JPH0350746A - Die bonding equipment - Google Patents
Die bonding equipmentInfo
- Publication number
- JPH0350746A JPH0350746A JP18555189A JP18555189A JPH0350746A JP H0350746 A JPH0350746 A JP H0350746A JP 18555189 A JP18555189 A JP 18555189A JP 18555189 A JP18555189 A JP 18555189A JP H0350746 A JPH0350746 A JP H0350746A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- heat sink
- bonding material
- solder
- planer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 abstract description 33
- 238000011109 contamination Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005201 scrubbing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はダイボンディング装置に関し、特にパワーＩＣ
等のチップから発生した熱を放散させるために、このチ
ップと回路基板の間に介装されるヒートシンクにチップ
をボンディングするダイボンディング装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a die bonding device, particularly for power IC.
The present invention relates to a die bonding apparatus for bonding a chip to a heat sink interposed between the chip and a circuit board in order to dissipate heat generated from the chip.
従来の技術
従来のダイボンディング装置は、第４図に示すように、
ヒートシンク２３を、ヒータ２２にて加熱されたトンネ
ル炉２１内に挿入して搬送しながら加熱し、このトンネ
ル炉２１の所定位置に形成した開口部２４の上方にデイ
スペンサ２６を配置し、このデイスペンサ２６からヒー
トシンク２３上に所定量の溶融半田２５を滴下して塗布
し、その後このデイスペンサ２６の後方位置でトンネル
炉２１の土壁に形成した開口部２７から、チップ２８を
吸着したコレット２９にてヒートシンク２３上にチップ
２８を装着している。BACKGROUND ART A conventional die bonding apparatus, as shown in FIG.
The heat sink 23 is inserted into the tunnel furnace 21 heated by the heater 22 and heated while being transported, and the dispenser 26 is placed above the opening 24 formed at a predetermined position of the tunnel furnace 21. A predetermined amount of molten solder 25 is dripped onto the heat sink 23 and applied thereto.Then, from an opening 27 formed in the earthen wall of the tunnel furnace 21 at a position behind the dispenser 26, the collet 29 which has adsorbed the chip 28 is used to attach the heat sink to the heat sink. A chip 28 is mounted on 23.
また、上記のように滴下した溶融半田２５上にチップ２
８を装着すると、チップ２８の接合面と半田層との間に
空隙を生じ易く、作動時の発熱によって空隙内の空気が
膨張し、チップ２８にクラックが発生する等の問題があ
る。このような問題を解消するために、チップ２８の装
着時にコレット２９を水平方向に微小量往復移動させる
、所謂スクラブを行い、チップ２８の接合面と溶融半田
２５との濡れを良くし、空隙が生じないようにしている
。Also, the chip 2 is placed on top of the molten solder 25 dropped as described above.
8, a gap is likely to be formed between the bonding surface of the chip 28 and the solder layer, and the air in the gap expands due to heat generated during operation, causing problems such as cracks in the chip 28. In order to solve this problem, when the chip 28 is attached, the collet 29 is moved back and forth in the horizontal direction by a small amount, so-called scrubbing, which improves the wetting of the joint surface of the chip 28 with the molten solder 25 and eliminates the voids. I'm trying to prevent it from happening.
発明が解決しようとする課題
しかし、なから、デイスペンサ２６により溶融半田２５
を滴下しているため、その溶融半田２５の滴下量を常に
正確にコントロールするのは困難で、環境条件の変化、
溶融半田の組成や温度の変化による粘度の変化、加圧用
気体圧の変化等によって滴下半田量にばらつきを生じ、
その結果上記のようにスクラブを行ったときに、溶融半
田の一部がチップ２日上に盛り上がり、第５図に示すよ
うに、チップ２８の上面が溶融半田２５で汚染されたり
、第６図に示すように、コレット２９が溶融半田２５で
汚染されたり、穴詰まりを生じたりするという問題があ
った。Problems to be Solved by the Invention However, the dispenser 26 does not allow the melted solder 25 to be removed.
It is difficult to always accurately control the amount of molten solder 25 dripped, and changes in environmental conditions,
Variations in the amount of solder dropped may occur due to changes in viscosity due to changes in the composition of the molten solder, changes in temperature, changes in pressurizing gas pressure, etc.
As a result, when scrubbing as described above, some of the molten solder swells onto the top of the chip 28, causing the top surface of the chip 28 to be contaminated with molten solder 25 as shown in FIG. 5, and as shown in FIG. As shown in FIG. 2, there is a problem that the collet 29 is contaminated with the molten solder 25 and the hole is clogged.
