FR2216750B1 - - Google Patents
Info
- Publication number
- FR2216750B1 FR2216750B1 FR7311825A FR7311825A FR2216750B1 FR 2216750 B1 FR2216750 B1 FR 2216750B1 FR 7311825 A FR7311825 A FR 7311825A FR 7311825 A FR7311825 A FR 7311825A FR 2216750 B1 FR2216750 B1 FR 2216750B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19732305883 DE2305883A1 (de) | 1973-02-07 | 1973-02-07 | Leiterplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2216750A1 FR2216750A1 (fr) | 1974-08-30 |
FR2216750B1 true FR2216750B1 (fr) | 1979-06-22 |
Family
ID=5871175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7311825A Expired FR2216750B1 (fr) | 1973-02-07 | 1973-04-02 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5018977A (fr) |
DE (1) | DE2305883A1 (fr) |
FR (1) | FR2216750B1 (fr) |
GB (1) | GB1426629A (fr) |
NL (1) | NL7303597A (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2361007A1 (fr) * | 1976-08-06 | 1978-03-03 | Sev Marchal | Procede de fabrication d'un circuit electrique notamment pour un pont redresseur d'alternateur de vehicule automobile |
JPS5479081U (fr) * | 1977-11-15 | 1979-06-05 | ||
JPS55111015A (en) * | 1979-02-20 | 1980-08-27 | Sanyo Electric Co | Feeder for electric equipment and method of manufacturing same |
JPS59147448A (ja) * | 1983-02-12 | 1984-08-23 | Fujitsu Ltd | 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法 |
EP0127689B1 (fr) * | 1983-05-19 | 1987-08-26 | Ibm Deutschland Gmbh | Procédé pour la fabrication de circuits imprimés ayant des conducteurs métalliques incrustés dans le support isolant |
DE3427908C2 (de) * | 1984-07-28 | 1986-10-02 | Gebrüder Junghans GmbH, 7230 Schramberg | Verfahren zum Herstellen des Schaltungsträgers eines elektromechanischen Uhrwerks und nach solchem Verfahren herstellbarer Schaltungsträger |
FR2574222B1 (fr) * | 1984-12-04 | 1987-05-29 | Sintra | Procede de fabrication d'un substrat pour circuit hybride comportant des connexions faiblement resistives |
GB2171355B (en) * | 1985-02-22 | 1989-11-22 | Kollmorgen Tech Corp | Molded articles suitable for adherent metallization, molded metallized articles and processes for making the same |
US5407622A (en) * | 1985-02-22 | 1995-04-18 | Smith Corona Corporation | Process for making metallized plastic articles |
FR2584862B1 (fr) * | 1985-07-12 | 1988-05-20 | Eurotechnique Sa | Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede |
US4659157A (en) * | 1985-09-03 | 1987-04-21 | Molex Incorporated | Stamped circuitry assembly |
FR2590052B1 (fr) * | 1985-11-08 | 1991-03-01 | Eurotechnique Sa | Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee |
FR2590051B1 (fr) * | 1985-11-08 | 1991-05-17 | Eurotechnique Sa | Carte comportant un composant et micromodule a contacts de flanc |
DE3641995C1 (de) * | 1986-12-09 | 1988-05-19 | Philips Patentverwaltung | Verfahren zum Herstellen von gedruckten Schaltungen |
DE3924176A1 (de) * | 1988-07-26 | 1990-02-01 | Steinmueller Kg Atlanta Kabel | Verfahren zur herstellung einer leiterplatine |
KR0165544B1 (ko) * | 1990-03-05 | 1999-03-20 | 야마다 로꾸이찌 | 전자발음장치 |
US5343616B1 (en) * | 1992-02-14 | 1998-12-29 | Rock Ltd | Method of making high density self-aligning conductive networks and contact clusters |
US5584120A (en) * | 1992-02-14 | 1996-12-17 | Research Organization For Circuit Knowledge | Method of manufacturing printed circuits |
DE4313006C2 (de) * | 1993-04-21 | 1998-05-20 | Duerrwaechter E Dr Doduco | Elektrische Leiterbahn, insbesondere aus Bimetall |
EP0836113A3 (fr) * | 1996-10-14 | 2000-08-02 | Konica Corporation | Emballage de film photographique muni d'un objectif et d'une unité de flash électronique |
DE102009012088A1 (de) * | 2009-03-06 | 2010-09-09 | Hella Kgaa Hueck & Co. | Zündgerät für eine Hochdruckgasentladungslampe |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3177103A (en) * | 1961-09-18 | 1965-04-06 | Sauders Associates Inc | Two pass etching for fabricating printed circuitry |
-
1973
- 1973-02-07 DE DE19732305883 patent/DE2305883A1/de active Pending
- 1973-03-15 NL NL7303597A patent/NL7303597A/xx not_active Application Discontinuation
- 1973-03-20 JP JP3151273A patent/JPS5018977A/ja active Pending
- 1973-04-02 FR FR7311825A patent/FR2216750B1/fr not_active Expired
- 1973-04-09 GB GB1684673A patent/GB1426629A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2216750A1 (fr) | 1974-08-30 |
DE2305883A1 (de) | 1974-08-15 |
GB1426629A (en) | 1976-03-03 |
NL7303597A (fr) | 1974-08-09 |
JPS5018977A (fr) | 1975-02-27 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |