JPH08293670A - Soldering - Google Patents
SolderingInfo
- Publication number
- JPH08293670A JPH08293670A JP7098637A JP9863795A JPH08293670A JP H08293670 A JPH08293670 A JP H08293670A JP 7098637 A JP7098637 A JP 7098637A JP 9863795 A JP9863795 A JP 9863795A JP H08293670 A JPH08293670 A JP H08293670A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- melting point
- soldering
- component
- solder material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品等のはんだ付
け方法に係り、特に、プリント回路を構成する樹脂基
板、セラミック基板等の基板上に、電子部品等を高品質
ではんだ接続することができるはんだ付け方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of soldering electronic parts and the like, and more particularly, to soldering electronic parts and the like with high quality onto a substrate such as a resin substrate or a ceramic substrate forming a printed circuit. The present invention relates to a soldering method that can be performed.
【０００２】[0002]
【従来の技術】プリント回路基板上に部品をはんだ接続
する場合、接続された接続はんだ継手中にボイド等の欠
陥がないことが望ましい。特に、はんだによる接合が、
電気的接合、機械的強度のみでなく気密性を保持するよ
うな目的を持って行われる場合、接合するはんだ中に発
生するボイドが接合の信頼性に対して重要となり、ボイ
ドの発生を防止するようなはんだ付け方法が従来から工
夫されている。BACKGROUND OF THE INVENTION When soldering components onto a printed circuit board, it is desirable that there be no defects such as voids in the connected solder joints. In particular, soldering is
When the purpose is to maintain not only electrical bonding and mechanical strength but also airtightness, voids generated in the solder to be bonded become important for the reliability of the bonding and prevent the occurrence of voids. Such a soldering method has been devised conventionally.
【０００３】図２は従来技術によるはんだ付け方法を説
明する図である。図２において、１はプリント回路基
板、２は基板側はんだ接続パターン、３ははんだ箔、４
は部品側はんだ接続パターン、５は部品、６は接合はん
だ、７はボイドである。FIG. 2 is a diagram for explaining a conventional soldering method. In FIG. 2, 1 is a printed circuit board, 2 is a board-side solder connection pattern, 3 is a solder foil, and 4 is a solder foil.
Is a component side solder connection pattern, 5 is a component, 6 is a joining solder, and 7 is a void.
【０００４】図２に示すはんだ付け方法は、図２（ａ）
に示すように、プリント回路基板１の基板側はんだ接続
パターン２と、部品５の部品側はんだ接続パターン４と
の間にはんだ箔３を挟んで加熱を行うことによりはんだ
付けを行うものである。加熱により、はんだ箔３が溶融
し、はんだ付け後の状態を示す図２（ｂ）のように、部
品５がプリント回路基板１上に接続される。このとき、
プリント回路基板１と部品５とを接合する接合はんだ６
内にボイド７が形成される。The soldering method shown in FIG. 2 is as shown in FIG.
As shown in, soldering is performed by sandwiching the solder foil 3 between the board-side solder connection pattern 2 of the printed circuit board 1 and the component-side solder connection pattern 4 of the component 5 and heating. By heating, the solder foil 3 is melted, and the component 5 is connected to the printed circuit board 1 as shown in FIG. 2B showing the state after soldering. At this time,
Joint solder 6 for joining the printed circuit board 1 and the component 5
A void 7 is formed inside.
【０００５】このボイドの形成は、はんだ溶融中のはん
だの流動時に巻き込まれた空気、はんだ付け中に発生す
るガスが部品５により蓋をされることになって残ってし
まうために生じるものである。The formation of the voids occurs because the air entrapped during the flow of the solder during the melting of the solder and the gas generated during the soldering are left by being covered by the component 5. .
【０００６】図３は従来技術によるはんだ付け方法の他
の例を説明する図である。図３における符号は図２の場
合と同一である。この従来技術は、図２により説明した
従来技術におけるボイドの発生を防止することのできる
ものである。FIG. 3 is a diagram for explaining another example of the conventional soldering method. Reference numerals in FIG. 3 are the same as those in FIG. This conventional technique can prevent the generation of voids in the conventional technique described with reference to FIG.