本発明は上記従来の問題点に鑑み、ヒートシンク上に平
坦に接合材を塗布でき、チップ上の接合材による汚染や
コレットに対する接合材の影響を無くすことができるダ
イボンディング装置を提供することを目的とする。In view of the above-mentioned conventional problems, an object of the present invention is to provide a die bonding device that can apply a bonding material evenly on a heat sink and eliminate contamination by the bonding material on the chip and the effect of the bonding material on the collet. shall be.
課題を解決するための手段
本発明のダイボンディング装置は、ヒートシンクの搬送
経路に沿って、ヒートシンク上に接合材を塗布する手段
と接合材を塗布されたヒートシンク上にチップを装着す
る手段とを配設したダイボンディング装置において、接
合材の塗布手段とチップの装着手段との間に、搬送され
るヒートシンク上面との間に所定間隙を設けてプレーナ
を配設したことを特徴とする。Means for Solving the Problems The die bonding apparatus of the present invention includes a means for applying a bonding material onto a heat sink and a means for mounting a chip on the heat sink coated with the bonding material, along the transport path of the heat sink. The die bonding apparatus is characterized in that a planer is disposed between the bonding material applying means and the chip mounting means with a predetermined gap provided between the top surface of the heat sink and the conveyed heat sink.
作 用
本発明によると、ヒートシンク上に塗布された接合材は
、搬送経路に沿ってチップの装着位置に搬送される前に
、プレーナとヒートシンク上面との間の所定間隔に対応
する−様な厚さに規制されてその上面が平坦にされ、こ
の接合材の上にチップを装着することによってチップの
接合面との濡れ性が大きく、空隙が生じ難い状態で装着
され、又スクラブを行ってもチップ上への半田汚染やコ
レットに対する接合材の影響を無くすことができる。According to the present invention, the bonding material applied on the heat sink has a thickness that corresponds to a predetermined distance between the planer and the top surface of the heat sink before being conveyed along the conveyance path to the chip mounting position. By placing the chip on top of this bonding material, the chip has a high wettability with the bonding surface, and is mounted in a state where it is difficult to form voids, and even when scrubbing. It is possible to eliminate solder contamination on the chip and the influence of the bonding material on the collet.
実施例
以下、本発明のダイボンディング装置の一実施例を第１
図〜第３図に基づいて説明する。EXAMPLE Hereinafter, one example of the die bonding apparatus of the present invention will be explained as follows.
This will be explained based on FIGS.
第１図及び第２図において、１はトンネル炉でその底壁
には適当ピッチでヒータ２が内蔵され、底壁上に載置さ
れたヒートシンク３を所定温度に加熱するように構成さ
れている。ヒートシンク３は、例えば銅ブロック等から
成り、その表面にニッケルメッキを施し、さらに好まし
くは半田メツキが施されている。このヒートシンク３を
トンネル炉ｌの底壁に接触した状態で逐次一方向に間歇
的に搬送するため、図示しない適宜搬送手段が設けられ
ている。又、トンネル炉１内を不活性雰囲気ないし還元
性雰囲気にするため、第２図に示すようにＮｚガスとＨ
２ガスの混合ガスの供給通路４が設けられている。In FIGS. 1 and 2, 1 is a tunnel furnace, and heaters 2 are built into the bottom wall of the furnace at appropriate pitches, and are configured to heat a heat sink 3 placed on the bottom wall to a predetermined temperature. . The heat sink 3 is made of, for example, a copper block, the surface of which is plated with nickel, and more preferably plated with solder. In order to intermittently transport the heat sink 3 in one direction while in contact with the bottom wall of the tunnel furnace 1, appropriate transport means (not shown) is provided. In addition, in order to create an inert atmosphere or a reducing atmosphere inside the tunnel furnace 1, Nz gas and H
A supply passage 4 for a mixed gas of two gases is provided.
トンネル炉１の上壁１ａの所定位置に形成した開口部６
の上方には、接合材としての溶融半田５を滴下するデイ
スペンサ７が配置されている。このデイスペンサ７は、
内部に溶融半田５を収容するとともに、その上部空間に
Ｎｚガス等の加圧気体８を供給することによって所定量
の溶融半田５を下方に位置するヒートシンク３の上面に
滴下するように構成されている。又、溶融半田５の収容
部の外周にはヒータ９が設けられている。An opening 6 formed at a predetermined position in the upper wall 1a of the tunnel furnace 1
A dispenser 7 that drips molten solder 5 as a bonding material is arranged above. This dispenser 7 is
It is configured to house molten solder 5 inside and supply pressurized gas 8 such as Nz gas to the upper space so that a predetermined amount of molten solder 5 is dripped onto the upper surface of the heat sink 3 located below. There is. Further, a heater 9 is provided around the outer periphery of the housing portion for the molten solder 5.
