DE2305883A1 - CIRCUIT BOARD - Google Patents

CIRCUIT BOARD

Info

Publication number
DE2305883A1
DE2305883A1 DE19732305883 DE2305883A DE2305883A1 DE 2305883 A1 DE2305883 A1 DE 2305883A1 DE 19732305883 DE19732305883 DE 19732305883 DE 2305883 A DE2305883 A DE 2305883A DE 2305883 A1 DE2305883 A1 DE 2305883A1
Authority
DE
Germany
Prior art keywords
conductor tracks
circuit board
carrier plate
tracks
punched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19732305883
Other languages
German (de)
Inventor
Rudolf Hubrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FINSTERHOELZL RAFI ELEKT
Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik
Original Assignee
FINSTERHOELZL RAFI ELEKT
Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FINSTERHOELZL RAFI ELEKT, Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik filed Critical FINSTERHOELZL RAFI ELEKT
Priority to DE19732305883 priority Critical patent/DE2305883A1/en
Priority to NL7303597A priority patent/NL7303597A/xx
Priority to JP3151273A priority patent/JPS5018977A/ja
Priority to FR7311825A priority patent/FR2216750B1/fr
Priority to GB1684673A priority patent/GB1426629A/en
Publication of DE2305883A1 publication Critical patent/DE2305883A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

Firma HAPI Raimund Finsterhölzl Elektrotechnische äpezialfabrik Company HAPI Raimund Finsterhölzl Elektrotechnische äpezialfabrik

798 Bavensburg - Vorberg798 Bavensburg - Vorberg

Lsitsrplatt«Lsitsrplatt "

Die Erfindung betrifft die Ausbildung einer Leiterplatte ffir elektrische Schaltungen, bestehend aus stromleitenden Leiterbahnen, die Bestandteil einer Trägerplatte aus nichtleitendem Werkstoff sind. Der wesentliche Vorteil derartiger Leiterplatten besteht darin, daß auf einer verhältnismäßig kleinen Fläche Leiterbahnen für vielfältige öchaltaufgaben untergebracht werden können, was sich auf die Abmessungen der mit Leiterplatten bastücktsn Geräte vorteilhaft auswirkt. Sin weiterer Vorteil der Leiterplatts ergibt sich daraus, daß sich die Leiterbahnen und die erforderlichen Kontakte kostengünstig herstellen lassen, wobei auch der Materialaufwand verhältnismäßig gering ist.The invention relates to the formation of a printed circuit board For electrical circuits, consisting of conductive tracks that form part of a carrier plate made of non-conductive Material are. The main advantage of such circuit boards is that on a relatively small area conductor tracks for a variety of switching tasks can be accommodated, which affects the dimensions which has a beneficial effect on devices fitted with printed circuit boards. Another advantage of the printed circuit board results from the fact that the conductor tracks and the necessary contacts can be produced inexpensively, including the The cost of materials is relatively low.

Die genannten Vorteile der bekannten Leiterplatte sind je-» doch andererseits mit dem Nachteil verbunden, daß eine volle Ausnützung der elektrischen Belastbarkeit der Leiterbahnen wegen der Entstehung von Krischströmen die Einhaltung von verhältnismäßig großen Abständen zwischen den Leiterbahnen bedingt. Dadurch ist die Anzahl der Leiterbahnen pro Flächeneinheit begrenzt bzw. es müßte bei kleineren Kriechabständen eine geringere elektrische Belastbarkeit in Kauf genommen werden, als der Querschnitt der Leitarbahnen an sich zulassen würde.The mentioned advantages of the known printed circuit board are, on the other hand, associated with the disadvantage that full utilization of the electrical load capacity of the conductor tracks requires maintaining relatively large distances between the conductor tracks because of the generation of electrical currents. As a result, the number of conductor tracks per unit area is limited or, in the case of smaller creepage distances, a lower electrical load capacity would have to be accepted than the cross-section of the conductor tracks would allow.

409833/0489 409833/0489

Aus diesen Erkenntnissen ergibt sich die Aufgabe der Erfindung, welche darin besteht» eine Leiterplatte zu schaffen, die bezüglich der elektrischen Belastbarkeit ihrer Leiterbahnen und der erforderlichen Kriechabstände günstigere Verhältnisse aufweist» als die bekannten Leiterplatten.The object of the invention arises from these findings, which consists in creating a printed circuit board which, with regard to the electrical load capacity of its Conductor paths and the required creepage distances have more favorable ratios »than the known circuit boards.

