DE8912914U1 - - Google Patents

Info

Publication number
DE8912914U1
DE8912914U1 DE8912914U DE8912914U DE8912914U1 DE 8912914 U1 DE8912914 U1 DE 8912914U1 DE 8912914 U DE8912914 U DE 8912914U DE 8912914 U DE8912914 U DE 8912914U DE 8912914 U1 DE8912914 U1 DE 8912914U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8912914U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ivo Irion & Vosseler & Co 7730 Villingen-Schwenningen De GmbH
Original Assignee
Ivo Irion & Vosseler & Co 7730 Villingen-Schwenningen De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ivo Irion & Vosseler & Co 7730 Villingen-Schwenningen De GmbH filed Critical Ivo Irion & Vosseler & Co 7730 Villingen-Schwenningen De GmbH
Priority to DE8912914U priority Critical patent/DE8912914U1/de
Publication of DE8912914U1 publication Critical patent/DE8912914U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
DE8912914U 1989-11-02 1989-11-02 Expired DE8912914U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8912914U DE8912914U1 (en) 1989-11-02 1989-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8912914U DE8912914U1 (en) 1989-11-02 1989-11-02

Publications (1)

Publication Number Publication Date
DE8912914U1 true DE8912914U1 (en) 1989-12-28

Family

ID=6844201

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8912914U Expired DE8912914U1 (en) 1989-11-02 1989-11-02

Country Status (1)

Country Link
DE (1) DE8912914U1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634888A1 (en) * 1993-07-15 1995-01-18 Siemens Aktiengesellschaft Plug-in unit, particularly relay module for motor vehicles
DE4327584A1 (en) * 1993-08-17 1995-02-23 Bayerische Motoren Werke Ag Electric drive unit
WO1996008023A1 (en) * 1994-09-09 1996-03-14 Siemens Aktiengesellschaft Process for contacting power current connection elements of an electric component and component produced using this process
EP0722264A2 (en) * 1995-01-13 1996-07-17 Kabushiki Kaisha Toshiba Circuit board & circuit board assembly
DE19615432A1 (en) * 1996-04-19 1997-10-23 Abb Patent Gmbh Mounting plate for electric components
DE19707709C1 (en) * 1997-02-26 1998-04-16 Siemens Ag Relay modules circuit board e.g. for automobile
DE10101957A1 (en) * 2001-01-17 2002-07-18 Delphi Tech Inc Electromechanical part has stamped and/or molded electrically conducting conductor frame encased in plastic, conducting tracks applied to plastic body, IC(s) connected to frame/track(s)
DE10154234A1 (en) * 2001-11-07 2003-05-22 Kostal Leopold Gmbh & Co Kg Arrangement consisting of a panel-like module and a connection unit, connection unit for such an arrangement, method for creating such an arrangement and device for producing such an arrangement
DE10226766A1 (en) * 2002-06-14 2004-01-29 Gerhard Geiger Gmbh & Co Drive device e.g. for window shutters, includes capacitor with central aperture for through-running output shaft
DE4436523B4 (en) * 1994-10-13 2007-04-26 Siemens Ag Method for producing an electronic device and speed sensor with an electronic circuit
DE4404986B4 (en) * 1994-02-17 2008-08-21 Robert Bosch Gmbh Device for contacting electrical conductors and method for producing such a device
DE102005049975B4 (en) * 2005-10-17 2008-11-27 Kiekert Ag Component carrier with a strip conductor structure
DE102008055836A1 (en) 2008-11-04 2010-05-12 Tyco Electronics Amp Gmbh component carrier
DE102011102484A1 (en) * 2011-05-24 2012-11-29 Jumatech Gmbh Circuit board with molded part and method for its production