デイスペンサ５からヒートシンク３の搬送方向後方の位
置において、トンネル炉１の上壁１ａ内面には、第３図
に詳細に示すように、ステンレス鋼や超硬材等の溶融半
田５に対して濡れ性の悪い板材から成るプレーナ１０が
、位置調整可能にポル）１１にて固定されている。この
プレーナｌＯは搬送方向に向かって傾斜して配設される
とともにその下端縁までの距離Ｈが、ヒートシンク３の
上面との間に０．２１ｍｍ程度の間隙δが形成されるよ
うに設定されている。At a position behind the dispenser 5 in the conveying direction of the heat sink 3, the inner surface of the upper wall 1a of the tunnel furnace 1 is made of stainless steel, cemented carbide, etc. that is wettable to the molten solder 5, as shown in detail in FIG. A planer 10 made of a plate material with poor quality is fixed with a pole 11 so that its position can be adjusted. This planar lO is arranged to be inclined toward the conveyance direction, and the distance H to its lower edge is set so that a gap δ of about 0.21 mm is formed between it and the upper surface of the heat sink 3. There is.
又、このプレーナ１０からヒートシンク３の搬送方向後
方の位置において、トンネル炉ｌの上壁１ａに形成され
た開口部１２から、チップ１３を吸着したコレット１４
にてヒートシンク３上にチップ１３を装着するように構
成されている。Further, at a position rearward from the planer 10 in the transport direction of the heat sink 3, a collet 14 adsorbing the chip 13 is seen from an opening 12 formed in the upper wall 1a of the tunnel furnace l.
The chip 13 is mounted on the heat sink 3 at the same time.
以上の構成において、トンネル炉ｌ内に挿入したヒート
シンク３は、トンネル炉１の底壁に沿って搬送される間
にヒータ２にて所定温度に加熱された後、開口部６の下
方位置で停止し、ここでデイスペンサ７にてその上面に
所定量の溶融半田５が滴下、塗布される。このときの塗
布状態は、単に滴下されるだけであるため、平坦ではな
い、このヒートシンク３が、次にプレーナ１０の下を通
過する際に、塗布された溶融半田５が均一な所定の厚さ
に平坦化される。In the above configuration, the heat sink 3 inserted into the tunnel furnace 1 is heated to a predetermined temperature by the heater 2 while being transported along the bottom wall of the tunnel furnace 1, and then stopped at a position below the opening 6. Here, a predetermined amount of molten solder 5 is dripped and applied onto the upper surface by the dispenser 7. At this time, the applied state is not flat because it is simply dripped. When this heat sink 3 next passes under the planer 10, the applied molten solder 5 has a uniform predetermined thickness. flattened to
その後、ヒートシンク３は開口部１２の下方位置で停止
し、ここでコレット１４にて吸着、保持されたチップ１
３がヒートシンク３上に装着される。この時、溶融半田
５が平坦化されているので、チップ１３の接合面と溶融
半田５の間に空隙が生じ難い。又、その際にコレット１
４をスクラブさせて、チップ１３の接合面と溶融半田５
との間の空隙を完全に無くすようにするのが好ましい。Thereafter, the heat sink 3 stops at a position below the opening 12, where the chip 1 is attracted and held by the collet 14.
3 is mounted on the heat sink 3. At this time, since the molten solder 5 is flattened, it is difficult to form a gap between the bonding surface of the chip 13 and the molten solder 5. Also, at that time, collet 1
4 to rub the bonding surface of the chip 13 and the molten solder 5.
It is preferable to completely eliminate the gap between the two.
このように、過剰な溶融半田５を掻き取り、平坦に形成
した溶融半田５上にチップ１３を装着することにより、
空隙の無い状態でチップ１３を装着でき、かつチップ１
３上が半田で汚染されたり、コレット１４が半田で汚染
されたり、穴詰まりを生じたりすることもない。In this way, by scraping off the excess molten solder 5 and mounting the chip 13 on the molten solder 5 that has been formed flat,
Chip 13 can be mounted without any gaps, and chip 1
3 is not contaminated with solder, the collet 14 is not contaminated with solder, and the hole is not clogged.
尚、上記実施例では接合材として半田を用いた例を示し
たが、その他の接合材を用いる場合も本発明は適用可能
である。又、プレーナ１０として固定設置した板材から
なるものを例示したが、ローラやベルトを用いることも
できる。In the above embodiment, solder is used as the bonding material, but the present invention is also applicable to cases where other bonding materials are used. Furthermore, although the planer 10 is made of a fixedly installed plate, rollers or belts may also be used.