【０００７】図３に示す方法は、まず、図３（ａ）に示
すように、プリント回路基板１のはんだ接続パターン２
の上にはんだ箔３を載せ、この状態で１度加熱を行って
図３（ｂ）に示すようにはんだ箔３を加熱溶融させる。
この加熱によっても、はんだの流動時の空気の巻き込
み、ガスの発生を生じるが、溶融した接合はんだ６の上
に部品がないため、密度が小さく軽いガス分は、容易に
はんだ中より抜けることができ、図３（ｂ）に示すよう
に、接合はんだ６内にボイドが残ることはない。In the method shown in FIG. 3, first, as shown in FIG. 3A, the solder connection pattern 2 of the printed circuit board 1 is formed.
The solder foil 3 is placed on top of this, and heating is performed once in this state to heat and melt the solder foil 3 as shown in FIG. 3B.
This heating also causes air entrainment and gas generation when the solder flows, but since there are no parts on the melted joint solder 6, a gas component having a small density and light weight can easily escape from the solder. As a result, voids do not remain in the bonding solder 6 as shown in FIG.
【０００８】このような処理（むかえはんだという）を
実施した後、図３（ｃ）に示すように、接合はんだ６の
上に部品５をセットし再び加熱を行う。これにより、接
合はんだ６が再び加熱溶融されることになり、図３
（ｄ）に示すように、ボイドの発生のないプリント回路
基板１と部品５との接合を行うことができる。After carrying out such a treatment (referred to as "replacement solder"), as shown in FIG. 3 (c), the component 5 is set on the joining solder 6 and heated again. As a result, the joining solder 6 is heated and melted again, and
As shown in (d), it is possible to join the printed circuit board 1 and the component 5 without generation of voids.
【０００９】なお、このようなむかえはんだを実施して
はんだ付けを行う従来技術として、例えば、特開平３−
２０２７８７号公報等に記載された技術が知られてい
る。Incidentally, as a conventional technique for performing such re-soldering and soldering, for example, Japanese Patent Laid-Open No.
The technique described in Japanese Patent No. 202787 is known.
【００１０】[0010]
【発明が解決しようとする課題】前述したむかえはんだ
を実施する従来技術は、はんだ付けによりボイドの発生
のないはんだ接続継手を得るために、むかえはんだ処理
により１度はんだを溶融した後、接続する部品をセット
し再びはんだを溶融する必要がある。このため、この従
来技術は、１つの部品を接続するために、２回の加熱処
理を必要とし、作業時間を多く費やし、また、多数台の
はんだ付け装置を必要とするという問題点を有してい
る。さらに、この従来技術は、プリント回路基板等に耐
熱性を要求するという問題点をも有している。In the prior art for carrying out the above-mentioned change solder, the solder is connected once after the solder is melted by the change solder treatment in order to obtain a solder connection joint without generation of voids by soldering. It is necessary to set the parts and melt the solder again. Therefore, this conventional technique has a problem that two heat treatments are required to connect one component, a lot of working time is required, and a large number of soldering devices are required. ing. Further, this conventional technique also has a problem that the printed circuit board and the like are required to have heat resistance.
【００１１】本発明の目的は、前記従来技術の問題点を
解決し、１回の加熱処理のみでボイドの発生を防止して
信頼性の高いはんだによる接続を行うことができるはん
た付け方法を提供することにある。An object of the present invention is to solve the above-mentioned problems of the prior art and to prevent the occurrence of voids by a single heat treatment and to perform a highly reliable soldering method. To provide.
