JPS60180664A - Soldering method - Google Patents

Abstract

PURPOSE:To eliminate uneven soldering and to solder surely a semiconductor element to a substrate by positioning the semiconductor element via solder onto the substrate by using a jig then conveying the substrate in a reflow furnace along a guide plate and applying oscillation thereto. CONSTITUTION:A semiconductor element 7 is imposed via solder 6 on a substrate 8 and is positioned and set by a jig 5 thereto. The substrate 8 on which said element is set is placed on a conveying belt 2 and is conveyed along guide plates 3a, 3b in the reflow zone in a reflow furnace 1. Any of the jig 5, the substrate 8 or the element 7 is oscillated by an oscillator 4 connected to the plate 3a via said plate. The solder 6 is thereby melted and the soldering point is oscillated, by which the wettability with the solder is improved and the soldering is assured without generating the nonuniformly soldered layer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a soldering method, and particularly relates to a method for soldering a substrate and a semiconductor element.
The present invention relates to a method of this kind for reliably performing soldering in a reflow oven.

[Technical background of the invention M] Conventionally, a semiconductor element is fixed on a substrate by soldering. Soldering first.

The semiconductor element is set on a jig for positioning the semiconductor element on the substrate, the jig is placed on a predetermined position of the substrate to be soldered, and the semiconductor element is placed on the substrate via the solder. This substrate is transported in a reflow oven and heated in a reflow zone (heating area) to melt the solder between the semiconductor element and the substrate, thereby performing soldering.

[Problems with the background technology] However, in the conventional method, the solder is simply heated by simply heating the substrate, so that semi-IJ between the semiconductor element and the substrate is
(There is a problem that the wettability of the material is poor and it does not mix well well, and there is also a problem that unevenness tends to occur in the half H1 layer between the semiconductor element and the substrate.

[Purpose of the invention] The present invention was made in view of the above-mentioned conventional difficulties.

When transporting through the reflow oven and performing soldering.

By vibrating either the jig, the board, the semiconductor element, or the guide plate, we provide a soldering method that vibrates the soldering area, improves the wettability of the solder, and removes unevenness in the solder layer. It is something to do.

[Ji! In order to achieve the above object, the soldering method according to the present invention involves transferring the semiconductor element to the substrate when transporting it in a reflow oven and attaching the semiconductor wire t to the substrate in half H1. The semiconductor element is set on a jig for positioning and placed on the substrate via a semi-LLI, and the substrate is set on a guide plate installed on the reflow oven and transported, and the jig, This vibrates either the substrate, the semiconductor element, or the guide plate.

Embodiments of the invention] Part 1: Surprising results of the invention/Ii! An example will be explained with reference to the drawings.

That is, the soldering method of the present invention is a half-H soldering method as shown in the drawings.
In the drawing, a progressive belt 2 is provided in the reflow oven 1, and guide plates 3a, 3b are installed above near the reflow zone (heating area) of the reflow oven 1. is fixedly installed, and an oscillator 4 is connected to the guide plate 3a.

Then, the substrate 8 on which the semiconductor element 7 is mounted is conveyed by the jig 5 via the solder 6 on the conveyor bell 1-2.

Soldering with such a configuration can be performed at half IL1 (
In the method, first, the semiconductor cord 7 is placed in the jig 5. The jig 5 is for determining the placement position of the semiconductor element 7 on the substrate 8, and the solder 6 is placed in advance at the position on the substrate 8. Then, the substrate 8 on which the semiconductor cables 7 set in the jig 5 are placed in a fixed position is placed on the conveyor belt 2 in a reflow oven and conveyed. When the substrate 8 is conveyed to near A1 of the reflow zone of the reflow oven 1, it is moved by the guide plates 3a and 3b.

At this time, the oscillator 4 is operated to vibrate the guide plate 3a, thereby vibrating the entire board 8. At the reflow zone position, the board 8 is heated to melt the solder and remove the solder.
At this time, the vibration of the guide plate 3a vibrates and shakes the half-H444 portions, thereby causing the melted solder to spread over the entire contact surface on the substrate 8 of the semiconductor element 7. Therefore, the RML resistance of the solder is improved,
It is possible to make half 1+j without causing unevenness in the solder layer.

In the above embodiment, only the guide plate 3a is vibrated, but both the guide plates 3a and 3b may be vibrated. A similar effect can be obtained by applying vibration to some JL of the semiconductor cable 7 and the substrate 8.

Claims (1)

[Claims] The semiconductor device is transferred in a reflow oven, and half of the semiconductor device is placed on the substrate.
(For bonding, the semiconductor element P is set on a jig for positioning it on the substrate, the semiconductor element is placed on the substrate via a semi-ta, and the substrate is placed on the reflow oven. While transporting along the guide board, Ou
A half-mounted method characterized by vibrating any one of a recording jig, a substrate, a semiconductor element, or a guide plate.