JP2890734B2 - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JP2890734B2 JP2890734B2 JP2202151A JP20215190A JP2890734B2 JP 2890734 B2 JP2890734 B2 JP 2890734B2 JP 2202151 A JP2202151 A JP 2202151A JP 20215190 A JP20215190 A JP 20215190A JP 2890734 B2 JP2890734 B2 JP 2890734B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- land
- printed circuit
- circuit board
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、プリント基板の表面に電子部品を実装する
技術であるリフロー工程および自動半田付けロボット工
法を併用して用いる時に半田付け品質の大幅な向上に有
効な半田付け方法に関する。The present invention relates to a technique for mounting an electronic component on a surface of a printed circuit board, and a reflow process and a significantly improved soldering quality when used in combination with an automatic soldering robot method. The present invention relates to an effective soldering method.
従来の技術 近年、家電製品に採用されるプリント基板の半田付け
工程において、より高密度実装を実現するためにフロー
工法（半田槽にプリント基板を浸漬する方法）に代り、
リフロー工法が盛んに利用されてきている。2. Description of the Related Art In recent years, in the process of soldering printed circuit boards used in home appliances, instead of a flow method (a method of immersing a printed circuit board in a solder bath) to achieve higher density mounting,
The reflow method has been actively used.
リフロー工法とはプリント基板にクリーム半田を印刷
し、チップ部品を実装した後、プリント基板をリフロー
炉（高温炉）の中に入れてクリーム半田を溶かしてチッ
プ部品を半田付けする方法である。The reflow method is a method in which cream solder is printed on a printed circuit board, chip components are mounted, and then the printed circuit board is placed in a reflow furnace (high-temperature furnace) to melt the cream solder and solder the chip components.
ところが、耐熱性の面より全ての部品にリフロー工法
を採用することは不可能であり、非耐熱部品はリフロー
半田付け終了後、手付けによって半田付けを実施してい
る。However, it is impossible to adopt the reflow method for all components from the viewpoint of heat resistance, and non-heat-resistant components are soldered by hand after reflow soldering is completed.
この半田付けをする場合、近年では、より自動化を推
進するため人手による半田付けでなく、半田付けロボッ
トにより実施しているのが一般的である。In recent years, this soldering is generally performed not by manual soldering but by a soldering robot in order to promote automation.
発明が解決しようとする課題 しかしながらこのロボット半田付けにおいては、前工
程でプリント基板はリフロー炉を通過して高温（240
℃）に加熱されており、そのプリント基板の半田付けラ
ンド（半田付けロボットで半田付けすべき場所で通常は
銅箔が用いられる）は酸化が進行し、半田付け性が極端
に悪化しており、製造工程において半田付け不良が発生
しやすいという課題がある。特に人手による半田付けに
比べてロボットによる半田付けは、プログラムされた一
定のデータにより制御されているためプリント基板材料
の半田付けのための条件が一定していないと半田付け不
良が多発するという課題がある。However, in this robot soldering, in the pre-process, the printed circuit board passes through a reflow furnace and has a high temperature (240 ° C).
℃), and the soldering lands of the printed circuit board (copper foil is usually used where soldering should be performed by a soldering robot) are oxidizing, and the solderability is extremely deteriorated. In addition, there is a problem that a soldering failure easily occurs in a manufacturing process. In particular, compared to manual soldering, soldering by robots is controlled by programmed constant data, so if the conditions for soldering printed circuit board materials are not constant, soldering failures frequently occur There is.
本発明は上記課題を解決するものであり、半田付け信
頼性に優れたプリント基板を製造できる半田付け方法を
提供することを目的とする。An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a soldering method capable of manufacturing a printed circuit board having excellent soldering reliability.
課題を解決するための手段 本発明は上記目的を達成するために、非耐熱部品のリ
ードを挿入する孔を有するランドにクリーム半田を部分
的に塗布し、耐熱部品を実装する時、リフロー炉で同時
にこのクリーム半田を溶解して前記ランドの上を部分的
に半田でコートしておくものである。Means for Solving the Problems In order to achieve the above object, the present invention partially applies cream solder to a land having a hole for inserting a lead of a non-heat-resistant component and mounts the heat-resistant component on a reflow furnace. At the same time, the cream solder is melted and the land is partially coated with solder.
作用 したがって本発明によれば、非耐熱部品のリードを半
田付けするランドを前もってクリーム半田を溶融してコ
ートておくことにより、ランドの表面の酸化を防止して
品質の良い半田付けを行うことができ、優れた半田付け
信頼性を得ることができる。According to the present invention, therefore, the land for soldering the lead of the non-heat-resistant component is coated in advance by melting the cream solder, thereby preventing the surface of the land from being oxidized and performing high-quality soldering. And excellent soldering reliability can be obtained.
