JPS5378065A - Method of connecting external terminal to ic - Google Patents

Method of connecting external terminal to ic

Info

Publication number
JPS5378065A
JPS5378065A JP15291076A JP15291076A JPS5378065A JP S5378065 A JPS5378065 A JP S5378065A JP 15291076 A JP15291076 A JP 15291076A JP 15291076 A JP15291076 A JP 15291076A JP S5378065 A JPS5378065 A JP S5378065A
Authority
JP
Japan
Prior art keywords
external terminal
connecting external
terminal
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15291076A
Other languages
Japanese (ja)
Other versions
JPS5653222B2 (en
Inventor
Atsushi Aritomo
Yasumasa Fukushima
Yukio Miwa
Hiroshi Yokoyama
Yuuji Kazama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15291076A priority Critical patent/JPS5378065A/en
Publication of JPS5378065A publication Critical patent/JPS5378065A/en
Publication of JPS5653222B2 publication Critical patent/JPS5653222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15291076A 1976-12-21 1976-12-21 Method of connecting external terminal to ic Granted JPS5378065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15291076A JPS5378065A (en) 1976-12-21 1976-12-21 Method of connecting external terminal to ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15291076A JPS5378065A (en) 1976-12-21 1976-12-21 Method of connecting external terminal to ic

Publications (2)

Publication Number Publication Date
JPS5378065A true JPS5378065A (en) 1978-07-11
JPS5653222B2 JPS5653222B2 (en) 1981-12-17

Family

ID=15550802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15291076A Granted JPS5378065A (en) 1976-12-21 1976-12-21 Method of connecting external terminal to ic

Country Status (1)

Country Link
JP (1) JPS5378065A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274097A (en) * 1988-09-09 1990-03-14 Fujitsu Ltd Soldering method of electronic component lead terminal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274097A (en) * 1988-09-09 1990-03-14 Fujitsu Ltd Soldering method of electronic component lead terminal

Also Published As

Publication number Publication date
JPS5653222B2 (en) 1981-12-17

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