JPS6376356A - Automatic device for fixing fin - Google Patents

Abstract

PURPOSE:To uniformly coat the whole adhering surface with an adhesive and to improve wetting properties of the adhesive, by installing an adhesive quantitative plate so that its liquid surface of the adhesive is slanted a little downwards against the direction in which an adhering surface of a radiating fin is slided. CONSTITUTION:A radiating fin 5 or 6 is moved downwards to a position where its bottom surface fully enters an adhesive in an adhesive quantitative plate 15. Then, the fin is moved upwards to a position where the bottom surface comes nearly in contact with the surface of the adhesive 4, and it is slided in the lateral direction so as to wipe the adhesive 4. At that time, inclination of the adhesive quantitative plate 15 enables uniform coating of the adhesive 4 and prevents a lump of the adhesive from being generated on the radiating fin, a part shown in 21. The coated bottom surface is pressure-welded with a chip carrier 2, and the radiating fin 5 is scrubbed right and left so as to be rightly positioned and pressure-adhered. Thus bubbles existing inside the adhesive 4 are drawn outside, so that wetting of properties the adhesive 4 can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an automatic fin attachment device that automatically attaches heat dissipation fins onto a ceramic wiring board or a chip carrier soldered thereto.

[Conventional technology]

FIG. 5 shows an outline of how the radiation fins are attached to the ceramic wiring board and the chip carrier soldered thereto. FIG. 5(a) shows the ceramic wiring board and the chip carrier before the heat dissipation fins are attached, and the chip carrier 2 is connected to the ceramic wiring board 1 with solder 3. On this ceramic wiring board 1 and chip carrier 2,
As shown in FIG. 5(b), the radiation fins 5 and 6 are bonded and attached using adhesive 4, respectively. In this case, two types of radiation fins 5 and 6 are used whose heights are adjusted in advance so that the heights of the upper surfaces of the radiation fins match after installation.

When automatically attaching heat dissipation fins to ceramic wiring boards and chip carriers.

The problem is how to apply the adhesive evenly over the entire adhesive surface of the heat dissipation fin. Conventionally, there are two known methods for applying adhesive to the adhesive surface of heat dissipation fins: the printing method, in which the adhesive is uniformly applied using a printing machine, and the dispenser method, in which the adhesive is dispersed using a dispenser. .

Incidentally, as a known example of automatically mounting chip components on a board, there is, for example, Japanese Patent Application Laid-Open No. 138990/1982.
No consideration is given to installing heat radiation fins.

[Problem that the invention seeks to solve]

In the above-mentioned conventional technology, the printing method can apply adhesive to a constant thickness on the entire surface to be coated with one printing machine if the height is the same and the surface to be coated is flat. If the height of the fins, the shape of the coated surface, etc. differ, a printing machine will be required for each, making the equipment expensive. On the other hand, the dispenser method can apply a fixed amount of adhesive to any location, but if the adhesive area is large, the adhesive will not be distributed evenly around the periphery. A mechanism to move the dispenser in the X and Y directions is required, which also makes the device expensive.

Furthermore, when attaching the heat dissipation fins, the heat dissipation fins are crimped, but in the prior art, voids occur due to air bubbles in the adhesive, resulting in poor wettability.

SUMMARY OF THE INVENTION An object of the present invention is to provide an automatic fin attaching device that can easily and evenly apply an adhesive over the entire adhesive surface of a heat dissipation fin, and also improves the wettability of the adhesive when attaching the heat dissipation fin.

[Means for solving problems]

The automatic fin attaching device of the present invention includes a heat dissipation fin storage such as a pole feeder or a tray that respectively accommodates different types of heat dissipation fins, and a rotatable adhesive metering plate that accommodates a fixed amount of liquid adhesive. A squeegee that is attached to the adhesive metering plate and spreads the adhesive uniformly, an adhesive supply device that supplies adhesive to the adhesive metering plate, a squeegee that is attached to the adhesive metering plate, and a squeegee that supplies the adhesive to the adhesive metering plate; After applying the adhesive, slide the adhesive surface on the adhesive liquid level in the adhesive metering plate.

It is equipped with an operation unit (robot) that presses onto the ceramic wiring board and chip carrier, and an adhesive metering plate.
The heat dissipation fin is installed so that the adhesive liquid level is slightly tilted downward with respect to the direction in which the adhesive surface slides, and the operating unit also controls the heat dissipation fin when it is pressed onto a ceramic wiring board or chip carrier. It is structured to scrub left and right.

[For production]

By installing the adhesive metering plate so that the adhesive liquid level is tilted slightly downward in the direction in which the adhesive surface of the heat dissipation fin slides, the adhesive will cut more easily. It becomes possible to apply adhesive evenly,
Additionally, it is possible to prevent the adhesive from climbing up in the sliding direction. Furthermore, when the heat dissipation fin is pressure-bonded to a ceramic wiring board or the like, by scrubbing from side to side, air bubbles existing inside the adhesive are removed, and the wettability of the adhesive is improved.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a schematic configuration of an embodiment of an automatic fin attaching apparatus of the present invention. In FIG. 1, reference numeral 10 denotes a jig for transporting a substrate, 11 a substrate loader in which a substrate before the heat radiation fins are attached is stored, and 12 a substrate unloader in which the substrate after the heat radiation fins are attached is stored. 13 is a pole feeder that stores and supplies heat dissipation fins for chip carriers;
Reference numeral 14 denotes a tray that stores and supplies heat dissipating fins for substrates.

15 is a rotatable adhesive metering plate containing a fixed amount of liquid adhesive, and 16 is an adhesive supply device that supplies adhesive to the adhesive metering plate 15. In addition, the adhesive metering plate 1 for the radiation fins stored in the pole feeder 13 and the tray 14
5 and the substrate 1 is performed by a well-known industrial robot, but this robot is omitted in FIG.

To explain the operation shown in FIG. 1, first, the substrate 1 of the substrate loader 11 is placed on the transport jig 10 and transported (■), and positioned at the radiation fin installation position. A chip carrier 2 is soldered to this substrate 1 as shown in FIG. 5(a). Next, heat radiation fins for the chip carrier are supplied from the ball feeder 13, the heat radiation fins are moved to the adhesive metering plate 14 by the robot (■), and the adhesive is applied with the adhesive metering plate 14 (■). ) and further moves to the top of board 1 (■).

The substrate is fixed to the top surface of the chip carrier. Below, ■～■
Repeat the above steps to attach the required number of chip carrier heat dissipation fins to the top surface of the chip carrier on the substrate 1. Next, bring the arm of the robot to the tray 14 (■), take out the heat radiation fin for the board from the tray 14, move to the adhesive metering plate 14 (■), and apply the adhesive with the adhesive metering plate 14. After that (■), it moves further onto the substrate (■) and is fixed to the upper surface of the substrate. Thereafter, by repeating the operations ① to ② and attaching the necessary number of substrate heat dissipation fins to the upper surface of the substrate, the result will be as shown in FIG. 5(b). In FIG. 5(b),
5 is a heat dissipation fin for the chip carrier, and 6 is a heat dissipation fin for the substrate. In this way, when the heat radiation fins have been attached to all the necessary locations on the substrate 1, the substrate is stored in the substrate unloader 12 (■).

FIG. 2 shows the detailed configuration of the adhesive metering plate 15. As shown in FIG. 2, the adhesive metering plate 15 is a disk-shaped container, and receives liquid adhesive from an adhesive supply device 16 through a nozzle 17. A squeegee 18 whose height is adjustable is attached to the adhesive metering plate 15, and the bottom surface of the squeegee 18 is made flat. The adhesive metering plate 1
5 is rotated by a motor 19, and at this time, the adhesive is uniformly spread within the metering plate 15 by the squeegee 18. Furthermore, the adhesive metering plate 15 is tilted to 0 by the plate 20.
The structure is tilted by a certain degree.

