JPS5340889A - Method of forming connecting leads - Google Patents

Method of forming connecting leads

Info

Publication number
JPS5340889A
JPS5340889A JP9376377A JP9376377A JPS5340889A JP S5340889 A JPS5340889 A JP S5340889A JP 9376377 A JP9376377 A JP 9376377A JP 9376377 A JP9376377 A JP 9376377A JP S5340889 A JPS5340889 A JP S5340889A
Authority
JP
Japan
Prior art keywords
connecting leads
forming connecting
forming
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9376377A
Other languages
Japanese (ja)
Other versions
JPS6027158B2 (en
Inventor
Buogerusuberujie Maruseru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sev Marchal
Original Assignee
Sev Marchal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sev Marchal filed Critical Sev Marchal
Publication of JPS5340889A publication Critical patent/JPS5340889A/en
Publication of JPS6027158B2 publication Critical patent/JPS6027158B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Synchronous Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Motors, Generators (AREA)
JP9376377A 1976-08-06 1977-08-06 How to form connection lead wires Expired JPS6027158B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR7624204 1976-08-06
FR7624204A FR2361007A1 (en) 1976-08-06 1976-08-06 METHOD OF MANUFACTURING AN ELECTRICAL CIRCUIT IN PARTICULAR FOR A MOTOR VEHICLE ALTERNATOR RECTIFIER BRIDGE

Publications (2)

Publication Number Publication Date
JPS5340889A true JPS5340889A (en) 1978-04-13
JPS6027158B2 JPS6027158B2 (en) 1985-06-27

Family

ID=9176659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9376377A Expired JPS6027158B2 (en) 1976-08-06 1977-08-06 How to form connection lead wires

Country Status (7)

Country Link
JP (1) JPS6027158B2 (en)
BR (1) BR7705207A (en)
DE (1) DE2735124A1 (en)
ES (1) ES461390A1 (en)
FR (1) FR2361007A1 (en)
GB (1) GB1548517A (en)
IT (1) IT1083395B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4430798A1 (en) * 1994-08-30 1996-03-07 Siemens Ag Lead frame for connecting electrical components
FR2486323A1 (en) * 1980-07-04 1982-01-08 Paris & Du Rhone Automobile alternator combined voltage regulator and brush mounting - has moulded insulating plate with embedded conductor strip providing electrical circuit
FR2544581B1 (en) * 1983-04-14 1985-07-19 Paris & Du Rhone RECTIFIER BRIDGE FOR A MOTOR VEHICLE ALTERNATOR, WITH ANTI-INTERFERENCE CAPACITOR
DE3515911A1 (en) * 1985-05-03 1986-11-06 SWF Auto-Electric GmbH, 7120 Bietigheim-Bissingen ELECTRIC SWITCH, IN PARTICULAR STEERING SWITCH FOR MOTOR VEHICLES
DE3641995C1 (en) * 1986-12-09 1988-05-19 Philips Patentverwaltung Process for the production of printed circuits
DE3728081A1 (en) * 1987-08-22 1989-03-02 Bosch Gmbh Robert RECTIFIER BEARING DEVICE
DE3924176A1 (en) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Prodn. of printed circuit panel by stamping conductors in meta strip - moving strip into injection mould and cutting conductors, and injecting polymer encapsulate
DE3943261C2 (en) * 1989-12-29 1994-11-24 Stocko Metallwarenfab Henkels Electrical circuit
US5043614A (en) * 1990-02-02 1991-08-27 Ford Motor Company Alternator rectifier bridge assembly
KR0165544B1 (en) * 1990-03-05 1999-03-20 야마다 로꾸이찌 Electronic sound producing device
DE4017673C2 (en) * 1990-06-01 2001-02-01 Teves Gmbh Alfred Insulating plate for electrical switches
DE4323827C1 (en) * 1993-07-15 1994-12-08 Siemens Ag Pluggable assembly
DE4327584A1 (en) * 1993-08-17 1995-02-23 Bayerische Motoren Werke Ag Electric drive unit
DE19531126C1 (en) * 1995-08-24 1996-12-12 Delphi Automotive Systems Gmbh Electrical connector with pressed metal contacts e.g. for road vehicles
DE29516161U1 (en) * 1995-10-12 1995-12-07 Stocko Metallwarenfabriken Henkels Und Sohn Gmbh & Co, 42327 Wuppertal Circuit board
DE19707709C1 (en) * 1997-02-26 1998-04-16 Siemens Ag Relay modules circuit board e.g. for automobile
DE19712314A1 (en) * 1997-03-24 1998-10-01 Thomas & Betts Gmbh Connection for the ignition device of airbag systems in motor vehicles
DE19733237C1 (en) * 1997-08-01 1999-05-20 Barlian Reinhold Electrical housing for automobiles
FR2872622B1 (en) * 2004-07-02 2006-09-29 Valeo Securite Habitacle Sas METHOD FOR MANUFACTURING AN ELECTRICAL DEVICE COMPRISING CROSS CONDUCTIVE TRACKS
CN110757717A (en) * 2019-11-29 2020-02-07 扬州扬杰电子科技股份有限公司 Plastic package mold for rectifier bridge

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1156131B (en) * 1958-06-23 1963-10-24 Ibm Deutschland Method for producing an electrical conduction pattern
DE2305883A1 (en) * 1973-02-07 1974-08-15 Finsterhoelzl Rafi Elekt CIRCUIT BOARD

Also Published As

Publication number Publication date
ES461390A1 (en) 1978-12-01
GB1548517A (en) 1979-07-18
IT1083395B (en) 1985-05-21
FR2361007A1 (en) 1978-03-03
BR7705207A (en) 1978-06-06
DE2735124C2 (en) 1988-10-13
DE2735124A1 (en) 1978-02-09
JPS6027158B2 (en) 1985-06-27
FR2361007B1 (en) 1981-09-11

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