JPS5018977A - - Google Patents

Info

Publication number
JPS5018977A
JPS5018977A JP3151273A JP3151273A JPS5018977A JP S5018977 A JPS5018977 A JP S5018977A JP 3151273 A JP3151273 A JP 3151273A JP 3151273 A JP3151273 A JP 3151273A JP S5018977 A JPS5018977 A JP S5018977A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3151273A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5018977A publication Critical patent/JPS5018977A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP3151273A 1973-02-07 1973-03-20 Pending JPS5018977A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732305883 DE2305883A1 (en) 1973-02-07 1973-02-07 CIRCUIT BOARD

Publications (1)

Publication Number Publication Date
JPS5018977A true JPS5018977A (en) 1975-02-27

Family

ID=5871175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3151273A Pending JPS5018977A (en) 1973-02-07 1973-03-20

Country Status (5)

Country Link
JP (1) JPS5018977A (en)
DE (1) DE2305883A1 (en)
FR (1) FR2216750B1 (en)
GB (1) GB1426629A (en)
NL (1) NL7303597A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479081U (en) * 1977-11-15 1979-06-05
JPS55111015A (en) * 1979-02-20 1980-08-27 Sanyo Electric Co Feeder for electric equipment and method of manufacturing same

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2361007A1 (en) * 1976-08-06 1978-03-03 Sev Marchal METHOD OF MANUFACTURING AN ELECTRICAL CIRCUIT IN PARTICULAR FOR A MOTOR VEHICLE ALTERNATOR RECTIFIER BRIDGE
JPS59147448A (en) * 1983-02-12 1984-08-23 Fujitsu Ltd Lead frame for loading semiconductor element and semiconductor device manufactured by using said lead frame and manufacture thereof
EP0127689B1 (en) * 1983-05-19 1987-08-26 Ibm Deutschland Gmbh Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
DE3427908C2 (en) * 1984-07-28 1986-10-02 Gebrüder Junghans GmbH, 7230 Schramberg Method for producing the circuit carrier of an electromechanical clockwork and circuit carrier that can be produced by such a method
FR2574222B1 (en) * 1984-12-04 1987-05-29 Sintra METHOD FOR MANUFACTURING A SUBSTRATE FOR A HYBRID CIRCUIT HAVING WEAKLY RESISTIVE CONNECTIONS
US5407622A (en) * 1985-02-22 1995-04-18 Smith Corona Corporation Process for making metallized plastic articles
GB2171355B (en) * 1985-02-22 1989-11-22 Kollmorgen Tech Corp Molded articles suitable for adherent metallization, molded metallized articles and processes for making the same
FR2584862B1 (en) * 1985-07-12 1988-05-20 Eurotechnique Sa PROCESS FOR THE CONTINUOUS MANUFACTURE OF MICROMODULES FOR CARDS CONTAINING COMPONENTS, CONTINUOUS BAND OF MICROMODULES AND MICROMODULES CARRIED OUT BY SUCH A PROCESS
US4659157A (en) * 1985-09-03 1987-04-21 Molex Incorporated Stamped circuitry assembly
FR2590051B1 (en) * 1985-11-08 1991-05-17 Eurotechnique Sa CARD COMPRISING A COMPONENT AND MICROMODULE WITH SIDING CONTACTS
FR2590052B1 (en) * 1985-11-08 1991-03-01 Eurotechnique Sa METHOD FOR RECYCLING A CARD COMPRISING A COMPONENT, CARD PROVIDED FOR RECYCLE
DE3641995C1 (en) * 1986-12-09 1988-05-19 Philips Patentverwaltung Process for the production of printed circuits
DE3924176A1 (en) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Prodn. of printed circuit panel by stamping conductors in meta strip - moving strip into injection mould and cutting conductors, and injecting polymer encapsulate
KR0165544B1 (en) * 1990-03-05 1999-03-20 야마다 로꾸이찌 Electronic sound producing device
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
DE4313006C2 (en) * 1993-04-21 1998-05-20 Duerrwaechter E Dr Doduco Electrical conductor track, in particular made of bimetal
EP0836113A3 (en) * 1996-10-14 2000-08-02 Konica Corporation Lens-fitted film unit with electronic flash
DE102009012088A1 (en) * 2009-03-06 2010-09-09 Hella Kgaa Hueck & Co. Igniter for a high-pressure gas discharge lamp

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479081U (en) * 1977-11-15 1979-06-05
JPS55111015A (en) * 1979-02-20 1980-08-27 Sanyo Electric Co Feeder for electric equipment and method of manufacturing same

Also Published As

Publication number Publication date
FR2216750A1 (en) 1974-08-30
DE2305883A1 (en) 1974-08-15
FR2216750B1 (en) 1979-06-22
NL7303597A (en) 1974-08-09
GB1426629A (en) 1976-03-03

Similar Documents

Publication Publication Date Title
AU476761B2 (en)
FR2239709B1 (en)
AR201235Q (en)
AR201231Q (en)
AU474593B2 (en)
AU474838B2 (en)
FR2216750B1 (en)
AU476714B2 (en)
AR201229Q (en)
AU476696B2 (en)
AR199451A1 (en)
AU477823B2 (en)
AR195948A1 (en)
AR195311A1 (en)
AU476873B1 (en)
AR200885A1 (en)
AR196382A1 (en)
AR197627A1 (en)
AR193950A1 (en)
AR210729A1 (en)
AU471461B2 (en)
AR196123Q (en)
AR196212Q (en)
AU479522A (en)
AU479420A (en)