FIG. 3 shows the operation of the radiation fin 5 or 6 when adhesive is applied to the radiation fin 5 or 6 using the adhesive metering plate 15. First, the heat dissipating fin 5 or 6 is lowered to a position where its bottom surface is fully contained in the adhesive of the adhesive metering plate 15 (■). Next, the heat radiation fin 5 or 6 is raised to a position where its bottom surface is almost in contact with the surface of the adhesive 4 (
(■), slide the adhesive horizontally at that height and cut the adhesive 4 (■). At this time, since the adhesive metering plate 15 is tilted as shown in the figure, the adhesive 4 is evenly applied to the bottom surface (adhesive surface) of the radiation fin 5 or 6, as shown by 21 of the radiation fin. Prevents adhesive from forming in the area. After sliding the heat dissipation fins 5 or 6 laterally and applying the adhesive, raise the heat dissipation fins (
■), carry it to the location where the board is located. Between this ■ and ■,
The rotation of the adhesive metering plate 11 is temporarily stopped, and then the rotation of the adhesive metering plate 11 is restarted to make the adhesive 4 in the adhesive metering plate 15 uniform, in preparation for the next application.

FIG. 4 shows the operation of the heat dissipating fin 5 for a chip carrier when the heat dissipating fin 5 is bonded onto the chip carrier 2. The same applies when bonding. That is, after the heat dissipation fin 5 is lowered and the bottom surface coated with the adhesive 4 is pressed against the chip carrier 2, the heat dissipation fin 5 is scrubbed from side to side (■).

(2) Then, the heat dissipation fins 5 are properly positioned and crimped (2). By scrubbing the heat dissipating fins during bonding, air bubbles existing inside the adhesive 4 come out, and the wetting properties of the adhesive 4 are improved.

〔Effect of the invention〕

As is clear from the above description, according to the present invention.

Adhesive can be applied evenly to the entire adhesive surface of heat dissipation fins of different sizes and shapes, and the adhesive has good wettability, making it possible to create highly reliable products.

[Brief explanation of the drawing]

Fig. 1 is a schematic configuration diagram of an embodiment of the automatic fin attachment device of the present invention, Fig. 2 is a detailed configuration diagram of the adhesive metering plate portion in Fig. 1, and Fig. 3 is an operation of applying adhesive to a heat dissipation fin. FIG. 4 is a diagram illustrating the operation of bonding the heat dissipation fin to the chip carrier. FIG. 5 is a diagram showing an example of the ceramic wiring board and the chip carrier before and after the heat dissipation fins are attached. DESCRIPTION OF SYMBOLS 1...Ceramic wiring board, 2...Chip carrier, 4...Adhesive, 5, 6...Radiating fin. 15... Adhesive quantitative plate, 20... Tilt plate. Figure 1 Figure 2 Figure 3 Figure 4

Claims (2)

[Claims] (1) In a device for attaching heat dissipation fins onto a ceramic wiring board or a chip carrier mounted on the wiring board,
A radiation fin storage housing storing radiation fins, a rotatable adhesive metering plate storing a fixed amount of liquid adhesive, a squeegee attached to the adhesive metering plate to uniformly spread the adhesive, and the adhesive. An adhesive supply device that supplies adhesive to the adhesive metering plate, and a radiation fin that is carried out from the radiation fin storage, and the adhesive surface of the radiation fin is slid on the adhesive liquid surface in the adhesive metering plate to apply the adhesive. and an operation unit for applying the adhesive onto the ceramic wiring board or the chip carrier, and the adhesive metering plate has an adhesive liquid level slightly tilted downward with respect to the direction in which the adhesive surface of the heat dissipation fin slides. An automatic fin attaching device characterized by being installed as follows. (2) The operation unit scrubs the heat dissipation fin from side to side when the adhesive surface of the heat dissipation fin is pressed onto the ceramic wiring board or the chip carrier. Automatic finning device.