Um dies zu erreichen, ist nach der Erfindung die Leiterplatte dadurch gekennzeichnet, daß die Leiterbahnen in die Trägerplatte eingebettet sind, so daß sie von dieser völlig umschlossen werden, wobei die Kontakt- bzw» Anschlußstellen durch Aussparungen in der Trägerplatte freigehalten sind.To achieve this, according to the invention, the circuit board is characterized in that the conductor tracks are in the carrier plate are embedded so that they can be removed from this are completely enclosed, the contact or »connection points being kept free by recesses in the carrier plate.

Bei einer derartigen Leiterplatte sind die Leiterbahnen durch den nichtleitenden Trägerplatten-Werkstoff, vorzugsweise Bpoxy-Harz, vollständig umschlossen, so dafl vergleichsweise eine höhere elektrische Belastbarkeit der Leiterbahnen bei kleineren Kriechabständen ermöglicht ist, da hier nur noch die Durchschlagsfestigkeit des Plattenwerkstoffs zu beachten ist.In such a circuit board, the conductor tracks are completely enclosed by the non-conductive carrier plate material, preferably epoxy resin, so that a comparatively higher electrical load-bearing capacity of the conductor tracks with smaller creepage distances is possible, since here only the dielectric strength of the panel material is to be observed.

Zur wirtschaftlichen Fertigung der Leiterplatte wird erfindungsgemäe In der Weise verfahren, daß die Leiterbahnen aus einer Metallplatine ausgestanzt werden, wobei ein geschlossener Halterahmen gebildet wird, mit welchen die Leiterbahnen zur Fixierung ihrer Lage verbunden sind, worauf la einer Pressform durch Umpressen der Leiterbahnen mit nichtleitendem Werkstoff \x&ä nach Entfernen des Böhmens eine Trägerplatte hergestellt wird, welche die Leiterbahnen enthält.For economical production of the circuit board, the method according to the invention is that the conductor tracks are punched out of a metal plate, a closed holding frame is formed with which the conductor tracks are connected to fix their position, whereupon a press mold is made by pressing the conductor tracks with non-conductive material \ x & ä after removing the boom, a carrier plate is produced which contains the conductor tracks.

Akte 5039 Ca) - - 3 - File 5039 Ca) - - 3 -

409833/0489409833/0489

Nach einem weiteren Vorschlag der Erfindung besteht die Platine für die Leiterbahnen aus federndem Werkstoff, z»- , Ί&ν Federbronze, wobei federnde Anschlußfahnen als Teile der gestanzten Leiterbahnen vorgesehen sein können, welche nachträglich herausbiegbar sind.According to a further proposal of the invention, the board for the conductor tracks consists of resilient material, z »-, Ί & ν spring bronze, with springy connecting lugs as parts the punched conductor tracks can be provided, which can be bent out later.

Dadurch entfällt das bisher notwendige Anschweißen« bzw.. -löten der Anschlußfahnen, Andererseits ist es in wesentlich einfacherer Weise als bei den bekannten gedruckten Leiterbahnen möglich, Kontaktnieten, Steckerstifte und ander© Kontaktelemente unmittelbar auf die Leiterbahnen bzw. die dafür vorgesehenen. Stollen dsr Platine zu schweißen oder zn löten„This eliminates the previously necessary welding or soldering of the connecting lugs. On the other hand, it is much easier than with the known printed conductor tracks to place contact rivets, plug pins and other contact elements directly on the conductor tracks or on the ones provided for them. To weld or zn studs dsr board solder "

Die erfindungsgemäSe Leiterplatte eignet sich sowohl für die Bestückung von elektrischen als auch elektronischen Bauelementen.The circuit board according to the invention is suitable for both the assembly of electrical and electronic components.

Akte 5039 Ca)File 5039 Ca)

409833/0489409833/0489

In der Zeichnung ist ein Ausführungsbeispiel der Erfindung in vergrößertem Maßstab dargestellt.In the drawing is an embodiment of the invention shown on an enlarged scale.

Es zeigen Fig. 1 die Ansicht der Leiterplatte,1 shows the view of the circuit board,

Fig. 2 den Schnitt A-A aus Fig« I,Fig. 2 the section A-A from Fig «I,

Fig. 3 eine ötirnansicht,Fig. 3 is an end view,

Fig. 4 die Ansicht der ausgestanzten Fiatine.4 shows the view of the punched-out fiatine.