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634888A1 (en) * 1993-07-15 1995-01-18 Siemens Aktiengesellschaft Plug-in unit, particularly relay module for motor vehicles
US5446626A (en) * 1993-07-15 1995-08-29 Siemens Aktiengesellschaft Pluggable assembly, particularly a relay module for motor vehicles
DE4327584A1 (en) * 1993-08-17 1995-02-23 Bayerische Motoren Werke Ag Electric drive unit
DE4404986B4 (en) * 1994-02-17 2008-08-21 Robert Bosch Gmbh Device for contacting electrical conductors and method for producing such a device
WO1996008023A1 (en) * 1994-09-09 1996-03-14 Siemens Aktiengesellschaft Process for contacting power current connection elements of an electric component and component produced using this process
US5847937A (en) * 1994-09-09 1998-12-08 Siemens Aktiengesellschaft Method for contacting high-current connecting elements of an electrical component, and assembly made by such a method
DE4436523B4 (en) * 1994-10-13 2007-04-26 Siemens Ag Method for producing an electronic device and speed sensor with an electronic circuit
EP0722264A2 (en) * 1995-01-13 1996-07-17 Kabushiki Kaisha Toshiba Circuit board & circuit board assembly
EP0722264A3 (en) * 1995-01-13 1997-12-29 Kabushiki Kaisha Toshiba Circuit board & circuit board assembly
DE19615432A1 (en) * 1996-04-19 1997-10-23 Abb Patent Gmbh Mounting plate for electric components
EP0863530A2 (en) * 1997-02-26 1998-09-09 Siemens Aktiengesellschaft Electric circuit board and method of producing the same
US6049043A (en) * 1997-02-26 2000-04-11 Siemens Aktiengesellschaft Printed circuit board
EP0863530A3 (en) * 1997-02-26 1999-05-06 Siemens Aktiengesellschaft Electric circuit board and method of producing the same
DE19707709C1 (en) * 1997-02-26 1998-04-16 Siemens Ag Relay modules circuit board e.g. for automobile
DE10101957A1 (en) * 2001-01-17 2002-07-18 Delphi Tech Inc Electromechanical part has stamped and/or molded electrically conducting conductor frame encased in plastic, conducting tracks applied to plastic body, IC(s) connected to frame/track(s)
DE10154234A1 (en) * 2001-11-07 2003-05-22 Kostal Leopold Gmbh & Co Kg Arrangement consisting of a panel-like module and a connection unit, connection unit for such an arrangement, method for creating such an arrangement and device for producing such an arrangement
US7002813B2 (en) 2001-11-07 2006-02-21 Leopold Kostal Gmbh & Co. Kg Assembly comprised of a panel-like constructed module and of a connection unit, production method and device
DE10226766A1 (en) * 2002-06-14 2004-01-29 Gerhard Geiger Gmbh & Co Drive device e.g. for window shutters, includes capacitor with central aperture for through-running output shaft
DE10226766B4 (en) * 2002-06-14 2007-01-18 Gerhard Geiger Gmbh & Co driving device
DE102005049975B4 (en) * 2005-10-17 2008-11-27 Kiekert Ag Component carrier with a strip conductor structure
DE102005049975C5 (en) * 2005-10-17 2011-07-28 Kiekert AG, 42579 Component carrier with a strip conductor structure
EP1776003B1 (en) * 2005-10-17 2014-10-01 Kiekert Aktiengesellschaft Car door lock
DE102008055836A1 (en) 2008-11-04 2010-05-12 Tyco Electronics Amp Gmbh component carrier
WO2010052202A1 (en) * 2008-11-04 2010-05-14 Tyco Electronics Amp Gmbh Component support
DE102008055836B4 (en) * 2008-11-04 2010-08-19 Tyco Electronics Amp Gmbh component carrier
DE102011102484A1 (en) * 2011-05-24 2012-11-29 Jumatech Gmbh Circuit board with molded part and method for its production
DE102011102484B4 (en) * 2011-05-24 2020-03-05 Jumatech Gmbh Printed circuit board with molded part and process for its production
US10736214B2 (en) 2011-05-24 2020-08-04 Jumatech Gmbh Printed circuit board having a molded part and method for the production thereof

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