JPS59173325U - Lead wire attachment structure to electronic components - Google Patents
Lead wire attachment structure to electronic componentsInfo
- Publication number
- JPS59173325U JPS59173325U JP6711783U JP6711783U JPS59173325U JP S59173325 U JPS59173325 U JP S59173325U JP 6711783 U JP6711783 U JP 6711783U JP 6711783 U JP6711783 U JP 6711783U JP S59173325 U JPS59173325 U JP S59173325U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electronic components
- attachment structure
- wire attachment
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のリード線取付構造の縦断面図、第２図及
び第３図は他の従来のリード線取付構造を示すもので、
第２図はその縦断面図、第３図はリード線の正面図、第
４図及び第５図は本考案のリード線取付構造を示し、第
４図はその縦断面図、 ゛第５図はリード線の平面図
、第６図は剥離試験要領の説明図である。
１５・・・リード線取付構造、１６・・・リード線、１
７・・・先端部、１８・・・偏平部、１９・・・空隙、
２０・・・半田等接着材。Fig. 1 is a vertical cross-sectional view of a conventional lead wire mounting structure, and Figs. 2 and 3 show other conventional lead wire mounting structures.
Fig. 2 is a longitudinal sectional view thereof, Fig. 3 is a front view of the lead wire, Figs. 4 and 5 show the lead wire mounting structure of the present invention, Fig. 4 is a longitudinal sectional view thereof, and Fig. 5. 6 is a plan view of the lead wire, and FIG. 6 is an explanatory diagram of the peel test procedure. 15... Lead wire mounting structure, 16... Lead wire, 1
7...Tip part, 18...Flat part, 19...Gap,
20...Adhesive material such as solder.
Claims (1)
れ、該リード線を電子部品取付面上ｌ；、上記平坦部が
取付面上から外方に跨がるように載置し、平坦部下面と
上記取付面との間に空隙を形成せしめ、半田等接着材は
上記先端部及び平坦部の一部を覆い、かつ上記空隙に充
填されることを特徴とする電子部品へのリード線取付構
造。The lead wire is formed with a flat part of a required length except for the tip part, and the lead wire is placed on the electronic component mounting surface so that the flat part extends outward from the mounting surface, A lead for an electronic component, characterized in that a gap is formed between the flat lower surface and the mounting surface, and an adhesive such as solder covers a part of the tip and the flat part, and fills the gap. Line mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6711783U JPS59173325U (en) | 1983-05-04 | 1983-05-04 | Lead wire attachment structure to electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6711783U JPS59173325U (en) | 1983-05-04 | 1983-05-04 | Lead wire attachment structure to electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59173325U true JPS59173325U (en) | 1984-11-19 |
| JPS6314448Y2 JPS6314448Y2 (en) | 1988-04-22 |
Family
ID=30197319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6711783U Granted JPS59173325U (en) | 1983-05-04 | 1983-05-04 | Lead wire attachment structure to electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59173325U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020235583A1 (en) * | 2019-05-22 | 2020-11-26 | Koa株式会社 | Resistor |
| JP2022087294A (en) * | 2017-07-20 | 2022-06-09 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフト | Electrical component with solder joint |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5922971B2 (en) * | 2012-04-02 | 2016-05-24 | 株式会社昭和テックス | Rail bond |
-
1983
- 1983-05-04 JP JP6711783U patent/JPS59173325U/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022087294A (en) * | 2017-07-20 | 2022-06-09 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフト | Electrical component with solder joint |
| WO2020235583A1 (en) * | 2019-05-22 | 2020-11-26 | Koa株式会社 | Resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6314448Y2 (en) | 1988-04-22 |
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