approximately 20 mm with processed solder plating.
ttmz 6 is solder paste applied to the surface of solder plating 5 and its thickness is approximately 350J! The curved portion of the tip of the J-shaped terminal 2 is placed so as to be slightly embedded in the solder paste 6.
第４図ｆｂｌにおいて、正常な半田付けは第４図ｆａ）
の状態を半田ペースト６と半田メツキ５が略同時に溶融
するように加熱した場合に、Ｊ形す−ド端子２の先端の
湾曲部と銅メツキ４との間に図示する矢印方向に溶融半
田の表面張力が作用して溶着した半田５゛によって完了
する。In Fig. 4 fbl, normal soldering is shown in Fig. 4 fa)
When the solder paste 6 and the solder plating 5 are heated so that they melt almost simultaneously, molten solder flows between the curved part of the tip of the J-shaped terminal 2 and the copper plating 4 in the direction of the arrow shown in the figure. The welding is completed by the solder 5, which is welded by the action of surface tension.
第４図ｆｃｌ〜ｆｅ）は半田付は異常となる場合の経過
を示したもので、第４図（Ｃ１は半田ペースト６が半田
メツキ５より先に溶融し、半田メツキ５が若干遅れて溶
融するように加熱された場合に、溶融した半田ペースト
６に図示する矢印方向に表面張力が作用してＪ形す−ド
端子２に引き上げられる状態を示している。Fig. 4 (fcl to fe) shows the progress when soldering becomes abnormal. The figure shows a state in which when the solder paste 6 is heated as shown in FIG.
第４図（ｄ）は、異常な半田付けは第４図（Ｃ１の状態
から遅れて溶融した半田５”がＪ形す−ド端子２の先端
部に濡れて矢印に示すように上昇する途中状態を示して
いる。Fig. 4(d) shows that abnormal soldering is caused by melted solder 5'' which is delayed from the state shown in Fig. 4 (C1) and wets the tip of the J-shaped terminal 2, rising as shown by the arrow. Indicates the condition.
第４図（ｅ）は、第４図（ｄｌの状態から、Ｊ形す−ド
端子２の先端部に上昇した半田５゛がすべてＪ形す−ド
端子２の上部に吸い上げられ、Ｊ形す−ド端子２の湾曲
部と銅メツキ４との間にギヤツブが発生した異常半田付
は完了状態を示している。この状態を当該技術分野にお
いてはソルダー・オープン・ジヨイント不良、あるいは
単にオーブン障害と呼称している。Figure 4(e) shows that from the state of Figure 4 (dl), all of the solder 5' that has risen to the tip of the J-shaped lead terminal 2 is sucked up to the top of the J-shaped lead terminal 2, and Abnormal soldering in which a gear has occurred between the curved part of the solder terminal 2 and the copper plating 4 indicates a completed state.This state is known in the technical field as a solder open joint defect or simply an oven failure. It is called.
上述のようにＪ形す−ド端子２をプリント基板３上の所
定位置に半田付けする場合には、温度制御が重要なポイ
ントとなりオーブン障害の発生を防止することができな
い問題点がある。As mentioned above, when the J-shaped terminal 2 is soldered to a predetermined position on the printed circuit board 3, temperature control becomes an important point, and there is a problem in that oven failure cannot be prevented.
本発明は上記従来の問題点に鑑みてなされたもので、半
田付は不良の発生を防止できるＪ形す−ド端子の半田付
は方法の提供を目的とする。The present invention has been made in view of the above-mentioned conventional problems, and it is an object of the present invention to provide a method for soldering J-shaped terminals that can prevent the occurrence of soldering defects.
