JPS5586143A - Method of forming terminal pad - Google Patents

Method of forming terminal pad

Info

Publication number
JPS5586143A
JPS5586143A JP11438579A JP11438579A JPS5586143A JP S5586143 A JPS5586143 A JP S5586143A JP 11438579 A JP11438579 A JP 11438579A JP 11438579 A JP11438579 A JP 11438579A JP S5586143 A JPS5586143 A JP S5586143A
Authority
JP
Japan
Prior art keywords
terminal pad
forming terminal
forming
pad
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11438579A
Other languages
Japanese (ja)
Inventor
Shiyuuiaberudo Jiyon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5586143A publication Critical patent/JPS5586143A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11438579A 1978-12-20 1979-09-07 Method of forming terminal pad Pending JPS5586143A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US97157878A 1978-12-20 1978-12-20

Publications (1)

Publication Number Publication Date
JPS5586143A true JPS5586143A (en) 1980-06-28

Family

ID=25518567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11438579A Pending JPS5586143A (en) 1978-12-20 1979-09-07 Method of forming terminal pad

Country Status (1)

Country Link
JP (1) JPS5586143A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227917A (en) * 1994-12-22 1996-09-03 Toshiba Corp Mounting structure of semiconductor element, liquid crystal display and semiconductor device
JPH0927672A (en) * 1996-07-26 1997-01-28 Hitachi Ltd Circuit board and surface treatment method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227917A (en) * 1994-12-22 1996-09-03 Toshiba Corp Mounting structure of semiconductor element, liquid crystal display and semiconductor device
JPH0927672A (en) * 1996-07-26 1997-01-28 Hitachi Ltd Circuit board and surface treatment method thereof

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