【００１２】[0012]
【課題を解決するための手段】本発明によれば前記目的
は、接続しようとする２つの部材の相対する接続面に、
未溶融のはんだ材を供給後、加熱を行うことによりはん
だ材を溶融させてはんだ接続を行うはんだ付け方法にお
いて、異なる高さを持ち、異なる融点を持つ少なくとも
２種類のはんだ材を前記接続面に供給し、高い融点を持
つはんだ材により、接続しようとする部品同士の間隔を
一定距離に保ち、かつ、低い融点を持つはんだ材と部材
の一方の側との間に所定の距離の空隙ができるように両
部材を保持し、低い融点を持つはんだ材を溶融させた
後、高い融点を持つはんだ材を溶融させてはんだ付を行
うことにより達成される。According to the invention, the object is to provide a connecting surface of two members to be connected which are opposite to each other.
In a soldering method in which an unmelted solder material is supplied and then heated to melt the solder material for solder connection, at least two kinds of solder materials having different heights and different melting points are provided on the connection surface. A solder material having a high melting point is supplied to maintain a constant distance between the components to be connected, and a gap having a predetermined distance is formed between the solder material having a low melting point and one side of the member. As described above, it is achieved by holding both members, melting the solder material having a low melting point, and then melting the solder material having a high melting point to perform soldering.
【００１３】[0013]
【作用】接続しようとする２つの部材の相対する接続面
であるはんだ接続パターンに供給されるはんだ材は、高
さの異なる溶融温度の異なる２種類のはんだ材であり、
高さの高い溶融温度の高いはんだ材が、接続しようとす
る部材相互の間隔を一定に保持する役割を持つ。加熱を
行うと、まず、高さの低い溶融温度の低いはんだ材が溶
融する。このとき、ボイドの発生の原因となるガスは、
溶融したはんだの表面が接続しようとしている部材によ
り塞がれていないため、はんだ中より容易に排除され
る。加熱を続けると、高さの高い溶融温度の高いはんだ
材が溶融し、２つの部材間の距離が一方の部材の自重に
より小さくなり、上側の部材がボイドのない溶融温度の
低いはんだによる溶融はんだ中に侵入してくることにな
り、接続面全体のはんだ付けを行うことができる。The solder materials supplied to the solder connection patterns, which are the connection surfaces facing each other of the two members to be connected, are two types of solder materials having different heights and different melting temperatures,
The solder material having a high height and a high melting temperature has a role of keeping a constant space between the members to be connected. When heating is performed, first, the solder material having a low height and a low melting temperature is melted. At this time, the gas that causes the generation of voids is
Since the surface of the molten solder is not blocked by the member to be connected, it is more easily removed than in the solder. When heating is continued, the solder material with a high height and a high melting temperature melts, the distance between the two members decreases due to the weight of one member, and the upper member melts with a low melting temperature solder without voids. It will penetrate into the inside, and the entire connection surface can be soldered.
【００１４】本発明は、前述により、１回の加熱工程に
より前述した従来技術のむかえはんだの方法と同様な効
果を得ることが可能となり、継手中にボイド欠陥のない
信頼性の高いはんだ付けを行うことが可能となる。As described above, according to the present invention, it is possible to obtain the same effect as the above-mentioned conventional soldering method by a single heating step, and to perform highly reliable soldering without void defects in the joint. It becomes possible to do.
【００１５】なお、高さの高い溶融温度の高いはんだ材
の高さは、高さの低い溶融温度の低いはんだ材が溶融し
たとき、この溶融はんだと一方の部材とが接しない高さ
が必要である。The height of the solder material having a high melting point and a high melting temperature is required to be such that, when the solder material having a low height and a low melting temperature is melted, the molten solder and one member are not in contact with each other. Is.
【００１６】[0016]
【実施例】以下、本発明によるはんだ付け方法の一実施
例を図面により詳細に説明する。An embodiment of the soldering method according to the present invention will be described in detail below with reference to the drawings.
【００１７】図１は本発明の一実施例によるはんだ付け
方法を説明する図である。図１において、８ははんたチ
ップであり、他の符号は図２の場合と同一である。FIG. 1 is a diagram for explaining a soldering method according to an embodiment of the present invention. In FIG. 1, reference numeral 8 is a solder chip, and other symbols are the same as those in FIG.
【００１８】はんだ接続しようとする２つの部材は、図
１に示すように、プリント回路基板１と部品５とであ
り、部品５は、例えばプリント回路基板１上の他の部品
を密封するための接続部が矩形等の形状を持つもの、あ
るいは、基板自体の放熱等のための接続部が線状の形状
を持つもの等であってよい。As shown in FIG. 1, the two members to be connected by soldering are a printed circuit board 1 and a component 5, and the component 5 is for sealing other components on the printed circuit board 1, for example. The connection portion may have a rectangular shape or the like, or the connection portion for heat dissipation of the substrate itself may have a linear shape.
【００１９】はんだ接続のために使用する２種類のはん
だ材は、はんだ箔３とはんだチップ８とであり、はんだ
箔３は、高さ（厚み）がはんだチップ８より小さく、ま
た、その溶融温度もはんだ箔３より低い組成のものであ
る。従って、はんだチップ８は、はんだ箔３よりも融点
が高い組成で構成され、はんだ箔３よりも厚い寸法とな
っている。The two types of solder materials used for solder connection are the solder foil 3 and the solder chip 8. The solder foil 3 has a height (thickness) smaller than that of the solder chip 8 and its melting temperature. Also has a lower composition than the solder foil 3. Therefore, the solder chip 8 is composed of a composition having a melting point higher than that of the solder foil 3, and has a dimension thicker than the solder foil 3.
【００２０】まず、図１（ａ）に示すように、はんだ箔
３とはんだチップ８とを、プリント回路基板１の接続パ
ターン２の上に置き、この上に部品５をセットする。こ
のとき、はんだチップ８は、接続面の全体で少なくとも
２ヵ所に置かれ、その他の部分にはんだ箔３が置かれ
る。前述したように、はんだチップ８は、はんだ箔３よ
りも厚い寸法となっているので、部品５は、はんだチッ
プ８により保持されてプリント回路基板１上にセットさ
れることになる。なお、はんだチップ８の部品５を保持
する部分の面積は、はんだ箔３の面積に比較して小さな
ものでよい。First, as shown in FIG. 1A, the solder foil 3 and the solder chip 8 are placed on the connection pattern 2 of the printed circuit board 1, and the component 5 is set on this. At this time, the solder chips 8 are placed at at least two places on the entire connecting surface, and the solder foil 3 is placed on the other portions. As described above, since the solder chip 8 is thicker than the solder foil 3, the component 5 is held by the solder chip 8 and set on the printed circuit board 1. The area of the portion of the solder chip 8 that holds the component 5 may be smaller than the area of the solder foil 3.
【００２１】次に、前述の状態から加熱を開始する。図
１（ｂ）は、はんだ箔３の融点以上、はんだチップ８の
融点以下に加熱温度を保持した状態を示している。プリ
ント回路基板１と部品５との接続部となる継手部は、は
んだ箔３の融点以上の温度に加熱されているため、接合
はんだ６は、プリント回路基板１の接続パターン２上に
濡れ広がりプリント回路基板１との接続が完了してい
る。しかし、この状態では、はんだチップ５がまだ溶融
していないため、部品５ははんだチップ８に保持されて
おり、部品５と接合はんだ６とは接触していない。従っ
て、図１（ａ）の状態からはんだ箔３が溶融して濡れ拡
がるときに巻き込んだガス、はんだ溶融時に発生するガ
スは、この図１（ｂ）に示す状態で、容易にはんだ中よ
り排出されることになる。Next, heating is started from the above-mentioned state. FIG. 1B shows a state in which the heating temperature is maintained above the melting point of the solder foil 3 and below the melting point of the solder chip 8. Since the joint portion, which is a connection portion between the printed circuit board 1 and the component 5, is heated to a temperature equal to or higher than the melting point of the solder foil 3, the joint solder 6 spreads wet on the connection pattern 2 of the printed circuit board 1 and printed. The connection with the circuit board 1 is completed. However, in this state, since the solder chip 5 is not yet melted, the component 5 is held by the solder chip 8 and the component 5 and the joining solder 6 are not in contact with each other. Therefore, the gas entrained when the solder foil 3 melts and spreads from the state shown in FIG. 1A and the gas generated when the solder melts are easily discharged from the solder in the state shown in FIG. 1B. Will be done.
【００２２】この状態からさらに、加熱温度を上昇さ
せ、はんだチップ８の融点以上に加熱すると、はんだチ
ップ８は溶融して部品５を保持する力がなくなり、部品
５は、自重で落下し、図１（ｃ）に示すように、接合は
んだ６の中に浸漬されて、プリント回路基板１に部品５
がはんだ付けされる。When the heating temperature is further raised from this state and the temperature is higher than the melting point of the solder tip 8, the solder tip 8 melts and loses the force to hold the component 5, and the component 5 falls by its own weight. As shown in FIG. 1 (c), the printed circuit board 1 is dipped in the bonding solder 6 and the component 5
Is soldered.
【００２３】前述した本発明の一実施例によるはんだ付
け方法によれば、はんだ箔３がはんだチップ８より先に
溶融し、部品５が溶融した接合はんだ６に接触するまで
の間に、発生したガスをはんだの中から排出することが
可能となり、１回の加熱により従来技術により説明した
むかえはんだの方法と同様に、接合はんだ内にボイドの
残ることのない信頼性の高いはんだ接続を行うことがで
きる。According to the above-described soldering method according to the embodiment of the present invention, the solder foil 3 is melted before the solder chip 8 and is generated before the component 5 comes into contact with the melted joint solder 6. It is possible to discharge gas from the solder, and to perform highly reliable solder connection that does not leave voids in the joint solder by heating once, similar to the method of replacement solder described in the prior art. You can
【００２４】なお、前述した本発明の一実施例の方法で
は、はんだチップ８の部分に僅かにボイドが残ることが
あるが、接続される部分の全面積に対して、はんだチッ
プ８の部分の面積が極めて少ないので、残されたボイド
による影響を受けることがない。In the above-described method of the embodiment of the present invention, a slight void may remain in the solder chip 8 portion. Since the area is extremely small, it is not affected by the remaining voids.
【００２５】はんだ箔３とはんだチップ８とは、融点の
差と、それぞれが溶融凝固するとき特性を考慮して任意
のはんだ材を選定することができる。For the solder foil 3 and the solder chip 8, any solder material can be selected in consideration of the difference in melting points and the characteristics when they are melted and solidified.
【００２６】例えば、はんだ箔３として、Ｓｎ：Ｐｂ＝
６３：３７Ｗｔ％の組成のはんだ材（融点１８３℃）を
選定した場合、はんだチップ８として、Ｓｎ：Ａｇ＝９
６．５：３．５Ｗｔ％のはんだ（融点２２１℃）を選定
することができる。For example, as the solder foil 3, Sn: Pb =
When a solder material having a composition of 63:37 Wt% (melting point 183 ° C.) is selected, Sn: Ag = 9 as the solder chip 8.
6.5: 3.5 wt% solder (melting point 221 ° C.) can be selected.
【００２７】この場合、本発明の一実施例によるはんだ
付け方法の温度管理は、室温から加熱し１９０℃〜２０
０℃の間で一旦保持して、はんだ箔３を溶融させ、はん
だ中のガスを除去した後、温度を２４０℃〜２５０℃に
昇温してはんだチップ８を溶融させ、部品５を自重で溶
融したはんだ中に浸漬後温度を降下させればよい。In this case, the temperature control of the soldering method according to one embodiment of the present invention is performed by heating from room temperature to 190 ° C. to 20 ° C.
After holding once at 0 ° C. to melt the solder foil 3 and remove the gas in the solder, the temperature is raised to 240 ° C. to 250 ° C. to melt the solder chip 8 and the component 5 by its own weight. The temperature may be lowered after immersion in the molten solder.
