JPS6094369U - soldering equipment - Google Patents
soldering equipmentInfo
- Publication number
- JPS6094369U JPS6094369U JP18369083U JP18369083U JPS6094369U JP S6094369 U JPS6094369 U JP S6094369U JP 18369083 U JP18369083 U JP 18369083U JP 18369083 U JP18369083 U JP 18369083U JP S6094369 U JPS6094369 U JP S6094369U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- nozzle
- sub
- flow rate
- main nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図〜第３図は従来の半田付は装置を示すも −め
で、第１図はその断面図、第２図は主噴き口付近、第３
図は副噴き口付近の半田付は時の拡大断面、第４図は本
考案の一実施例の断面図、第５図は他の実施例の要部の
斜視図、第６図は他の実施例の断面図で、各図中矢印は
半田の流れを示す。
１１・・・半田槽、１４・・・主噴き口、１５・・・副
噴き口、１６・・・噴出口体、１７・・・隔壁、２０・
・・流量調整ユニット。Figures 1 to 3 show conventional soldering equipment, with Figure 1 being a cross-sectional view, Figure 2 showing the vicinity of the main nozzle,
The figure shows an enlarged cross-section of soldering near the sub-nozzle, Figure 4 is a cross-sectional view of one embodiment of the present invention, Figure 5 is a perspective view of the main parts of another embodiment, and Figure 6 is a cross-sectional view of another embodiment. In the cross-sectional views of the embodiment, arrows in each figure indicate the flow of solder. DESCRIPTION OF SYMBOLS 11... Solder tank, 14... Main nozzle, 15... Sub-nozzle, 16... Spout body, 17... Partition wall, 20...
...Flow rate adjustment unit.
Claims (1)
まれ、半田槽の半田表面より高い位置で・噴流して基板
に電気部品を半田付する副噴き口と、該副噴き口と隣接
し、且つ副噴き口との間に空隙を形成することなく設置
され、基板に付着した余分な半田を流し落す主噴き口と
、該主噴き口に至る半田経路内に、半田の流量を調節し
゛て主噴き口の半田面の高さを調節する流量調整ユニッ
トとを設けたことを特徴とする半田付は装置。The solder in the solder bath, which is melted and maintained at a constant temperature, is fed into a sub-nozzle at a position higher than the solder surface of the solder bath to solder electrical components to the board, and a sub-nozzle adjacent to the sub-nozzle. The flow rate of solder is adjusted between the main nozzle, which is installed without forming a gap between it and the sub-nozzle, and which washes away excess solder adhering to the substrate, and the solder path leading to the main nozzle. A soldering device characterized by being equipped with a flow rate adjustment unit that adjusts the height of the solder surface of the main nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18369083U JPS6094369U (en) | 1983-11-30 | 1983-11-30 | soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18369083U JPS6094369U (en) | 1983-11-30 | 1983-11-30 | soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6094369U true JPS6094369U (en) | 1985-06-27 |
Family
ID=30397490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18369083U Pending JPS6094369U (en) | 1983-11-30 | 1983-11-30 | soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6094369U (en) |
-
1983
- 1983-11-30 JP JP18369083U patent/JPS6094369U/en active Pending
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