JPS5844899U - Shield plate mounting structure - Google Patents
Shield plate mounting structureInfo
- Publication number
- JPS5844899U JPS5844899U JP13928581U JP13928581U JPS5844899U JP S5844899 U JPS5844899 U JP S5844899U JP 13928581 U JP13928581 U JP 13928581U JP 13928581 U JP13928581 U JP 13928581U JP S5844899 U JPS5844899 U JP S5844899U
- Authority
- JP
- Japan
- Prior art keywords
- piece
- shield
- shield plate
- mounting structure
- plate mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のシールド板の斜視図、第２図は本考案に
係るシールド板の斜視図、第３図は第２図のシールド板
を用いた高周波配線体の分解斜視図、及び第４図は第３
図の配線体の要部拡大斜視図である。
１０・・・・・・シールド板、１１・・・・・・シート
材、１２・・・・・・舌片、°１３・・・・・・支持片
、１４・・・・・・折曲片、２０・・・・・・配線体、
２１・・・・・・プリント板、３ｏ・・・・・・シール
ドケース、３２・・・・・・側板、４０・・・・・・半
田。FIG. 1 is a perspective view of a conventional shield plate, FIG. 2 is a perspective view of a shield plate according to the present invention, FIG. 3 is an exploded perspective view of a high frequency wiring body using the shield plate of FIG. The figure is the third
FIG. 2 is an enlarged perspective view of a main part of the wiring body shown in the figure. 10... Shield plate, 11... Sheet material, 12... Tongue piece, °13... Support piece, 14... Bending Piece, 20...Wiring body,
21... Printed board, 3o... Shield case, 32... Side plate, 40... Solder.
Claims (1)
に当接して配設するシールド板を半田により電気機械的
に相互に固着した高周波配線体において、前記シールド
板はその下辺に前記プリント基板の表面に当接する支持
片と゛裏面で半田固着される舌片を、またその主通に前
記シールドケースの側板内面に略直交する折曲片を具備
し、これら支持片、舌片及び折曲片を各辺側からの切込
み゛及び切込み部分の折曲により形成したことを特徴と
するシールド板取付構体。In a high frequency wiring body in which shield plates are arranged upright on a printed circuit board and in contact with a side plate of a shield case, and are electromechanically fixed to each other by soldering, the lower side of the shield plate is in contact with the surface of the printed circuit board. The supporting piece, the tongue piece which is fixed by soldering on the back side, and the bending piece which is substantially perpendicular to the inner surface of the side plate of the shield case in its main passage, and the support piece, the tongue piece and the bending piece are attached from each side. A shield plate mounting structure characterized in that it is formed by notches and bending of the notches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13928581U JPS5844899U (en) | 1981-09-18 | 1981-09-18 | Shield plate mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13928581U JPS5844899U (en) | 1981-09-18 | 1981-09-18 | Shield plate mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5844899U true JPS5844899U (en) | 1983-03-25 |
Family
ID=29932482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13928581U Pending JPS5844899U (en) | 1981-09-18 | 1981-09-18 | Shield plate mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5844899U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6149495U (en) * | 1984-09-04 | 1986-04-03 | ||
| JP2017195307A (en) * | 2016-04-21 | 2017-10-26 | 株式会社東海理化電機製作所 | Substrate unit |
| WO2022153833A1 (en) * | 2021-01-15 | 2022-07-21 | 株式会社村田製作所 | Module |
-
1981
- 1981-09-18 JP JP13928581U patent/JPS5844899U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6149495U (en) * | 1984-09-04 | 1986-04-03 | ||
| JP2017195307A (en) * | 2016-04-21 | 2017-10-26 | 株式会社東海理化電機製作所 | Substrate unit |
| WO2022153833A1 (en) * | 2021-01-15 | 2022-07-21 | 株式会社村田製作所 | Module |
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