第１図は、本発明の方法をＪ形す−ドに適用した場合で
、Ｊ形す−ド端子にグリセリンを塗布する方法を示す図
、第２図はＪ形す−ド端子をプリント基板に半田付けし
た側面図を示す。半導体装置のパッケージ１の側面より
導出した帯板状のＪ形す−ド端子２をプリント基板３に
半田付けするに際し、当該Ｊ形す−ド端子２の半田付け
すべき湾曲部を除く全面にグリセリン７を塗布した後に
半田付けを行い、半田付は完了後に前記グリセリン７を
洗浄除去するように構成する。Fig. 1 shows a method of applying glycerin to a J-type terminal when the method of the present invention is applied to a J-type terminal, and Fig. 2 shows a method of applying glycerin to a J-type terminal. shows a side view of soldering. When soldering the strip-shaped J-shaped terminal 2 led out from the side surface of the semiconductor device package 1 to the printed circuit board 3, the entire surface of the J-shaped terminal 2 except the curved part to be soldered is soldered. Soldering is performed after applying glycerin 7, and the glycerin 7 is washed and removed after soldering is completed.
帯板状のＪ形す−ド端子２の半田付けすべき湾曲部を除
く全面に塗布されたグリセリン７は半田濡れ性を阻止す
る効果があり、熔融した半田ペーストはＪ形す−ド端子
２の半田付けすべき湾曲部に沿って表面張力の作用によ
り上昇するが、グリセリン７の塗布面を超えて上昇でき
ず、したがって溶融した半田はプリント基板３とＪ形す
−ド端子２の間にとどまり、第２図に示すように正常な
半田付けができる効果がある。The glycerin 7 applied to the entire surface of the strip-shaped J-shaped terminal 2 except for the curved portion to be soldered has the effect of inhibiting solder wettability, and the molten solder paste is applied to the J-shaped terminal 2. The molten solder rises along the curved part to be soldered due to the effect of surface tension, but it cannot rise above the surface coated with glycerin 7, and therefore the molten solder does not rise between the printed circuit board 3 and the J-shaped terminal 2. This has the effect of allowing normal soldering to occur as shown in FIG.
以下本発明の実施例を図面・によって詳述する。 Embodiments of the present invention will be described in detail below with reference to the drawings.
なお、構成、動作の説明を理解し易くするために全図を
通じて同一部分には同一符号を付してその重複説明を省
略する。Note that, in order to make the explanation of the configuration and operation easier to understand, the same parts are given the same reference numerals throughout all the figures, and repeated explanation thereof will be omitted.
第１図は、本発明のＪ形す−ド端子にグリセリンを塗布
する方法を示す図である。図において、７はグリセリン
、８はグリセリン７を満たした容器であって、パッケー
ジｌの側面より導出した帯板状の、Ｊ形す−ド端子の半
田付けすべき湾曲部にグリセリン７が付着しないように
保持して、グリセリン７に浸漬し、Ｊ形す−ド端子２の
半田付けすべき湾曲部以外の全面にグリセリン７を塗布
する。グリセリン７がＪ形す−ド端子２に付着している
領域と付着していない領域との境界点をＰ点で示す。FIG. 1 is a diagram showing a method of applying glycerin to a J-shaped terminal of the present invention. In the figure, 7 is glycerin, 8 is a container filled with glycerin 7, and the glycerin 7 does not adhere to the curved part of the J-shaped square terminal led out from the side of the package L, which is to be soldered. Hold it in the same position and immerse it in glycerin 7, and apply glycerin 7 to the entire surface of the J-shaped terminal 2 other than the curved portion to be soldered. The boundary point between the area where glycerin 7 is attached to the J-shaped terminal 2 and the area where it is not attached is indicated by point P.
第２図は本発明のＪ形す−ド端子をプリント基板に半田
付けした断面図を示す。図において、半田５°は第４図
における半田ペースト６と半田メツキ５とが溶融して形
成されたもので、その上端部はグリセリン７が塗布され
た下端部のＰ点で阻止されている。グリセリン７は具体
的にはＣＪｓ０３等の利用が好ましい。FIG. 2 shows a sectional view of the J-type square terminal of the present invention soldered to a printed circuit board. In the figure, the solder 5° is formed by melting the solder paste 6 and the solder plating 5 in FIG. Specifically, it is preferable to use Glycerin 7 such as CJs03.
このようにして半田付けを完了したプリント基板３は、
洗浄工程で付着しているグリセリン７をすべて除去する
。洗浄剤としては具体的にｌ＋１＋１トリフロルエタン
等の利用が好ましい。The printed circuit board 3 that has been soldered in this way is
All adhering glycerin 7 is removed in the cleaning process. Specifically, it is preferable to use l+1+1 trifluorethane as the cleaning agent.
