JPS6038661U - Jet soldering device - Google Patents
Jet soldering deviceInfo
- Publication number
- JPS6038661U JPS6038661U JP13212983U JP13212983U JPS6038661U JP S6038661 U JPS6038661 U JP S6038661U JP 13212983 U JP13212983 U JP 13212983U JP 13212983 U JP13212983 U JP 13212983U JP S6038661 U JPS6038661 U JP S6038661U
- Authority
- JP
- Japan
- Prior art keywords
- spout
- solder
- solder tank
- soldering device
- jet soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は噴流式半田付装置の従来例を示す断面図、第2
図は本考案の実施例を示す断面図、第3図は本考案の他
の実施例を示す断面図、第4図は本考案の他の実施例を
示す斜視図である。 □主要部分の符号の説明、
1・・・・・・半田槽、2・・・・・・噴出口、3・・
・・・・ダクト部材、4・・・・・・溶融半田、5・・
・・・・ポンプ、6・・・・・・ガイド部材、7・・、
・・・・酸化防止剤、8・・・・・・壁部材。Figure 1 is a sectional view showing a conventional example of a jet soldering device;
3 is a sectional view showing another embodiment of the invention, and FIG. 4 is a perspective view showing another embodiment of the invention. □Explanation of symbols of main parts,
1... Solder tank, 2... Spout, 3...
...Duct member, 4...Melted solder, 5...
...Pump, 6...Guide member, 7...
...Antioxidant, 8...Wall member.
Claims (1)
クト部材と、前記半田槽内の溶融半田を前記噴出口を経
て噴出せしめるポンプと、前記噴出口から噴出した溶融
半田を半田槽内へ導くべ(前記噴出口近傍に設けられた
ガイド部材とを含み、前記ガイド部材が前記噴出口から
斜め下方に垂下しかつその先端部が前記半田槽内に位置
して該半田槽側壁面に向って伸長していることを特徴と
する噴流式半田付装置。a duct member extending upward from inside the solder tank and having a spout at its tip; a pump for spouting the molten solder in the solder tank through the spout; and a pump for spouting the molten solder from the spout into the solder tank. (including a guide member provided in the vicinity of the spout, the guide member hanging diagonally downward from the spout, and the tip thereof being located in the solder tank and touching the side wall surface of the solder tank. A jet soldering device characterized by extending in the opposite direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13212983U JPS6038661U (en) | 1983-08-25 | 1983-08-25 | Jet soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13212983U JPS6038661U (en) | 1983-08-25 | 1983-08-25 | Jet soldering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6038661U true JPS6038661U (en) | 1985-03-18 |
Family
ID=30298488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13212983U Pending JPS6038661U (en) | 1983-08-25 | 1983-08-25 | Jet soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6038661U (en) |
-
1983
- 1983-08-25 JP JP13212983U patent/JPS6038661U/en active Pending
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