なお、この時ランド全体にクリーム半田を塗布すると
部品のリードを挿入する孔に半田が流れ込み、孔づまり
を発生させるため、特殊な形状にクリーム半田を塗布
し、半田付け性を向上させると同時に半田による孔づま
りを防止できる。At this time, if cream solder is applied to the entire land, the solder will flow into the holes where the leads of the components will be inserted, causing clogging of the holes. Apply cream solder in a special shape to improve the solderability, and at the same time improve the solderability. Hole clogging can be prevented.
実施例 以下、本発明の一実施例について図面を参照しながら
説明する。第１図は本発明の一実施例の構成を示すもの
であり、図において１はプリント基板、２は非耐熱部品
を挿入するための孔３を有するランドであり、プリント
基板１の表面に銅箔等により形成されており、その表面
に円形のクリーム半田４が複数個印刷塗布されている。
第２図は本発明の他の実施例の構成を示すものであり、
前記実施例と相違する点はランド５の形状が変わった場
合、クリーム半田６の形状も変わる点である。Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a configuration of an embodiment of the present invention. In the drawing, reference numeral 1 denotes a printed board, 2 denotes a land having holes 3 for inserting non-heat-resistant components, and copper It is formed of a foil or the like, and a plurality of circular cream solders 4 are printed and applied on the surface thereof.
FIG. 2 shows the configuration of another embodiment of the present invention.
The difference from the above embodiment is that when the shape of the land 5 changes, the shape of the cream solder 6 also changes.
つぎに上記実施例を用いてプリント基板１に電子部品
等を半田付けする方法について説明する。第３図（ａ）
〜（ｆ）は本実施例の半田付け方法を示す要部の概略図
であり、第３図（ａ）に示すように、その表面に非耐熱
部品実装用のランド２または５、およびその他の部品用
ランド７を有するプリント基板１の非耐熱部品実装用の
ランド２または５にリード挿入用の孔３を設ける。つぎ
に同図（ｂ）に示すように非耐熱部品用クリーム半田４
または６およびその他の部品用クリーム半田８をそれぞ
れのランド上に印刷する。同図（ｃ）はこのその他部品
用クリーム半田８上にその他の部品９（耐熱性のあるチ
ップ部品等）を実装機で装着したもので、このようにチ
ップ部品９等を搭載したプリント基板１は同図（ｄ）に
示すようにリフロー炉10の中を通過させることによって
ヒーター11で高温（240℃）の雰囲気中でクリーム半田
８を溶かしてチャップ部品９を半田付けする。Next, a method of soldering electronic components and the like to the printed circuit board 1 will be described using the above embodiment. Fig. 3 (a)
3A to 3F are schematic views of a main part showing a soldering method according to the present embodiment. As shown in FIG. 3A, a land 2 or 5 for mounting a non-heat-resistant component and other parts are provided on the surface thereof. The lead insertion hole 3 is provided in the land 2 or 5 for mounting the non-heat-resistant component of the printed circuit board 1 having the component land 7. Next, as shown in FIG.
Or 6 and cream solder 8 for other parts are printed on each land. FIG. 3C shows another component 9 (heat-resistant chip component or the like) mounted on the other component cream solder 8 by a mounting machine. The printed circuit board 1 on which the chip component 9 or the like is mounted as described above. As shown in FIG. 1D, the cream solder 8 is melted in a high-temperature (240 ° C.) atmosphere by a heater 11 by passing through a reflow furnace 10 and the chap component 9 is soldered.
この時非耐熱部品用のクリーム半田４または６も同時
に溶けてランド２または５に盛られた状態となってい
る。At this time, the cream solder 4 or 6 for the non-heat-resistant component is also melted at the same time and is placed on the land 2 or 5.
同図（ｅ）はリフロー炉10を通過したプリント基板１
を反転し、非耐熱部品12のリード13を部品挿入のための
孔３に挿入した状態を示すものであり、同図（ｆ）に示
すように、挿入した非耐熱部品12が落下しないように部
品押さえピン14で保持しながら反転し、半田付けロボッ
トの半田ごて15をランド２または５上の溶融したクリー
ム半田4,6に接触させ、糸半田16を供給してリード13の
半田付けを完了する。FIG. 1E shows the printed circuit board 1 having passed through the reflow furnace 10.
This shows a state in which the lead 13 of the non-heat-resistant component 12 is inserted into the hole 3 for inserting the component, and as shown in FIG. The soldering iron 15 of the soldering robot is brought into contact with the melted cream solders 4 and 6 on the lands 2 or 5 by supplying the thread solder 16 and the lead 13 is soldered. Complete.