【００２８】温度を降下させる場合の温度の降下速度
は、部品のリペアを考慮して決めればよい。すなわち、
温度の降下速度が遅い場合、溶融後のはんだチップ８内
のＡｇがはんだ箔３のはんだ材中への拡散していき、は
んだチップ８周辺のＡｇ濃度勾配が小さい状態で接合は
んだ６が固化することになり、部品５を後に取り外そう
とする場合に、低い加熱温度（はんだ箔３の溶融温度以
上）でリペアすることが可能となる。しかし、温度の降
下速度が早い場合、溶融後のはんだチップ８内のＡｇの
はんだ箔３のはんだ材中への拡散が少なく、はんだチッ
プ８周辺のＡｇ濃度勾配が大きい状態で接合はんだ６が
固化することになり、部品５を後に取り外そうとする場
合に、高い温度（はんだチップ８の溶融温度以上）にま
で加熱しなければ部品５をリペアすることができないこ
とになる。When lowering the temperature, the temperature lowering speed may be determined in consideration of the repair of parts. That is,
When the rate of temperature drop is slow, Ag in the solder chip 8 after melting diffuses into the solder material of the solder foil 3, and the bonding solder 6 solidifies in a state where the Ag concentration gradient around the solder chip 8 is small. Therefore, when the component 5 is to be removed later, the repair can be performed at a low heating temperature (above the melting temperature of the solder foil 3). However, when the temperature drop rate is fast, the Ag in the solder chip 8 after melting is less diffused into the solder material of the solder foil 3 and the bonding solder 6 is solidified in a state where the Ag concentration gradient around the solder chip 8 is large. Therefore, when the component 5 is to be removed later, the component 5 cannot be repaired unless it is heated to a high temperature (above the melting temperature of the solder chip 8).
【００２９】また、同様に、はんだ箔３として、Ｓｎ：
Ｐｂ＝６３：３７Ｗｔ％の組成のはんだ材（融点１８３
℃）を選定した場合、はんだチップ８として、Ｓｎ：Ｐ
ｂ＝５：９５Ｗｔ％のはんだ材を選定することができ
る。Similarly, as the solder foil 3, Sn:
Solder material having a composition of Pb = 63: 37 Wt% (melting point 183
(° C) is selected, the solder tip 8 is Sn: P
A solder material of b = 5: 95 Wt% can be selected.
【００３０】この場合も、まず、１９０℃〜２００℃に
加熱してはんだ箔３を溶融させ、その後Ｓｎ５、Ｐｂ９
５Ｗｔ％の組成のはんだチップ８を溶かすため、３３０
℃〜３５０℃程度に加熱しはんだ付けを行うようにすれ
ばよい。Also in this case, first, the solder foil 3 is melted by heating at 190 ° C. to 200 ° C., and then Sn5, Pb9.
To melt the solder tip 8 having a composition of 5 Wt%, 330
It suffices that the soldering is performed by heating to about ℃ to 350 ℃.
【００３１】この場合にも、Ｓｎ５、Ｐｂ９５％組成の
はんだチップ８内のＰｂは、Ｓｎ６３、Ｐｂ３７Ｗｔ％
のはんだ箔の溶融した接合はんだ６内に溶融拡散する
が、前述の場合と同様に、チップ周辺部のＰｂの濃度
は、温度降下のさせかたにより制御することができる。Also in this case, Pb in the solder chip 8 having a composition of Sn5 and Pb95% is Sn63 and Pb37Wt%.
Although it is melted and diffused into the melted joint solder 6 of the solder foil, the concentration of Pb in the peripheral portion of the chip can be controlled by decreasing the temperature, as in the case described above.
【００３２】前述した本発明の一実施例は、はんだ材の
供給形態を箔として説明したが、本発明は、これに限定
されるものではなく、はんだペースト、はんだワイヤ等
をはんだ材として供給するようにしてもよい。In the above-described embodiment of the present invention, the form of supplying the solder material is described as a foil, but the present invention is not limited to this, and a solder paste, a solder wire or the like is supplied as the solder material. You may do it.