発明の効果
本発明によれば、ヒートシンク上に塗布された接合材は
、チップの装着位置に搬送される前にプレーナとヒート
シンク上面との間の所定間隔に対応する−様な厚さに規
制されてその上面が平坦にされ、この接合材の上にチッ
プが装着されるため、チップの接合面との濡れ性が大き
く、空隙が生じ難い状態で装着され、又スクラブを行っ
てもチップ上への半田汚染やコレットに対する接合材の
影響を無くすことができる等、大なる効果を発揮する。Effects of the Invention According to the present invention, the bonding material applied on the heat sink is regulated to a thickness corresponding to a predetermined distance between the planer and the top surface of the heat sink before being conveyed to the chip mounting position. The top surface of the chip is flattened, and the chip is mounted on top of this bonding material, so it has a high wettability with the bonding surface of the chip, and is mounted in a state where it is difficult to form a gap. It has great effects, such as eliminating solder contamination and the effects of the bonding material on the collet.
第１図〜第３図は本発明のダイボンディング装置の一実
施例を示し、第１図は縦断正面図、第２図は縦断側面図
、第３図はプレーナの詳細図、第４図は従来例のダイボ
ンディング装置の縦断正面図、第５図及び第６図は同チ
ップ装着時の問題点を示す断面図である。
３・・・・・・ヒートシンク、５・・・・・・溶融半田
、７・・・・・・デイスペンサ、１０・・・・・・プレ
ーナ、１３・・・・・・チップ、１４・・・・・・コレ
ット。1 to 3 show an embodiment of the die bonding apparatus of the present invention, in which FIG. 1 is a vertical front view, FIG. 2 is a vertical side view, FIG. 3 is a detailed view of the planer, and FIG. A vertical front view of a conventional die bonding apparatus, and FIGS. 5 and 6 are cross-sectional views showing problems when mounting the same chip. 3... Heat sink, 5... Molten solder, 7... Dispenser, 10... Planer, 13... Chip, 14... ...Colette.
Claims (1)
合材を塗布する手段と接合材を塗布されたヒートシンク
上にチップを装着する手段とを配設したダイボンディン
グ装置において、接合材の塗布手段とチップの装着手段
との間に、搬送されるヒートシンク上面との間に所定間
隙を設けてプレーナを配設したことを特徴とするダイボ
ンディング装置。In a die bonding apparatus, a means for applying a bonding material onto a heat sink and a means for mounting a chip on the heat sink coated with the bonding material are arranged along the conveyance path of the heat sink. A die bonding apparatus characterized in that a planer is disposed with a predetermined gap provided between the mounting means and the upper surface of the heat sink being transported.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18555189A JPH0350746A (en) | 1989-07-18 | 1989-07-18 | Die bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18555189A JPH0350746A (en) | 1989-07-18 | 1989-07-18 | Die bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350746A true JPH0350746A (en) | 1991-03-05 |
Family
ID=16172791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18555189A Pending JPH0350746A (en) | 1989-07-18 | 1989-07-18 | Die bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350746A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188833A (en) * | 1981-05-18 | 1982-11-19 | Hitachi Ltd | Connecting method for material to be connected |
-
1989
- 1989-07-18 JP JP18555189A patent/JPH0350746A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188833A (en) * | 1981-05-18 | 1982-11-19 | Hitachi Ltd | Connecting method for material to be connected |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5898992A (en) | Method of mounting circuit components on a flexible substrate | |
| US6427898B2 (en) | Solder bump forming method and apparatus | |
| US4385083A (en) | Apparatus and method for forming a thin film of coating material on a substrate having a vacuum applied to the edge thereof | |
| US6575352B2 (en) | Apparatus and method for soldering electronic components to printed circuit boards | |
| US20110139855A1 (en) | Residual oxygen measurement and control in wave soldering process | |
| JPH0350746A (en) | Die bonding equipment | |
| JP3319740B2 (en) | Brazing material coating device | |
| JPH0648699B2 (en) | High density integrated circuit support and selective tinning apparatus for conductors of the support | |
| WO2020153366A1 (en) | Bonding device | |
| JP2691685B2 (en) | Method of supplying molten brazing filler metal | |
| JPH0472639A (en) | Die bonding apparatus | |
| JPS60180664A (en) | Soldering method | |
| JPH0648840Y2 (en) | Semiconductor manufacturing equipment | |
| JPS62253778A (en) | Method for cladding noble metal to copper member | |
| JP2001036231A (en) | Solder removing device | |
| JPS6376356A (en) | Automatic device for fixing fin | |
| JPH04122093A (en) | Paste transfer method and transfer jig | |
| CN114760772A (en) | Tin-dispensing and chip-mounting process | |
| JPH10290066A (en) | Part mounting method and equipment | |
| JP2715400B2 (en) | Flux coating device | |
| JPH05345406A (en) | Pasty solder printing | |
| JPH1075047A (en) | Method for forming flat pre-solder surface on wiring board | |
| JPH07307560A (en) | Mounting method of electronic component | |
| JPH04262866A (en) | Method for solder plating face packaging component | |
| JPH0352242A (en) | Junction-metal-film forming and diebonding methods |