JPS5818352U - Bonding wedge for thermocompression - Google Patents

Bonding wedge for thermocompression

Info

Publication number
JPS5818352U
JPS5818352U JP1981111788U JP11178881U JPS5818352U JP S5818352 U JPS5818352 U JP S5818352U JP 1981111788 U JP1981111788 U JP 1981111788U JP 11178881 U JP11178881 U JP 11178881U JP S5818352 U JPS5818352 U JP S5818352U
Authority
JP
Japan
Prior art keywords
thermocompression
wedge
bonding
bonding wedge
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981111788U
Other languages
Japanese (ja)
Inventor
斉藤　義一
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1981111788U priority Critical patent/JPS5818352U/en
Publication of JPS5818352U publication Critical patent/JPS5818352U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は熱圧着ボンディング法を説明するモデル図、第
２図と第３図は本考案の一実施例であるボンディングウ
ェッジにより形成された基板電極部の断面図と平面図で
ある。 図中、１はＨＹＢ、ＩＣ基板、３はリード（線）、４は
ボンディングウェッジ、７は４の凸部、８は凸部７の凹
痕及び９は１のバット電極部である。FIG. 1 is a model diagram for explaining the thermocompression bonding method, and FIGS. 2 and 3 are a sectional view and a plan view of a substrate electrode portion formed by a bonding wedge that is an embodiment of the present invention. In the figure, 1 is a HYB, an IC board, 3 is a lead (wire), 4 is a bonding wedge, 7 is a convex part of 4, 8 is a concave trace of the convex part 7, and 9 is a butt electrode part of 1.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＨＹＢ−ＩＣ基板等の電極へ外部リードを熱圧着法によ
り接続するボンディングウェッジにおいて、ウェッジ端
に凸部が設けられ接続のリードに凹痕を形成して前記Ｉ
Ｃに対するテストプローブの位置決めを可能としたこと
を特徴とする熱圧着用ボンディングウェッジ。In a bonding wedge that connects an external lead to an electrode of a HYB-IC board or the like by thermocompression bonding, a convex portion is provided at the edge of the wedge and a concave mark is formed on the connection lead to
A bonding wedge for thermocompression, characterized in that it enables positioning of a test probe with respect to C.
JP1981111788U 1981-07-28 1981-07-28 Bonding wedge for thermocompression Pending JPS5818352U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981111788U JPS5818352U (en) 1981-07-28 1981-07-28 Bonding wedge for thermocompression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981111788U JPS5818352U (en) 1981-07-28 1981-07-28 Bonding wedge for thermocompression

Publications (1)

Publication Number Publication Date
JPS5818352U true JPS5818352U (en) 1983-02-04

Family

ID=29906133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981111788U Pending JPS5818352U (en) 1981-07-28 1981-07-28 Bonding wedge for thermocompression

Country Status (1)

Country Link
JP (1) JPS5818352U (en)

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