【００３３】前述した本発明の一実施例によれば、プリ
ント回路基板のようなサブストレート材と、部品とをは
んだ接続する場合に、部品の下に発生するボイドの発生
を防止するため、従来２回に分けて実施していたはんだ
付けを１回の加熱工程で可能とすることができ、はんだ
付けに要する作業時間の短縮を図り、加熱設備の負荷を
低減し、設備投資額、設置スぺースを節約することが可
能となる。According to the above-described embodiment of the present invention, when a substrate material such as a printed circuit board and a component are soldered to each other, the formation of voids under the component is prevented. Soldering, which was performed twice, can be performed in one heating process, the work time required for soldering can be shortened, the load on heating equipment can be reduced, and the amount of equipment investment and installation It becomes possible to save space.
【００３４】[0034]
【発明の効果】以上説明したように本発明によれば、２
つの部材をはんだ接続する際、１回の加熱工程のみによ
り、接合はんだ内のボイドの発生を防止して信頼性の高
いはんだ接続を行うことができる。As described above, according to the present invention, 2
When connecting two members by soldering, it is possible to prevent voids in the jointed solder and perform highly reliable soldering connection by only one heating step.
【図１】本発明の一実施例によるはんだ付け方法を説明
する図である。FIG. 1 is a diagram illustrating a soldering method according to an embodiment of the present invention.
【図２】従来技術によるはんだ付け方法を説明する図で
ある。FIG. 2 is a diagram illustrating a soldering method according to a conventional technique.
【図３】従来技術によるはんだ付け方法の他の例を説明
する図である。FIG. 3 is a diagram illustrating another example of a soldering method according to the related art.
１ プリント回路基板 ２、４ 接続パターン ３ はんだ箔 ５ 部品 ６ 接合はんだ ７ ボイド ８ はんだチップ 1 Printed Circuit Board 2, 4 Connection Pattern 3 Solder Foil 5 Parts 6 Bonding Solder 7 Void 8 Solder Chip
Claims (3)
接続面に、未溶融のはんだ材を供給後、加熱を行うこと
によりはんだ材を溶融させてはんだ接続を行うはんだ付
け方法において、異なる高さを持ち、異なる融点を持つ
少なくとも２種類のはんだ材を前記接続面に供給し、高
い融点を持つはんだ材により、接続しようとする部品同
士の間隔を一定距離に保ち、かつ、低い融点を持つはん
だ材と部材の一方の側との間に所定の距離の空隙ができ
るように両部材を保持し、低い融点を持つはんだ材を溶
融させた後、高い融点を持つはんだ材を溶融させてはん
だ付を行うことを特徴とするはんだ付け方法。1. A soldering method in which unmelted solder material is supplied to opposing connection surfaces of two members to be connected and then heated to melt the solder material for solder connection. Having at least two types of soldering materials having different melting points and having different melting points are supplied to the connecting surface, and the soldering material having a high melting point maintains a constant distance between the parts to be connected and has a low melting point. Hold both members so that there is a gap of a certain distance between the solder material and one side of the member, melt the solder material with a low melting point, and then melt the solder material with a high melting point A soldering method characterized by applying soldering.
ケ所に、高い融点のはんだ材が供給されることを特徴と
する請求項１記載のはんだ付け方法。2. At least two joining surfaces of the two members
The soldering method according to claim 1, wherein a solder material having a high melting point is supplied to the places.
ｂ系のはんだ組成を持つものであり、前記高い融点を持
つはんだ材がＳｎ−Ａｇ系のはんだ組成、または、前記
低い融点を持つはんだ材よりＰｂ濃度の高いはんだ組成
を持つものであることを特徴とする請求項１または２記
載のはんだ付け方法。3. The solder material having a low melting point is Sn-P.