なお、第１図においてランド２が丸形タイプ銅箔パタ
ーン（直径2.5mm）の場合、リード13の挿入孔３（直径
0.8mm）が形成されており、これに示すように直径0.4mm
のクリーム半田４を角度90度おきに４箇所印刷してい
る。In FIG. 1, when the land 2 is a round type copper foil pattern (2.5 mm in diameter), the insertion hole 3 (diameter
0.8mm) and 0.4mm in diameter as shown
The cream solder 4 is printed at four positions at an angle of 90 degrees.
クリーム半田４の大きさはランド径：孔径：クリーム
半田径＝6:2:1の割合が最も望ましい。The size of the cream solder 4 is most preferably a ratio of land diameter: hole diameter: cream solder diameter = 6: 2: 1.
また第２図においてランド５が長円タンプの銅箔パタ
ーン（1.4mm×2.0mm）の場合、リード13を挿入する孔３
の周囲に示すようにわん曲した曲玉形状のクリーム半田
６（0.3mm×0.5mm）を孔３の左右に２箇所印刷してい
る。In FIG. 2, when the land 5 is an elliptical tamped copper foil pattern (1.4 mm × 2.0 mm), the hole 3 into which the lead 13 is inserted is formed.
The cream solder 6 (0.3 mm × 0.5 mm) in the shape of a curved bead is printed at two places on the left and right of the hole 3 as shown in FIG.
このように上記実施例によれば、非耐熱部品12のリー
ド13を挿入する孔３を有するランド２または５の上にク
リーム半田４または６を印刷して半田付けしているため
に極めて優れた半田付け信頼性が得られる。As described above, according to the above-described embodiment, the cream solder 4 or 6 is printed and soldered on the land 2 or 5 having the hole 3 into which the lead 13 of the non-heat-resistant component 12 is inserted. Soldering reliability is obtained.
なお、第１図および第２図に示すように特殊な形状を
有するクリーム半田4,6を印刷するのは第３図（ｄ）に
示すようにクリーム半田4,6がリフロー炉10内で溶融し
た時、非耐熱部品12のリード13を挿入する孔３の内部に
溶けたクリーム半田4,6が流れ込むことを防止するため
である。The printing of the cream solders 4 and 6 having a special shape as shown in FIGS. 1 and 2 is performed by melting the cream solders 4 and 6 in the reflow furnace 10 as shown in FIG. This is to prevent the melted cream solders 4 and 6 from flowing into the holes 3 where the leads 13 of the non-heat-resistant component 12 are inserted.
発明の効果 本発明は上記実施例より明らかなように、非耐熱部品
のリードを半田付けするランド上の部分的な箇所に前も
ってクリーム半田が一定の形状に印刷塗布されており、
チップ部品等の耐熱部品をリフロー炉で半田付けしたと
き、そのクリーム半田が溶けてランド上をコートするた
め銅箔などよりなるランドの表面が酸化されることがな
くなり、部品のリードを挿入する孔に半田が流れ込み、
孔づまりを発生させることがなくなる。Effect of the Invention As is clear from the above embodiment, the cream solder is printed and applied in a predetermined shape in advance at a partial location on the land where the lead of the non-heat-resistant component is soldered,
When soldering heat-resistant components such as chip components in a reflow furnace, the cream solder melts and coats the lands, so the surface of the lands made of copper foil etc. is not oxidized, and holes for inserting component leads Solder flows into the
Elimination of hole clogging is eliminated.
またランドが半田でコートされているため糸半田が供
給された時、半田付けする銅箔等のランドの部分は非常
に半田のぬれ性がよく、均一な半田量が形成されると同
時に半田付け品質が飛躍的に向上するという効果が得ら
れるものである。Also, since the lands are coated with solder, when thread solder is supplied, the lands such as copper foil to be soldered have very good solder wettability, and a uniform amount of solder is formed, and at the same time soldering The effect that the quality is dramatically improved can be obtained.
【図面の簡単な説明】 第１図は本発明の一実施例におけるプリント基板の要部
拡大平面図、第２図は本発明の他の実施例におけるプリ
ント基板の要部拡大平面図、第３図（ａ）〜（ｆ）は本
発明の一実施例の半田付け方法の構成を示す概略工程図
である。 １……プリント基板、2,5……ランド、３……孔、4,6…
…クリーム半田、７……その他のランド、９……その他
の電子部品（チップ部品）、10……リフロー炉、12……
非耐熱部品、13……リード。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an enlarged plan view of a main part of a printed circuit board in one embodiment of the present invention, FIG. 2 is an enlarged plan view of a main part of a printed circuit board in another embodiment of the present invention, FIG. 1A to 1F are schematic process diagrams showing a configuration of a soldering method according to one embodiment of the present invention. 1 ... printed circuit board, 2,5 ... land, 3 ... hole, 4,6 ...
