JPS61131875U - - Google Patents
Info
- Publication number
- JPS61131875U JPS61131875U JP1578785U JP1578785U JPS61131875U JP S61131875 U JPS61131875 U JP S61131875U JP 1578785 U JP1578785 U JP 1578785U JP 1578785 U JP1578785 U JP 1578785U JP S61131875 U JPS61131875 U JP S61131875U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- support
- soldering
- board support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 210000000078 claw Anatomy 0.000 claims description 3
- 230000004907 flux Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図は本考案の実施例に係るはんだ付用プリ
ント基板支持装置の概略的な斜視図、第２図ａは
本考案に係るプリント基板支持部の拡大正面図、
第２図ｂは同じく本考案に係るプリント基板支持
部の拡大側面図、第３図は従来のはんだ付用プリ
ント基板支持装置の概略的な斜視図、第４図はは
んだ付け処理工程を示した図、第５図ａは従来の
プリント基板支持装置の側面図、第５図ｂは従来
のプリント基板支持部の正面図、第５図ｃは従来
のプリント基板支持部の側面図、第５図ｄは従来
のプリント基板支持部におけるフラツクスの付着
状態を示した図である。
２，６……支持プレート、３，３′……支持爪
、４……プリント基板、５……ベース、７……電
子部品、１０……フラツクス。
FIG. 1 is a schematic perspective view of a soldering printed circuit board support device according to an embodiment of the present invention, FIG. 2 a is an enlarged front view of a printed circuit board support unit according to the present invention,
FIG. 2b is an enlarged side view of a printed circuit board support according to the present invention, FIG. 3 is a schematic perspective view of a conventional soldering printed circuit board support device, and FIG. 4 shows a soldering process. 5a is a side view of a conventional printed circuit board support device, FIG. 5b is a front view of a conventional printed circuit board support section, and FIG. 5c is a side view of a conventional printed circuit board support section. d is a diagram showing the state of flux adhesion on a conventional printed circuit board support section. 2, 6... Support plate, 3, 3'... Support claw, 4... Printed circuit board, 5... Base, 7... Electronic component, 10... Flux.
Claims (1)
けする際に該プリント基板を支持するのに用いる
はんだ付用プリント基板支持装置において、プリ
ント基板支持部に複数の支持爪を上下二列に一定
の間隔をおきかつ上下方向に整列しないように互
い違いに配置し、これらの支持爪の間に前記プリ
ント基板の側縁を挾み込んで支持することを特徴
とするはんだ付用プリント基板支持装置。 In a soldering printed circuit board support device used to support a printed circuit board when electronic components inserted onto the printed circuit board are soldered, a plurality of support claws are arranged at regular intervals in two rows on the printed circuit board support part. A printed circuit board support device for soldering, characterized in that the printed circuit board is supported by sandwiching the side edge of the printed circuit board between the supporting claws, which are arranged alternately so as not to be aligned in the vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1578785U JPS61131875U (en) | 1985-02-06 | 1985-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1578785U JPS61131875U (en) | 1985-02-06 | 1985-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131875U true JPS61131875U (en) | 1986-08-18 |
Family
ID=30501948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1578785U Pending JPS61131875U (en) | 1985-02-06 | 1985-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131875U (en) |
-
1985
- 1985-02-06 JP JP1578785U patent/JPS61131875U/ja active Pending
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