The solder material having a b-based solder composition, wherein the solder material having a high melting point has a Sn—Ag solder composition or a solder composition having a higher Pb concentration than the solder material having a low melting point. The soldering method according to claim 1 or 2, which is characterized in that.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7098637A JP3054056B2 (en) | 1995-04-24 | 1995-04-24 | Soldering method |
| US08/636,186 US5709338A (en) | 1995-04-24 | 1996-04-22 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7098637A JP3054056B2 (en) | 1995-04-24 | 1995-04-24 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08293670A true JPH08293670A (en) | 1996-11-05 |
| JP3054056B2 JP3054056B2 (en) | 2000-06-19 |
Family
ID=14225029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7098637A Expired - Fee Related JP3054056B2 (en) | 1995-04-24 | 1995-04-24 | Soldering method |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5709338A (en) |
| JP (1) | JP3054056B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016068081A1 (en) * | 2014-10-29 | 2016-05-06 | 株式会社神戸製鋼所 | Metal joint and manufacturing method for metal joint |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100548114B1 (en) * | 2000-12-21 | 2006-02-02 | 가부시키가이샤 히타치세이사쿠쇼 | Solder foil and semiconductor device and electronic device |
| JP4143478B2 (en) * | 2002-10-02 | 2008-09-03 | アルプス電気株式会社 | Solder connection structure and solder connection method for electronic parts |
| ATE514194T1 (en) * | 2005-11-25 | 2011-07-15 | Israel Aerospace Ind Ltd | SYSTEM AND METHOD FOR PRODUCING A SOLAR CELL ARRAY |
| US8698925B2 (en) | 2010-04-21 | 2014-04-15 | Intevac, Inc. | Collimator bonding structure and method |
| TWI544583B (en) * | 2012-04-18 | 2016-08-01 | 鴻海精密工業股份有限公司 | Chip assembly and chip assembling method |
| US8970228B2 (en) * | 2012-05-31 | 2015-03-03 | General Electric Company | Rotational clearance measurement system and method of operation |
| CN103170693A (en) * | 2013-03-27 | 2013-06-26 | 张家港市东大工业技术研究院 | Technology method of void-free butt welding of large-area flat plate |
| CN103464852B (en) * | 2013-07-10 | 2015-10-07 | 南京信息职业技术学院 | Three-dimensional reflow soldering method for electronic device |
| US10537030B2 (en) * | 2014-08-25 | 2020-01-14 | Indium Corporation | Voiding control using solid solder preforms embedded in solder paste |
| EP3499553A1 (en) * | 2017-12-13 | 2019-06-19 | Heraeus Deutschland GmbH & Co. KG | Method for producing a component bonded to a soldering preform through thermocompression below the melting point of the solder |
| JP7574311B2 (en) * | 2021-12-29 | 2024-10-28 | 香港時代新能源科技有限公司 | CIRCUIT BOARD, BATTERY MODULE, BATTERY PACK, AND POWER CONSUMPTION DEVICE |
| CN114654035B (en) * | 2022-04-29 | 2024-05-24 | 天津光电惠高电子有限公司 | Method for reducing LGA device welding cavity by using prefabricated solder |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3097770B2 (en) * | 1991-06-07 | 2000-10-10 | 株式会社日立製作所 | Sealed body connection method and sealed body |
| DE69215377T2 (en) * | 1991-08-05 | 1997-05-15 | Motorola Inc | MELTING SOLDERING PROCESS FOR FORMING A SOLDERING STICK ON A PRINT PLATE |
| US5540379A (en) * | 1994-05-02 | 1996-07-30 | Motorola, Inc. | Soldering process |
-
1995
- 1995-04-24 JP JP7098637A patent/JP3054056B2/en not_active Expired - Fee Related
-
1996
- 1996-04-22 US US08/636,186 patent/US5709338A/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016068081A1 (en) * | 2014-10-29 | 2016-05-06 | 株式会社神戸製鋼所 | Metal joint and manufacturing method for metal joint |
| JP2016083694A (en) * | 2014-10-29 | 2016-05-19 | 株式会社神戸製鋼所 | Metal junction body and method for manufacturing metal junction body |
| US10556285B2 (en) | 2014-10-29 | 2020-02-11 | Kobe Steel, Ltd. | Metal joined body and manufacturing method for metal joined body |
Also Published As
| Publication number | Publication date |
|---|---|
| US5709338A (en) | 1998-01-20 |
| JP3054056B2 (en) | 2000-06-19 |
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