... cream solder, 7 ... other lands, 9 ... other electronic parts (chip parts), 10 ... reflow furnace, 12 ...
Non heat-resistant parts, 13 Leads.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 館島 茂次 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭52−72166（ＪＰ，Ａ) 特開 昭61−251097（ＪＰ，Ａ) 実開 平３−48266（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/34 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Shigeji Tatejima 1006 Kazuma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (56) References JP-A 52-72166 (JP, A) JP-A Sho 61-251097 (JP, A) Japanese Utility Model Hei 3-48266 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 3/34
Claims (1)
孔が形成されているプリント基板上のランドに塗布され
たクリーム半田が加熱溶融される加熱溶融工程を含むプ
リント基板のランドと実装部品との半田付け方法であっ
て、前記加熱溶融工程よりも先に実施される工程とし
て、前記挿入孔に挿入されるリードと半田付けされるべ
きランドに対し部分的にクリーム半田が塗布される塗布
工程を有し、加熱溶融工程の際には実装されるべき部品
のリードが挿入されていない挿入孔があることを特徴と
する半田付け方法。1. A printed circuit board land and a mounted component including a heating and melting step of heating and melting cream solder applied to a land on the printed circuit board in which an insertion hole into which a lead of a component to be mounted is inserted is formed. A soldering method in which cream solder is partially applied to a lead to be inserted into the insertion hole and a land to be soldered, as a step performed before the heating and melting step. A soldering method, comprising a step of inserting a lead of a component to be mounted in a heating / melting step, into which a lead is not inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2202151A JP2890734B2 (en) | 1990-07-30 | 1990-07-30 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2202151A JP2890734B2 (en) | 1990-07-30 | 1990-07-30 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0487395A JPH0487395A (en) | 1992-03-19 |
| JP2890734B2 true JP2890734B2 (en) | 1999-05-17 |
Family
ID=16452810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2202151A Expired - Fee Related JP2890734B2 (en) | 1990-07-30 | 1990-07-30 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2890734B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005026457A (en) * | 2003-07-02 | 2005-01-27 | Toshiba Corp | Method for mounting electronic component, substrate manufacturing apparatus, and circuit board |
| JP2011066195A (en) * | 2009-09-17 | 2011-03-31 | Aisin Seiki Co Ltd | Method of manufacturing printed circuit substrate |
-
1990
- 1990-07-30 JP JP2202151A patent/JP2890734B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0487395A (en) | 1992-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5271548A (en) | Method for applying solder to and mounting components on printed circuit boards | |
| US5111991A (en) | Method of soldering components to printed circuit boards | |
| KR100530965B1 (en) | Printing mask, method of printing solder paste using printing mask, surface-mounted structural assembly, and method of manufacturing surface-mounted structural assembly | |
| JP3918779B2 (en) | Soldering method for non-heat resistant parts | |
| KR19980701441A (en) | Electrical conductive wire | |
| JP4181759B2 (en) | Electronic component mounting method and mounting structure manufacturing method | |
| JP3054056B2 (en) | Soldering method | |
| JP2890734B2 (en) | Soldering method | |
| JP3867768B2 (en) | Soldering method, soldering apparatus, and electronic circuit module manufacturing method and manufacturing apparatus | |
| JP2002359459A (en) | Electronic component mounting method, printed wiring board, and mounting structure | |
| JPH07131139A (en) | Wiring board for electronic part | |
| JPH10229273A (en) | Printed wiring board and method of soldering components thereto | |
| JPH05129753A (en) | Discrete component and printed board mounting method thereof | |
| JPH07170061A (en) | Mounting of electric component | |
| JPH05198932A (en) | Soldering method for printed board | |
| JPS6221298A (en) | Mounting of chip type electronic component | |
| JPH05283587A (en) | Soldering method of multiple-lead element | |
| JPH0113240B2 (en) | ||
| KR19990026398A (en) | Parts mounting method of printed circuit board | |
| JP2001345548A (en) | Method of jointing inserted and mounted parts by reflow solder | |
| JPH07176859A (en) | Printed board and method for mounting electronic component on it | |
| JPH04293297A (en) | Printed wiring board and soldering method therefor | |
| JP2006286899A (en) | Manufacturing method of printed wiring board | |
| JPH0846348A (en) | Mounting of component on mixed mounting board | |
| JP2022070305A (en) | Manufacturing method of printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |