JPH0267675U - - Google Patents
Info
- Publication number
- JPH0267675U JPH0267675U JP14597588U JP14597588U JPH0267675U JP H0267675 U JPH0267675 U JP H0267675U JP 14597588 U JP14597588 U JP 14597588U JP 14597588 U JP14597588 U JP 14597588U JP H0267675 U JPH0267675 U JP H0267675U
- Authority
- JP
- Japan
- Prior art keywords
- view
- inner tank
- terminal
- solder liquid
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
Landscapes
- Molten Solder (AREA)
Description
第1A図は本考案の第1の原理構成を示す斜視
図、第1B図は本考案の第1の原理構成を示す平
面図、第1C図は第1B図のB―B断面図、第2
A図は本考案の第2の原理構成を示す斜視図、第
2B図は本考案の第2の原理構成を示す平面図、
第2C図は第2B図のC―C断面図、第3図は本
考案の第1の原理にもとづく実施例を示す側面図
、第4図は本考案の第2の原理にもとづく実施例
を示す側面図、第5A図は本考案の第1の原理に
もとづく実施例の具体例を示す平面図、第5B図
は第5A図のD―D断面図、第5C図は第5A図
のE―E断面図、第6A図はSIP用チヤツクを
拡大して示す正面図、第6B図はSIP用チヤツ
クを拡大して示す側面図、第7A図はDIP用チ
ヤツクを拡大して示す正面図、第7B図はDIP
用チヤツクを拡大して示す側面図、第8図は従来
の端子半田付装置を部分断面で示す正面図、第9
図はSIP用端子の構成を示す斜視図、第10図
は半田の酸化物の除去手段の一例を示す斜視図で
ある。
1…半田液、2…外槽、3…内槽、4…半田液
面設定部、5…切欠溝、6…端子、7…基板、3
3…チヤツク、34…チヤツク支持部。
FIG. 1A is a perspective view showing the first principle configuration of the present invention, FIG. 1B is a plan view showing the first principle configuration of the present invention, FIG. 1C is a BB cross-sectional view of FIG.
Figure A is a perspective view showing the second principle configuration of the present invention, Figure 2B is a plan view showing the second principle configuration of the present invention,
Fig. 2C is a sectional view taken along the line CC in Fig. 2B, Fig. 3 is a side view showing an embodiment based on the first principle of the present invention, and Fig. 4 is a side view showing an embodiment based on the second principle of the present invention. 5A is a plan view showing a specific example of an embodiment based on the first principle of the present invention, FIG. 5B is a sectional view taken along line DD in FIG. 5A, and FIG. 5C is a sectional view taken along line E in FIG. 5A. -E sectional view, Figure 6A is an enlarged front view of the SIP chuck, Figure 6B is an enlarged side view of the SIP chuck, and Figure 7A is an enlarged front view of the DIP chuck. Figure 7B shows DIP
FIG. 8 is a side view showing an enlarged view of a conventional terminal soldering device; FIG. 8 is a front view partially showing a conventional terminal soldering device;
The figure is a perspective view showing the structure of the SIP terminal, and FIG. 10 is a perspective view showing an example of means for removing solder oxide. 1... Solder liquid, 2... Outer tank, 3... Inner tank, 4... Solder liquid level setting section, 5... Notch groove, 6... Terminal, 7... Board, 3
3...chuck, 34...chuck support section.
Claims (1)
ための半田液1を蓄える外槽2と、 該外槽2の内側に、前記端子固定部または前記
半田液1中に向かつて上下動可能に設置される升
形の内槽3とを備え、 前記内槽3の周縁部上面の少なくとも一辺に半
田液面設定部4を形成することを特徴とする端子
半田付装置。 2 請求項1記載の前記内槽3の周縁部上面の一
部に、表面近傍の半田液1を流出せしめる切欠溝
5を設けることを特徴とする端子半田付装置。[Claims for Utility Model Registration] 1. An outer tank 2 storing a solder liquid 1 for soldering a terminal 6 to a terminal fixing part of a board 7; 1, and a square-shaped inner tank 3 which is installed so as to be movable up and down toward the inner tank 1, and a solder liquid level setting part 4 is formed on at least one side of the upper surface of the peripheral edge of the inner tank 3. Device. 2. A terminal soldering device characterized in that a notched groove 5 is provided in a part of the upper surface of the peripheral edge of the inner tank 3 according to claim 1, for allowing the solder liquid 1 near the surface to flow out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14597588U JPH0267675U (en) | 1988-11-10 | 1988-11-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14597588U JPH0267675U (en) | 1988-11-10 | 1988-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0267675U true JPH0267675U (en) | 1990-05-22 |
Family
ID=31415041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14597588U Pending JPH0267675U (en) | 1988-11-10 | 1988-11-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0267675U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3616818A1 (en) * | 2018-08-28 | 2020-03-04 | Schleuniger Holding AG | Device and method for tinning conductor ends |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5645737U (en) * | 1979-09-17 | 1981-04-24 | ||
JPS591462B2 (en) * | 1977-01-31 | 1984-01-12 | ストオウフア−・ケミカル・カンパニ− | Control of negative effects from herbicides and fish feed |
-
1988
- 1988-11-10 JP JP14597588U patent/JPH0267675U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS591462B2 (en) * | 1977-01-31 | 1984-01-12 | ストオウフア−・ケミカル・カンパニ− | Control of negative effects from herbicides and fish feed |
JPS5645737U (en) * | 1979-09-17 | 1981-04-24 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3616818A1 (en) * | 2018-08-28 | 2020-03-04 | Schleuniger Holding AG | Device and method for tinning conductor ends |