Die in Fig. 1 bis 3 dargestellte fertige Leiterplatte besteht aus der nichtleitenden, strichpunktiert gezeichneten Trägerplatte i und den auegestanzten Leiterbahnen 2, welche γοα Werkstoff der Trägerplatte vollständig umschlossen sind. Die Kontakt- bzw. Anschlußstellen 3, 4, 5, 6, ?, 8, 9, 10, sind durch Aussparungen in der Trägerplatte freigehalten. Weitere Ausnehmungen Il sind für die Anschlußfahnen 12 vorgesehen, während an den Stellen 9, 10 die Steckerstifte 13 angenietet sind. Bei 4" ist z.B, eine Kontakt zunge 14 angelötet a welche mit einem Kontaktnocken 15 zusammenwirkt, der bei 3 mit einer Leiterbahn verbunden ist.The finished printed circuit board shown in FIGS. 1 to 3 consists of the non-conductive, dash-dotted carrier plate i and the punched-out conductor tracks 2, which γοα material of the carrier plate are completely enclosed. The contact or connection points 3, 4, 5, 6,?, 8, 9, 10 are kept free by recesses in the carrier plate. Further recesses II are provided for the connection lugs 12, while the connector pins 13 are riveted at the points 9, 10. At 4 ″, for example, a contact tongue 14 is soldered on which interacts with a contact cam 15 which is connected at 3 to a conductor track.

Im vorliegenden Beispiel handelt es sich um eine Leiterplatte für Starkstrom, welche alt einem Spannungsumsehalter versehen ist. Dieser wird durch einen Drehknopf 17 betätigt, welcher auf seiner Kontaktseite Kontaktbügel Id besitzt, die in bekannter Weise mit den an den Aussparungen 5, 6.,. 7» 3, zugänglichen Leiterbahneteilen geschaltet werden können*In the present example it is a circuit board for high-voltage currents, which are old with a voltage converter is. This is operated by a rotary knob 17, which has on its contact side contact bracket Id, which is known in Way with the recesses 5, 6.,. 7 »3, accessible Track parts can be switched *

In Fig. 4 ist die ausgestanzte Platin© P for ihrer Einbettung in die Isoliermasse der Trägerplatte gezeigt· Dabei sind einzelne Leiterbahnen 2 zur Fixierung ihrer Lag® mit dam Halterahmen 20 verbunden. Die Trägerplatte 1, deren Umrisse strichpunktiert eingezeichnet QiM., ist s@ B®g@®wäM®fcg -QpP die Teil® Ei der Platine P ä@u-Band ο,θρ frägerplatt® i-überragen» so4 shows the punched-out platinum © P before it is embedded in the insulating compound of the carrier plate. Individual conductor tracks 2 are connected to the holding frame 20 to fix their Lag®. The carrier plate 1, the outline of which is drawn in dash-dotted lines QiM., Is s @ B®g @ ®wäM®fcg -QpP the part® Ei of the board Pä @ u -Band ο, θρ frägerplatt® i-protrude »so

Akte SO39 (a) - 5 - File SO39 (a) - 5 -

409833/0489 _ '409833/0489 _ '

daß sie nach dem Abtrennen des Halterahmens 20 zu den Anschlußfahnen 12 geformt werden können, welche in bekannter Weise mit den Kontaktbügeln 22 (Pig. 2 und Pig. 3) versehen sind.that they after the separation of the holding frame 20 to the terminal lugs 12 can be formed, which are provided in a known manner with the contact clips 22 (Pig. 2 and Pig. 3) are.

Wie aus Figo 1 und Pig«, k hervorgeht, welche die Leiterplatte im Maßstab 2 : 1 zeigen, können die Kriechabstände (z.B. *a") zwischen den Leiterbahnen wesentlich kleiner gehalten werden, als dies bei den bekannten Leiterbahnen bei der gleichen elektrischen Belastbarkeit möglich ist.As can be seen from Fig. 1 and Pig, k , which show the printed circuit board on a scale of 2: 1, the creepage distances (e.g. * a ") between the conductor tracks can be kept much smaller than is possible with the known conductor tracks with the same electrical load capacity is.