なお、実施例ではＪ形す−ドを有する半導体部品につい
て説明したが、本発明は他の表面実装部品にも適用でき
ることはいうまでもない。Incidentally, in the embodiment, a semiconductor component having a J-shaped board has been described, but it goes without saying that the present invention can be applied to other surface mount components.
以上の説明から明らかなように本発明によれば、半田付
は時のオーブン障害の発生を防止できるという効果があ
る。As is clear from the above description, according to the present invention, soldering has the effect of preventing the occurrence of oven failures.
第１図は本発明のＪ形す−ド端子にグリセリンを塗布す
る方法を示す図、
第２図は本発明のＪ形す−ド端子をプリント基板に半田
付けした断面図、
第３図は従来の半導体装置のＪ形す−ド端子の形状図、
第４図は従来のＪ形す−ド端子の半田付は工程図を示す
。
第２図において、１はパッケージ、２はＪ形す−ド端子
、３はプリント基板、７はグリセリンをそれぞれ示す。
′１Ａ１１−区
ＣFig. 1 is a diagram showing a method of applying glycerin to the J-shaped terminal of the present invention, Fig. 2 is a cross-sectional view of the J-shaped terminal of the present invention soldered to a printed circuit board, and Fig. 3 is a diagram showing a method of applying glycerin to the J-shaped terminal of the present invention. A diagram showing the shape of a conventional J-type square terminal for a semiconductor device, and FIG. 4 shows a process diagram for soldering a conventional J-type square terminal. In FIG. 2, 1 is a package, 2 is a J-shaped terminal, 3 is a printed circuit board, and 7 is glycerin. '1A11-Ward C
Claims (1)
ド端子（２）をプリント基板（３）に半田付けするに際
し、 当該リード端子（２）の半田付けすべき部分を除く全面
にグリセリン（７）を塗布した後に半田付けを行い、半
田付け完了後に前記グリセリン（７）を洗浄除去するこ
とを特徴とする電子部品のリード端子の半田付け方法。[Claims] When a lead terminal (2) led out from the side surface of an electronic component package (1) is soldered to a printed circuit board (3), the entire surface of the lead terminal (2) excluding the part to be soldered. A method for soldering lead terminals of electronic components, characterized in that soldering is performed after applying glycerin (7) to a lead terminal of an electronic component, and the glycerin (7) is washed and removed after soldering is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22711588A JPH0274097A (en) | 1988-09-09 | 1988-09-09 | Soldering method of electronic component lead terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22711588A JPH0274097A (en) | 1988-09-09 | 1988-09-09 | Soldering method of electronic component lead terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0274097A true JPH0274097A (en) | 1990-03-14 |
Family
ID=16855712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22711588A Pending JPH0274097A (en) | 1988-09-09 | 1988-09-09 | Soldering method of electronic component lead terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0274097A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0605431A1 (en) * | 1991-07-16 | 1994-07-13 | E.I. Du Pont De Nemours And Company | Contact having a mass of reflowable solderable material thereon |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5378065A (en) * | 1976-12-21 | 1978-07-11 | Fujitsu Ltd | Method of connecting external terminal to ic |
| JPS6288398A (en) * | 1985-10-15 | 1987-04-22 | 富士通株式会社 | Soldering of flat package part |
-
1988
- 1988-09-09 JP JP22711588A patent/JPH0274097A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5378065A (en) * | 1976-12-21 | 1978-07-11 | Fujitsu Ltd | Method of connecting external terminal to ic |
| JPS6288398A (en) * | 1985-10-15 | 1987-04-22 | 富士通株式会社 | Soldering of flat package part |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0605431A1 (en) * | 1991-07-16 | 1994-07-13 | E.I. Du Pont De Nemours And Company | Contact having a mass of reflowable solderable material thereon |
| EP0605431A4 (en) * | 1991-07-16 | 1996-07-31 | Du Pont | Contact having a mass of reflowable solderable material thereon. |
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