JPS5895653U - lead frame - Google Patents

lead frame

Info

Publication number
JPS5895653U
JPS5895653U JP19158381U JP19158381U JPS5895653U JP S5895653 U JPS5895653 U JP S5895653U JP 19158381 U JP19158381 U JP 19158381U JP 19158381 U JP19158381 U JP 19158381U JP S5895653 U JPS5895653 U JP S5895653U
Authority
JP
Japan
Prior art keywords
lead frame
conductive adhesive
small hole
soldering
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19158381U
Other languages
Japanese (ja)
Inventor
富長 英樹
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP19158381U priority Critical patent/JPS5895653U/en
Publication of JPS5895653U publication Critical patent/JPS5895653U/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のリードフレームの平面図、第2図は従来
のリードフレームと基板との接続を示す説明図、第3図
は本考案の実施例によるリードフレームの平面図、第4
図は本考案のリードフレームと基板との接続を示す説明
図を示す。 図において、1,4はリードフレーム、2は基板、3.
6は導賀パターン、5は小穴を示す。
FIG. 1 is a plan view of a conventional lead frame, FIG. 2 is an explanatory diagram showing the connection between a conventional lead frame and a substrate, FIG. 3 is a plan view of a lead frame according to an embodiment of the present invention, and FIG.
The figure shows an explanatory diagram showing the connection between the lead frame and the substrate of the present invention. In the figure, 1 and 4 are lead frames, 2 is a substrate, and 3.
6 indicates a guiding pattern, and 5 indicates a small hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント板等に半田付又は導電性接着剤で接続されるリ
ードが連続してフレーム状に形成されているリードフレ
ームにおいて、該リードフレームの接続端子部の略中夫
に半日または導電性接着剤が流入し得る小穴を設けた事
を特徴とするリードフレーム。
In a lead frame in which leads are connected to a printed board or the like by soldering or conductive adhesive in a continuous frame shape, the conductive adhesive is applied to approximately the center of the connecting terminal portion of the lead frame. A lead frame characterized by having a small hole through which water can flow.
JP19158381U 1981-12-22 1981-12-22 lead frame Pending JPS5895653U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19158381U JPS5895653U (en) 1981-12-22 1981-12-22 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19158381U JPS5895653U (en) 1981-12-22 1981-12-22 lead frame

Publications (1)

Publication Number Publication Date
JPS5895653U true JPS5895653U (en) 1983-06-29

Family

ID=30105035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19158381U Pending JPS5895653U (en) 1981-12-22 1981-12-22 lead frame

Country Status (1)

Country Link
JP (1) JPS5895653U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831307A (en) * 1971-08-29 1973-04-24
JPS56142659A (en) * 1980-04-07 1981-11-07 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831307A (en) * 1971-08-29 1973-04-24
JPS56142659A (en) * 1980-04-07 1981-11-07 Nec Corp Semiconductor device

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