Akte 5039 (a)File 5039 (a)

4Q9833/IU894Q9833 / IU89

Claims (3)

AnsprücheExpectations 1. Leiterplatte für elektrische Schaltungen, bestehend aus stromleitenden Leiterbahnen, die Bestandteil einer Trägerplatte aus nichtleitendem Werkstoff sind« dadurch gekennzeichnet, daß die Leiterbahnen (2) In die Trägerplatte (1) eingebettet sind, so daß sie von dieser völlig umschlossen werden, wobei die Kontaktbzw. Anschlußstellen durch Aussparungen in u&r Trägerplatte freigehalten sind.1. Printed circuit board for electrical circuits, consisting of conductive tracks that are part of a carrier plate made of non-conductive material «characterized in that the conductor tracks (2) are embedded in the carrier plate (1) so that they are completely enclosed by this, the Contact or Connection points are kept free by recesses in u & r carrier plate. 2. Verfahren zur Herstellung der Leiterplatte nach Anspruch I1 dadurch gekennzeichnet, daß die Leiterbahnen (2) aus einer Metallplatine (?) ausgestanzt wer-άβη{ wobei ein geschlossener Halterahmen (20) gebildet wird, mit welchem die Leiterbahnen zur Fixierung ihrer Lage verbunden sind, worauf in einer Pressform durch Umpressen der Leiterbahnen mit nichtleitendem Werkstoff und nach Entfernen des Rahmens eine Trägerplatte hergestellt wird, welche die Leiterbahnen enthält. 2. A method for producing the circuit board according to claim I 1, characterized in that the conductor tracks (2) punched out of a metal plate (?) Who-άβη { wherein a closed holding frame (20) is formed, with which the conductor tracks are connected to fix their position are, whereupon a carrier plate is produced in a mold by pressing around the conductor tracks with non-conductive material and after removing the frame, which contains the conductor tracks. 3. Leiterplatte nach den vorhergehenden Ansprüchen, dadurch gekennzeichnet, dad die Platine für die Leiterbahnen aus federndem Werkstoff, z.B. Pederbrojä^e, besteht, wobei federnde Anschlußfahnen (12) als Teile der gestanzten Leiterbahnen vorgesehen sein können, welche nachträglich herausbiegbar sind.3. Circuit board according to the preceding claims, characterized marked, because the circuit board for the conductor tracks is made of resilient material, e.g. Pederbrojä ^ e, consists, wherein resilient connection lugs (12) can be provided as parts of the punched conductor tracks, which can be bent out later. Akte 5039 Ca )File 5039 Ca) 4098 33/04 894098 33/04 89
DE19732305883 1973-02-07 1973-02-07 CIRCUIT BOARD Pending DE2305883A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19732305883 DE2305883A1 (en) 1973-02-07 1973-02-07 CIRCUIT BOARD
NL7303597A NL7303597A (en) 1973-02-07 1973-03-15
JP3151273A JPS5018977A (en) 1973-02-07 1973-03-20
FR7311825A FR2216750B1 (en) 1973-02-07 1973-04-02
GB1684673A GB1426629A (en) 1973-02-07 1973-04-09 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732305883 DE2305883A1 (en) 1973-02-07 1973-02-07 CIRCUIT BOARD

Publications (1)

Publication Number Publication Date
DE2305883A1 true DE2305883A1 (en) 1974-08-15

Family

ID=5871175

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732305883 Pending DE2305883A1 (en) 1973-02-07 1973-02-07 CIRCUIT BOARD

Country Status (5)

Country Link
JP (1) JPS5018977A (en)
DE (1) DE2305883A1 (en)
FR (1) FR2216750B1 (en)
GB (1) GB1426629A (en)
NL (1) NL7303597A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2735124A1 (en) * 1976-08-06 1978-02-09 Sev Alternateurs METHOD FOR MANUFACTURING AN ELECTRICAL CIRCUIT, CIRCUIT BOARD MANUFACTURED BY THE METHOD AND USE OF A CIRCUIT BOARD MANUFACTURED BY THE METHOD FOR AUTOMOTIVE RECTIFIER
EP0127689A1 (en) * 1983-05-19 1984-12-12 Ibm Deutschland Gmbh Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
DE3605342A1 (en) * 1985-02-22 1986-09-04 AMP-Akzo Corp., Newark, Del. SUITABLE MOLDED BODIES, METALLIZED MOLDED BODIES AND METHOD FOR THE PRODUCTION THEREOF FOR APPLYING FIXED METAL COVERINGS
EP0216466A2 (en) * 1985-09-03 1987-04-01 Molex Incorporated Stamped circuitry assembly
DE3641995C1 (en) * 1986-12-09 1988-05-19 Philips Patentverwaltung Process for the production of printed circuits
DE3924176A1 (en) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Prodn. of printed circuit panel by stamping conductors in meta strip - moving strip into injection mould and cutting conductors, and injecting polymer encapsulate
DE4313006A1 (en) * 1993-04-21 1994-11-03 Duerrwaechter E Dr Doduco Electrical conductor track made of metal
US5407622A (en) * 1985-02-22 1995-04-18 Smith Corona Corporation Process for making metallized plastic articles
DE102009012088A1 (en) * 2009-03-06 2010-09-09 Hella Kgaa Hueck & Co. Igniter for a high-pressure gas discharge lamp

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479081U (en) * 1977-11-15 1979-06-05
JPS55111015A (en) * 1979-02-20 1980-08-27 Sanyo Electric Co Feeder for electric equipment and method of manufacturing same
JPS59147448A (en) * 1983-02-12 1984-08-23 Fujitsu Ltd Lead frame for loading semiconductor element and semiconductor device manufactured by using said lead frame and manufacture thereof
DE3427908C2 (en) * 1984-07-28 1986-10-02 Gebrüder Junghans GmbH, 7230 Schramberg Method for producing the circuit carrier of an electromechanical clockwork and circuit carrier that can be produced by such a method
FR2574222B1 (en) * 1984-12-04 1987-05-29 Sintra METHOD FOR MANUFACTURING A SUBSTRATE FOR A HYBRID CIRCUIT HAVING WEAKLY RESISTIVE CONNECTIONS
FR2584862B1 (en) * 1985-07-12 1988-05-20 Eurotechnique Sa PROCESS FOR THE CONTINUOUS MANUFACTURE OF MICROMODULES FOR CARDS CONTAINING COMPONENTS, CONTINUOUS BAND OF MICROMODULES AND MICROMODULES CARRIED OUT BY SUCH A PROCESS
FR2590052B1 (en) * 1985-11-08 1991-03-01 Eurotechnique Sa METHOD FOR RECYCLING A CARD COMPRISING A COMPONENT, CARD PROVIDED FOR RECYCLE
FR2590051B1 (en) * 1985-11-08 1991-05-17 Eurotechnique Sa CARD COMPRISING A COMPONENT AND MICROMODULE WITH SIDING CONTACTS
KR0165544B1 (en) * 1990-03-05 1999-03-20 야마다 로꾸이찌 Electronic sound producing device
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
EP0836113A3 (en) * 1996-10-14 2000-08-02 Konica Corporation Lens-fitted film unit with electronic flash

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2735124A1 (en) * 1976-08-06 1978-02-09 Sev Alternateurs METHOD FOR MANUFACTURING AN ELECTRICAL CIRCUIT, CIRCUIT BOARD MANUFACTURED BY THE METHOD AND USE OF A CIRCUIT BOARD MANUFACTURED BY THE METHOD FOR AUTOMOTIVE RECTIFIER
EP0127689A1 (en) * 1983-05-19 1984-12-12 Ibm Deutschland Gmbh Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
DE3605342A1 (en) * 1985-02-22 1986-09-04 AMP-Akzo Corp., Newark, Del. SUITABLE MOLDED BODIES, METALLIZED MOLDED BODIES AND METHOD FOR THE PRODUCTION THEREOF FOR APPLYING FIXED METAL COVERINGS
US5407622A (en) * 1985-02-22 1995-04-18 Smith Corona Corporation Process for making metallized plastic articles
EP0216466A2 (en) * 1985-09-03 1987-04-01 Molex Incorporated Stamped circuitry assembly
EP0216466A3 (en) * 1985-09-03 1988-04-06 Molex Incorporated Stamped circuitry assembly
EP0271163A2 (en) * 1986-12-09 1988-06-15 Philips Patentverwaltung GmbH Manufacturing method of electrical circuit boards
EP0271163A3 (en) * 1986-12-09 1988-12-28 Philips Patentverwaltung Gmbh Manufacturing method of electrical circuit boards
DE3641995C1 (en) * 1986-12-09 1988-05-19 Philips Patentverwaltung Process for the production of printed circuits
DE3924176A1 (en) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Prodn. of printed circuit panel by stamping conductors in meta strip - moving strip into injection mould and cutting conductors, and injecting polymer encapsulate
DE4313006A1 (en) * 1993-04-21 1994-11-03 Duerrwaechter E Dr Doduco Electrical conductor track made of metal
DE4313006C2 (en) * 1993-04-21 1998-05-20 Duerrwaechter E Dr Doduco Electrical conductor track, in particular made of bimetal
DE102009012088A1 (en) * 2009-03-06 2010-09-09 Hella Kgaa Hueck & Co. Igniter for a high-pressure gas discharge lamp

Also Published As

Publication number Publication date
GB1426629A (en) 1976-03-03
JPS5018977A (en) 1975-02-27
NL7303597A (en) 1974-08-09
FR2216750A1 (en) 1974-08-30
FR2216750B1 (en) 1979-06-22

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